Rubric: ETG-Reports

ETG (Hrsg.)

CIPS 2010 (ETG-FB 121)

6th International Conference on Integrated Power Electronics Sytems, Proceedings, March, 16-18, 2010, Nuremberg/Germany

ETG-Fachbericht Band 121

2010, 468 pages, 21 x 29,7 cm, paperback
ISBN 978-3-8007-3212-8

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215.00 €

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This year CIPS is organized for the second time in conjunction with the Annual Event of the ECPE Power Electronics Network, while in the previous years it was held in conjunction with the International Symposium on Power Semiconductor Devices and Integrated Circuits, ISPSD-2006, and the IEEE PESC 2004. CIPS 2010 is organized by ETG, the Power Engineering Society within VDE and co-organized by ECPE, the European Center for Power Electronics.

This conference proceeding contains the following papers, purchasable as PDF download with payment via credit card:


1	Performance Trends and Limitations of Power Electronic Systems Authors: Kolar, J. W.

2	Integrated gate driver circuit solutions Authors: Herzer, R.

3	High-Density System Integration for Medium Power Applications Authors: Boroyevich, Dushan; Chen, Zheng; Luo, Fang; Ngo, Khai; Ning, Puqi; Wang, Ruxi; Zhang, Di; Wang, Fred; Burgos, Rolando; Lai, Rixin; Wang, Shuo

4	A Formal Approach to System Integration Authors: Gutierrez-Alcaraz, J. M.; Haan, S. W. H. de; Ferreira, J. A.

5	Design for fault tolerance and predictive failures Authors: Wolmarans, J. J.; Ferreira, J. A.; Polinder, H.; Josifovic, I.; Clarenbach, D.

6	Modular Concept for Power Electronics in Electric Cars Authors: Wondrak, Wolfgang; Dehbi, Anis; Willikens, Axel

7	Power module with solid state circuit breakers for fault-tolerant applications Authors: Kriegel, Kai; Melkonyan, Ashot; Galek, Marek; Rackles, Juergen

8	Railway Traction Reliability Authors: Mermet-Guyennet, Michel; Piton, Michel

9	First Power Cycling Results of Improved Packaging Technologies for Hybrid Electrical Vehicle Applications Authors: Hensler, Alexander; Lutz, Josef; Thoben, Markus; Guth, Karsten

10	How Materials Behaviour affects Power Electronics Reliability Authors: Poech, Max H.

11	Interface Degradation of Al Heavy Wire Bonds on Power Semiconductors during Active Power Cycling measured by the Shear Test Authors: Goehre, Jens; Schneider-Ramelow, Martin; Geißler, Ute; Lang, Klaus-Dieter

12	Observation of chip solder degradation by electrical measurements during power cycling Authors: Hartmann, Samuel; Bayer, Martin; Schneider, Daniel; Feller, Lydia

13	A Novel Built-In Methodology for Screening LDMOS transistors to Achieve Zero Defects in the Automotive Environment Authors: Malandruccolo, Vezio; Ciappa, Mauro; Rothleitner, Hubert; Fichtner, Wolfgang

14	The Future of Wire Bonding is? Wire Bonding! Authors: Siepe, Dirk; Bayerer, Reinhold; Roth, Roman

15	SiC BJT Driver applied to a 2 kW Inverter : performances and limitations Authors: Tournier, Dominique; Bevilacqua, Pascal; Brosselard, Pierre; Planson, Dominique; Allard, Bruno

16	Normally-On SiC JFETs in Power Converters: Gate Driver and Safe Operation Authors: Bergogne, Dominique; Risaletto, Damien; Dubois, Fabien; Hammoud, Asif; Morel, Hervé; Bevilacqua, Pascal; Allard, Bruno; Berry, Olivier; Meibody-Tabar, Farid; Raël, Stéphane; Meuret, Régis; Dhokkar, Sonia

17	Insulating IGBT Driver with PCB integrated capacitive coupling elements Authors: Zeltner, Stefan

18	Power Electronics System Integration for Electric and Hybrid Vehicles Authors: März, Martin; Schletz, Andreas; Eckardt, Bernd; Egelkraut, Sven; Rauh, Hubert

19	Solar Power Inverters Authors: Mallwitz, Regine; Engel, Bernd

20	Fault tolerant drives for aerospace applications Authors: Atkinson, G. J.; Bennett, J. W.; Mecrow, B. C.; Atkinson, D. J.; Jack, A. G.; Pickert, V.

