Rubric: Proceedings - ETG Reports

ETG ; ECPE

CIPS 2008 (ETG-FB 111)

5th International Conference on Integrated Power Electronics Systems, Proceedings, March, 11-13, 2008 Nuremberg/Germany

ETG-Fachbericht Band 111

2008, 410 pages, 21 x 29,7 cm, paperback
ISBN 978-3-8007-3089-6

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198.00 €

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Conference Topics:
1. Power Electronics Systems
Device and System Packaging, Assembly Concepts and System Integration
Mechatronics – Integration of Power Electronics and Actuators
Thermal Management
Passive Integration Concepts
Embedded Power Systems
Electromagnetic Interference
Advanced Filter Designs
Technologies for High Temperature Applications
New Materials and Components for Hybrid Integration
Sensor and Driver Developments
Design for Reliability – Virtual Qualification
Design Methods and Tools
Life Cycle Costs (LCC) – Cost Analysis, Maintenance, Repair, Recycling, System partitioning
2. High and Medium Power Modules
Advanced Module Concepts
System Partitioning
3. Monolithic Power Electronic System Integration
Advanced Monolithic Power Electronic Systems
Technologies for “Systems-on-Chip”
SOI-Technologies
Chip Interfacing Technologies (Bonding)

This conference proceeding contains the following papers, purchasable as PDF download with payment via credit card:


1	Robustness Validation – An Improved Qualification Method for Semiconductor Devices in Automotive Authors: Keller, Helmut; Keller, Helmut

2	Predictive Reliability, Prognostics and Risk Assessment for Power Modules Authors: Bailey, C.; Lu, H.; Yin, C.; Ridout, S.

3	Lifetime Modeling and Prediction of Power Devices Authors: Ciappa, Mauro

4	Model for Power Cycling lifetime of IGBT Modules – various factors influencing lifetime Authors: Bayerer, Reinhold; Herrmann, Tobias; Licht, Thomas; Lutz, Josef; Feller, Marco

5	Proposition of IGBT modules assembling technologies for aeronautical applications Authors: Zéanh, A.; Zéanh, A.; Zéanh, A.; Zéanh, A.; Dalverny, O.; Karama, M.; Woirgard, E.; Azzopardi, S.; Bouzourene, A.; Casutt, J.; Mermet-Guyennet, M.

6	Test System for the Reliability Management of Power Modules Authors: Wernicke, Thies; Middendorf, Andreas; Dieckerhoff, Sibylle; Guttowski, Stephan; Reichl, Herbert

7	Power cycling induced failure mechanisms in the viewpoint of rough temperature environment Authors: Lutz, J.; Herrmann, T.; Feller, M.; Bayerer, R.; Licht, T.; Amro, Raed

8	DBC substrate based EMC Transfer Molded Power Module Authors: Lee, Keunhyuk; Jeon, Oseob; Lim, Seungwon; Park, Sungmin; Lee, Byoungok; Lee, Taekkeun

9	Built-in EMC for integrated power electronics systems Authors: Schanen, Jean-Luc; Roudet, James

10	EMC in Power Electronics Authors: Hoene, Eckart

11	Design and assembly of power semiconductors with double-sided water cooling Authors: Schneider-Ramelow, Martin; Baumann, Thomas; Hoene, Eckart

12	Compact thermal model for the analysis of power devices thermal interactions Authors: Bruno, Allard; Xavier, Jordà; Sabrine, M’Rad; Xavier, Perpinya

13	Thermal Power Density Barriers of Converter Systems Authors: DROFENIK, Uwe; KOLAR, Johann W.

14	Review on Highly Integrated Solutions for Power Electronic Devices Authors: Schulz-Harder, Jürgen

15	The Road to the Next Generation Power Module – 100% Solder Free Design Authors: Scheuermann, Uwe; Beckedahl, Peter

16	Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment Authors: Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan; Calata, Jesus N.; Calata, Jesus N.; Lei, Thomas G.; Lei, Thomas G.

