GMM (Hrsg.)

EMLC 2009 (GMM-FB 59)

25th European Mask and Lithography Conference, Lectures held at the GMM Conference January 12-15, 2009 in Dresden, Germany

GMM-Fachbericht Band 59

2009, CD-ROM
ISBN 978-3-8007-3154-1
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167.00 €

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This conference proceeding contains the following papers, purchasable as PDF download with payment via credit card / PayPal:


1	Lithography Development and Research Challenges for the = 22 nm Half-pitch Authors: Wurm, Stefan

2	Mask Industry Assessment Trend Analysis Authors: Hughes, Greg; Yun, Henry

3	Mask salvage in the age of capital contraction Authors: Kimmel, Kurt R.

4	Effects of mask absorber thickness on printability in EUV lithography with high resolution resist Authors: Kamo, Takashi; Aoyama, Hajime; Tanaka, Toshihiko; Suga, Osamu

5	Deflection Unit for Multi-Beam Mask Making Authors: Letzkus, Florian; Butschke, Joerg; Irmscher, Mathias; Jurisch, Michael; Klingler, Wolfram; Platzgummer, Elmar; Klein, Christof; Loeschner, Hans; Springer, Reinhard

6	SEMATECH Mask Program Authors: Yun, Henry; Rastegar, Abbas; Kearney, Patrick; Orvek, Kevin

7	Mask parameter variation in the context of the overall variation budget of an advanced logic wafer Fab Authors: Seltmann, Rolf; Burbach, Gert; Parge, Anne; Busch, Jens; Hertzsch, Tino; Poock, Andre; Weisbuch, Francois; Holfeld, Andre

8	Extended Abbe approach for fast and accurate lithography imaging simulations Authors: Evanschitzky, P.; Erdmann, A.; Fühner, T.

9	Decomposition Algorithm for Double Patterning of Contacts and Via Layers Authors: El-Gamal, A.; Al-Imam, M.

10	Mask contribution on CD & OVL errors budgets for Double Patterning Lithography Authors: Servin, I.; Lapeyre, C.; Barnola, S.; Connolly, B.; Ploss, R.; Nakagawa, K.; Buck, P.; McCallum, M.

11	New methods and processes based on advanced vacuum technology for photomask decontamination Authors: Foray, J. M.; Bellet, B.; HadjRabah, S.; Palisson, J.; Veran, E.; Davenet, M.; Favre, A.; Sergent, P.; Tissier, M.; Baudiquez, V.; Nesladek, P.; Foca, E.; Gopalakrishnan, S.; Hollein, I.; Dufaye, F.; Gough, S.

12	Particle transport and reattachment on a mask surface Authors: Nesladek, Pavel; Osborne, Steve; Kohl, Christian

13	Contamination control for ArF photo masks Authors: Gordon, Joseph S.; Silova, Marianna; Connolly, Brid; Huijbregtse, Jeroen; Maxim, Nicolae; Frisa, Larry; Chovino, Christian; Weins, Colleen

14	Lithography light source challenges for Double Patterning and EUVL Authors: Farrar, Nigel R.; Lalovic, Ivan; Brandt, David; Brown, Daniel

15	The task of EUV-reflectometry for HVM of EUV-masks: first steps Authors: Farahzadi, Azadeh; Wies, Christian; Lebert, Rainer

16	EUV and DUV scatterometry for CD and edge profile metrology on EUV masks Authors: Bodermann, Bernd; Wurm, Matthias; Diener, Alexander; Scholze, Frank; Groß, Hermann

17	EUV imaging performance – moving towards production Authors: Setten, Eelco van; Lok, Sjoerd; Dijk, Joep van; Kaya, Cemil; Schenau, Koen van Ingen; Feenstra, Kees; Meiling, Hans; Wagner, Christian

18	Resolution capability of EBM-6000 and EBM-7000 for Nano-imprint template Authors: Yoshitake, S.; Kamikubo, T.

19	Electron beam inspection methods for imprint lithography at 32 nm Authors: Selinidis, Kosta; Thompson, Ecron; Sreenivasan, S. V.; Resnick, Douglas J.

20	UV NIL template making and imprint evaluation Authors: Sasaki, Shiho; Hiraka, Takaaki; Mizuochi, Jun; Sakai, Yuko; Yusa, Satoshi; Morikawa, Yasutaka; Mohri, Hiroshi; Hayashi, Naoya

21	Residual-free imprint for sensor definition Authors: Mayer, A.; Bogdanski, N.; Möllenbeck, S.; Scheer, H.-C.

22	Monte-Carlo Simulations of Image Analysis for flexible and high-resolution Registration Metrol Authors: Arnz, M.; Klose, G.; Troll, G.; Beyer, D.; Mueller, A.

23	SEM image contrast modeling for mask and wafer metrology Authors: Frase, C. G.; Gnieser, D.; Johnsen, K.-P.; Häßler-Grohne, W.; Tutsch, R.; Bosse, H.

24	Registration Metrology on Double Patterning Reticles Authors: Schmidt, Karl-Heinrich; Röth, Klaus-Dieter; Laske, Frank; Bender, Jochen; Adam, Dieter; Ache, Oliver

25	Reduced Pellicle Impact on Overlay using High Order Intrafield Grid Corrections Authors: Kruif, Robert de; Rhee, Tasja van; Heijden, Eddy van der

26	High Resolution Cell Projection Authors: Weidenmueller, U.; Hahmann, P.; Lemke, M.; Schnabel, B.; Pain, L.; Manakli, S.