21	Dynamic Paralleling Problems in IGBT Module Construction and Application Authors: Schlapbach, Ulrich

22	Non Destructive SOA Testing of Power Modules Authors: Busatto, G.; Abbate, C.; Iannuzzo, F.

23	Active Reduction of Common Mode Current in Power Modules Authors: Schanen, Jean-Luc; Oliveira, Thomas De; Guichon, Jean-Michel; Mandray, Sylvain; Bouzourene, Arezki

24	Power Module with Additional Low Inductive Current Path Authors: Frisch, Michael; Ernö, Temesi

25	Power Circuit design for clean switching Authors: Bayerer, Reinhold; Domes, Daniel

26	Development of a mid-power core (35 kW) dedicated to inverters for aerospace applications Authors: Maglie, Rodolphe De; Osvald, Gaetan; Mashaly, Aly; Liebig, Sebastian; Engstler, Juergen; Engler, Alfred

27	Evaluation of Power Density of a Reduced Switch Count Five-level Three-phase PWM Rectifier for Aircraft Applications Authors: Itoh, Jun-ichi; Noge, Yuichi

28	Development of a Highly Compact and Efficient Solar Inverter with Silicon Carbide Transistors Authors: Wilhelm, C.; Kranzer, D.; Burger, B.

29	Mixed switched mode and linear Lithium Ion Battery Tester for high Power and large Bandwidth Authors: Fischnaller, M.; Melbert, J.

30	A Linear 10 kV Power Amplifier for Piezo Actuators Authors: Horn, T.; Melbert, J.

31	Three-stage DC-DC converter solutions for SMPS applications in comparison Authors: Schwalbe, Ulf; Scherf, Marko; Reimann, Tobias

32	Fast control technique for high frequency (5MHz) DC/DC integrated converter Authors: Viejo, M. del; Alou, P.; Oliver, J. A.; García, O.; Cobos, J. A.

33	Low temperature sinter technology - Die attachment for power electronic applications Authors: Göbl, C.; Faltenbacher, J.

34	Pure Low Temperature Joining Technique Power Module for Automotive Production Needs Authors: Schulze, Elisabeth; Mertens, Christian; Lindemann, Andreas

35	Power Semiconductor Joining through Sintering of Silver Nanoparticles: Evaluation of Influence of Parameters Time, Temperature and Pressure on Density, Strength and Reliability Authors: Knoerr, Matthias; Schletz, Andreas

36	Sintering technology used for interconnection of large areas: potential and limitation for power modules Authors: Licht, Thomas; Speckels, Roland; Thoben, Markus

37	Novel Silver Contact Paste Lead Free Solution for Die Attach Authors: Schmitt, Wolfgang

38	Direct bonded aluminum on aluminum nitride substrates via a transient liquid phase and its application Authors: Kuromitsu, Yoshirou; Nagatomo, Yoshiyuki; Tonomura, Hiroshi; Akiyama, Kazuhiro; Montesa, Christine Marie; Shibata, Naoya; Ikuhara, Yuichi

39	Evaluation of Insulation Material in Advanced High Power IGBT Modules with Extended Operation Temperature Authors: Feller, Lydia; Hartmann, Samuel; Granata, Davide; Behzadi, Bahar

40	Innovative materials of automotive power packaging Authors: Tan, Ky Lim; Vivet, Laurent; Morelle, Jean Michel; Pierre, Bertrand; Bienvenu, Yves; Kaabi, Abderrahmen

41	Application of Phase Change Materials for Low Duty Cycle High Peak Load Power Supplies Authors: Stupar, Andrija; Drofenik, Uwe; Kolar, Johann W.

42	Current Status of Prognostics Techniques and Application to Power Electronics Authors: Bailey, Chris; Yin, Chunyan; Lu, Hua; Musallam, Mahera; Johnson, C. Mark

43	Validation of a Fast Loss and Temperature Simulation Method for Power Converters Authors: Bryant, A. T.; Parker-Allotey, N.-A.; Swan, I. R.; Hamilton, D. P.; Mawby, P. A.; Ueta, T.; Nisijima, T.; Hamada, K.