17	3D Integration of Power Semiconductor Devices based on Surface Bump Technology Authors: Mermet-Guyennet, Michel; Castellazzi, Alberto; Lasserre, Philippe; Saiz, José

18	A Study of Pressed Contact Technology on IGBT Devices between -40°C and +200°C Authors: Banckaert, Guillaume; Mermet-Guyennet, Michel; Castellazzi, Alberto

19	An Investigation of Gate Drive Circuits and Losses in Power Devices of Multilevel Converters for Circuit Integration to Realize High Output Power Density Authors: Kamaga, Masamu; Kamaga, Masamu; Sung, Kyungmin; Sung, Kyungmin; Hayashi, Yusuke; Sato, Yukihiko; Sato, Yukihiko; Ohashi, Hiromichi

20	High Efficiency Isolated Half-Bridge Gate Driver with PCB Integrated Transformer Authors: Zeltner, Stefan

21	Low-cost digital control for SMPS integration Authors: Lin-Shi, Xuefang; Allard, Bruno; Guo, Shuibao; Gao, Yanxia

22	Optimisation of DC-link capacitors Authors: Kriegel, K.; Otto, J.; Rackles, J.

23	Duplex pulse controlled inverter with a film capacitor DC-link Authors: Kleimaier, A.; Hoffmann, B.; Scherer, A.

24	Polymer bonded soft magnetic particles for planar inductive devices Authors: Egelkraut, Sven; März, Martin; Ryssel, Heiner

25	Printed circuit board integrated multi-output transformer Authors: Waffenschmidt, Eberhard

26	DCDC Converter for Hybrid Vehicle Applications Authors: Schmidt, Wolfgang

27	Modularity bridging future Power Electronics in automotive volume applications – speeding up HEV applications Authors: Rekofsky, Andreas; Brey, Roland; Thoben, Markus; Mertens, Christian; Löcher, Günter

28	Automotive DC-DC Converter Designed for High Power-Density and High Efficiency Authors: Pavlovsky, Martin; Tsuruta, Yukinori; Kawamura, Atsuo

29	Influence of Parasitic Elements on the Commutation of a Resonant Matrix Converter Authors: Schulz, Sebastian; Ecklebe, Andreas; Lindemann, Andreas

30	System Design of Compact Low-Power Inverters for the Application in Photovoltaic AC-Modules Authors: Sahan, Benjamin; Henze, Norbert; Engler, Alfred; Zacharias, Peter; Licht, Thomas

31	Cost Reduction of PV-Inverters with SiC-DMOSFETs Authors: Burger, Bruno; Kranzer, Dirk; Stalter, Olivier

32	Two-Stage Power Architecture for Voltage Regulator Application based on Coupled Magnetic Structure Authors: González, M. C.; Alou, P.; García, O.; Cobos, J. A.; Visairo-Cruz, H.

33	VHDL-AMS simulation of integrated power systems: a unified solution for multi-domain multi-level abstraction analysis Authors: Castellazzi, Alberto; Ciappa, Mauro; Mermet-Guyennet, Michel; Fichtner, Wolfgang

34	Compact Power Electronics due to SiC Devices Authors: Friedrichs, Peter

35	Normally-On devices and circuits, SiC and high temperature: using SiC JFETs in power converters Authors: Bergogne, Dominique; Morel, Hervé; Tournier, Dominique; Allard, Bruno; Planson, Dominique; Raynaud, Christophe; Lazar, Mihai

36	Issues and Options for Planar Packaging of High-Voltage SiC Diodes Authors: Xu, Jing; Ngo, Khai D. T.; Calata, Jess; Wyk, J. D. van; Wyk, J. D. van

37	SiC JFET for high temperature power switches Authors: Bergogne, Dominique; Tournier, Dominique; Mousa, Rami; Koor, Mohsen Shafiee; Planson, Dominique; Morel, Hervé; Allard, Bruno

38	Current limiting with SiC JFET structures Authors: Tournier, Dominique; Bergogne, Dominique; Hamoud, Asif; Planson, Dominique; Mousa, Rami; Morel, Hervé; Allard, Bruno; Brevet, Olivier

39	600V Converter/Inverter/Brake (CIB) - Module with integrated SOI Gate Driver IC for Medium Power Applications Authors: Vogler, B.; Roßberg, M.; Herzer, R.; Reusser, L.

40	Life time prediction and design for reliability of Smart Power devices for automotive exterior lighting Authors: letor, Romeo; Russo, Sebastiano; Crisafulli, Roberto

41	System integration using advanced power semiconductors Authors: Deboy, Gerald

42	A high number of phases enables high frequency techniques and a better thermal management in medium power converters Authors: Garcia, O.; Alou, P.; Oliver, J. A.; Zumel, P.; Cobos, J. A.