27	MAPPER: High Throughput Maskless Lithography Authors: Kuiper, V.; Kampherbeek, B. J.; Wieland, M. J.; Boer, G. de; Berge, G. F. ten; Boers, J.; Jager, R.; Peut, T. van de; Peijster, J. J. M.; Slot, E.; Steenbrink, S. W. H. K.; Teepen, T. F.; Veen, A. H. V. van

28	New writing strategy in electron beam direct write lithography to improve critical dense lines patterning for sub-45nm nodes Authors: Martin, L.; Manakli, S.; Icard, B.; Pradelles, J.; Orobtchouk, Régis; Poncet, Alain; Pain, L.

29	A Solution to Meet New Challenges on EBDW Data Prep Authors: Galler, R.; Melzer, D.; Nowotny, J.; Kroenert, K.; Krueger, M.; Suelzle, M.; Papenfuss, B.; Wagner, C.; Baetz, U.; Buerger, B.; Gramss, J.; Lemke, M.

30	Innovative processes investigation for photomask pod conditioning and drying Authors: Foray, J. M.; Rude, C.; Palisson, J.; Davenet, M.; Favre, A.; Cheung, D.; Dufaye, F.; Gough, S.; Richteiger, P.; Baudiquez, V.; Foca, E.; Nesladek, P.; Gopalakrishnan, S.; Hollein, K. Avary I.

31	High speed (>100 Gbps) key components for a scalable optical data link, to be implemented in future maskless lithography applications Authors: Paraskevopoulos, A.; Voss, S.-H.; Talmi, M.; Walf, G.

32	Molecular dynamics study on mold fracture by nano scale defects in nanoimprint lithography Authors: Tada, K.; Yasuda, M.; Fujii, N.; Kawata, H.; Hirai, Y.

33	Advanced proximity matching with Pattern Matcher Authors: Serebryakov, Alexander; Brige, Lionel; Boisseau, Emmanuel; Peloquin, Eric; Coutellier, Vincent; Planchot, Jonathan

34	Mounting Methodologies to Measure EUV Reticle Nonflatness Authors: Battula, Venkata Siva; Zeuske, Jacob R.; Engelstad, Roxann L.; Vukkadala, Pradeep; Mikkelson, Andrew R.; Peski, Chris K. Van

35	CDP - Application of focus drilling Authors: Geisler, S.; Bauer, J.; Haak, U.; Schulz, K.; Old, G.; Matthus, E.

36	MeRiT(R) repair verification using in-die phase metrology Phame(R) Authors: Buttgereit, Ute; Birkner, Robert; Stelzner, Robert

37	Design Verification for sub 70 nm DRAM nodes via Metal Fix using E-Beam Direct Write Authors: Keil, K.; Jaschinsky, P.; Hohle, C.; Choi, K.-H.; Schneider, R.; Tesauro, M.; Thrum, F.; Zimmermann, R.; Kretz, J.

38	CRYSTAL Project: A Contribution to control Cycle Time excursion in Litho area Authors: Tissier, Michel; Beisser, Eric; Davenet, Magali; Garcia, Patrick; Au, David; Quere, Yves; Finck, François; Silova, Mariana; Hoellein, Ingo

39	Improving yield and cycle time at the inspection process by means of a new defects disposition technique Authors: Villa, Ernesto; Sartelli, Luca; Miyashita, Hiroyuki; Sundermann, Frank; Gough, Stuart; Dufaye, Felix; Sippel, Astrid

40	Nuisance Event Reduction Using Sensitivity Control Layers (SCL) for Advanced Photomask Inspection Authors: Hedges, Shad; Le, Chin; Eickhoff, Mark; Wylie, Mark; Simmons, Tim; Vellanki, Venu; McMurran, Jeff

41	Increasing inspection equipment productivity by utilizing Factory Automation SW on TeraScan 5XX systems Authors: Jakubski, Thomas; Piechocinski, Michal; Moses, Raphael; Bugata, Bharathi; Schmalfuss, Heiko; Köhler, Ines; Lisowski, Jan; Klobes, Jens; Fenske, Robert

42	Error-budget paradigms and laser mask pattern generator evolution Authors: Hamaker, H. Christopher; Jolley, Matthew J.; Berwick, Andrew D.

43	Ion Beam Deposition for Defect-Free EUVL Mask Blanks Authors: Kearney, Patrick; Lin, C. C.; Yun, Henry; Randive, Rajul; Reiss, Ira; Hayes, Alan; Mirkarimi, Paul

44	EUV Actinic Defect Inspection and Defect Printability at sub-32 nm Half-pitch Authors: Huh, Sungmin; Kearney, Patrick; Wurm, Stefan; Goodwin, Frank; Han, Hakseung; Goldberg, Kenneth; Mochi, Iacopo; Gullikson, Eric

45	Sub-30 nm defect removal on EUV substrates Authors: Rastegar, Abbas; Eichenlaub, Sean; Kadaksham, Arun John; House, Matt; Cha, Brian; Yun, Henry

GMM (Hrsg.)

EMLC 2009 (GMM-FB 59)

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