44	Thermal pre-dimensioning methodology based on thermal impedance Authors: Dubus, Patrick; Leon, Renan; Guyader, Delphine Le; Caves, Laurent

45	A MATLAB based approach for electro-thermal design of power converters Authors: Cova, Paolo; Bernardoni, Mirko

46	Fast and Accurate Simulation of Time-Variant Air-Cooling Systems Authors: Gradinger, Thomas; Liu, Yang

47	Thermo-mechanical stress analysis for a multilayer SMT manufacturing technology Authors: Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.

48	Investigation and PEEC Based Simulation of Radiated Emissions Produced by Power Electronic Converters Authors: Domurat-Linde, André; Hoene, Eckart

49	PEEC-Models for EMC filter layout optimization Authors: Oliveira, Thomas De; Guichon, Jean-Michel; Schanen, Jean-Luc; Gerbaud, Laurent

50	Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors Authors: Saums, David L.

51	New Semiconductor Technologies challenge Package and System Setups Authors: Miller, Gerhard

52	Future Role of Power Electronics Authors: Omura, Ichiro

53	Is it the End of the Road for Silicon in Power Conversion? Authors: Lidow, Alex

54	MOS-Gated GTO: a new functionally integrated device suitable for high voltage power applications Authors: Ronsisvalle, C.; Enea, V.; Abbate, C.; Busatto, G.; Sanseverino, A.

55	Importance of Boundary Conditions for Optimizing the Thermal Dimensioning of PCB Traces Authors: Coppola, L.; Agostini, B.; Schmidt, R.; Barcelos, R. Faria

56	Integrable Semiconductor Current Balancer for Paralleled Fluorescent Lamps Authors: Weger, Robert

57	Mechanical Characterization of an Au-Ge Solder Alloy for High Temperature Electronic Devices Authors: Msolli, Sabeur; Dalverny, Olivier; Alexis, Joel; Karama, Moussa

58	Evaluation of commercial SOI driver performances while operated in extreme conditions (150deg C-200deg C) Authors: Falahi, K. El; Allard, B.; Tournier, D.; Bergogne, D.

59	Integrated rectenna circuit for microwave power scavenging Authors: Merabet, Boubekeur; Takhedmit, Hakim; Allard, Bruno; Cirio, Laurent; Costa, François; Picon, Odile; Vollaire, Christian

60	Fast Extraction of Dynamic Thermal Impedance for Multi-Chip Power Modules Authors: Evans, Paul; Johnson, C. Mark

61	Inductive Parasitics in Power Semiconductor Modules subject to Multi-Objective Optimisation Authors: Förster, Stefan; Lindemann, Andreas

62	Normally-off AlGaN/GaN HFET with p-type GaN Gate and AlGaN Buffer Authors: Hilt, Oliver; Knauer, Arne; Brunner, Frank; Bahat-Treidel, Eldad; Würfl, Joachim

63	High Temperature Electronics for High Power Density DC-DC Converters and Motor Drives Authors: Delatte, Pierre; Dessard, Vincent; Saib, Aimad; Pequignot, Nicolas; Picún, Gonzalo; Demeûs, Laurent; Doucet, Jean-Christophe; Krebs, Thomas

64	Preliminary Study for the Integrated Design of an Electro-Mechanical Wing De-Icing System Authors: Abdesselam, Francis; Boissy, Loic; Castellazzi, Alberto; Wijekoon, Thiwanka; Wheeler, Pat; Johnson, Mark

65	Performance Trends and Limitations of Power Electronic Systems Authors: Kolar, J. W.; Biela, J.; Waffler, S.; Friedli, T.; Badstuebner, U.

66	Design of a Multi-Cell, DCM PFC Rectifier for a 1mm thick, 200W Off-line Power Supply - The Power Sheet Authors: Marxgut, Christoph; Biela, Jürgen; Kolar, Johann W.

67	Knowledge Matrix for Power Electronics – The Approach of the ZVEI Working Group 'High Temperature and Power Electronics' Authors: Rittner, Martin; Roth, Alexander

68	1200 V 6 A SiC BJTs with very low V(CESAT) and fast switching Authors: Lindgren, Anders; Domeij, Martin

69	System based optimization of the chip size and the thermal path for Si and SiC semiconductors Authors: Köneke, Thies; Merkert, Arvid; Mertens, Axel