43	System integration approach for high power density drives Authors: Popovic-Gerber, J.; Gerber, M.; Ferreira, J. A.

44	An Integrated Electronic Ballast for High Intensity Discharge (HID) Lamps Authors: Jiang, Yan; Lee, Fred C.; Wyk, J. D. van; Wyk, J. D. van; Liang, Yan; Liu, Wenduo

45	Current Sensor Dedicated for High Temperature Integrated Power Electronics Authors: Grecki, Filip; Koczara, Wlodzimierz; Iwanski, Grzegorz; Lastowiecki, Jozef

46	IPEM-Based Power Electronics System Integration Authors: Boroyevich, Dushan; Fred. C. Lee; Wyk, J. Daan van; Lu, Guo-Quan; Scott, Elaine P.; Xu, Ming; Burgos, Rolando; Wang, Fred; Jahns, Thomas M.; Lipo, Thomas A.; Lorenz, Robert D.; Chow, T. Paul

47	The ECPE Roadmap Initiative Authors: Harder, Thomas; Lorenz, Leo

48	Power Electronics Technology Roadmaps – a Bottom-up Approach Authors: Wolfgang, Eckhard; Harder, Thomas

49	Automotive Power Electronics Roadmap Authors: Kolar, J. W.; März, M.

50	Power Electronics Technology Roadmap: High Frequency Power Supplies (P<1kW) Authors: Cobos, José A.; O’Mathuna, Cian

51	ECPE Power Electronics Research and Technology Roadmaps: Team No.5: High Frequency Power Conversion > 1kW Authors: Reimann, Tobias

52	Base Plate Shape Optimisation for High-Power IGBT Modules Authors: Sommer, Johann-Peter; Bayerer, Reinhold; Tschirbs, Roman; Michel, Bernd

53	Non-Destructive Experimental Investigation about RBSOA in High Power IGBT Modules Authors: Busatto, Giovanni; Abbate, Carmine; Abbate, Benedetto; Iannuzzo, Francesco

54	Extraction of Efficient Thermal Models for Life Limiting Interfaces in Power Modules Authors: Musallam, Mahera; Johnson, C. Mark

55	Direct Substrate Cooling of Power Electronics Authors: Skuriat, Robert; Johnson, C. M.

56	Cooling of Insulated Assemblies Authors: Förster, Stefan; Lindemann, Andreas

57	A digital control technique for high-performances DC-DC converters Authors: Boscaino, V.; Capponi, G.; Blasi, G. M. di; Livreri, P.; Marino, F.

58	Comparative study of three transformer concepts for high current dual active bridge converters Authors: Wang, Y.; Roodenburg, B.; Haan, S. W. H. de

59	Adjustable Speed Generation System with Axial Flux Permanent Magnet Generator Authors: Koczara, Wlodzimierz; Brown, Neil L.; Al-Tayie, Jawad; Khayat, Nazar Al; Seliga, Robert; Ernest, Emil; Krasnodebski, Artur

60	EMS Analysis on Digital Pulse Width Modulators Authors: Orietti, Enrico; Saggini, Stefano; Mattavelli, Paolo; Spiazzi, Giorgio

61	Robustness Analysis of DC Distributed Power Systems by Means of Behavioral DC-DC Converter Models Authors: Oliver, J. A.; Prieto, R.; Laguna, L.; Cobos, J. A.

62	The ESBT(R) (Emitter-Switched Bipolar Transistor): a new monolithic power actuator technology devoted to high voltage and high frequency applications Authors: Ronsisvalle, Cesare; Enea, Vincenzo

63	Trade-off between energy savings and execution time applying DVS to a microprocessor Authors: Vasic, Miroslav; García, Oscar; Alou, Pedro; Oliver, Jesús A.; Cobos, José A.

64	Analysis of STI Thin-SOI LDMOS transistors for Smart Power and high frequency applications Authors: Cortes, I.; Fernandez-Martinez, P.; Flores, D.; Hidalgo, S.; Rebollo, J.

65	Performance Comparison of a Buck Converter Using Shielded-Substrate and Co-Packaged Planar Inductors Authors: Lim, M. H. F.; Gilham, D.; Wyk, J. D. van; Wyk, J. D. van; Lee, F. C.; Ngo, K. D. T.

66	PEEC-Based Numerical Optimization of Compact Radial Position Sensors for Active Magnetic Bearings Authors: MÜSING, Andreas; ZINGERLI, Claudius; IMOBERDORF, Philipp; KOLAR, Johann W.