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Rubric: Proceedings
- General Proceedings
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24th European Mask and Lithography Conference - Lectures held at the GMM Conference January 21-24, 2008 in Dresden, Germany
2008, CD-ROM |
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The three-day conference is dedicated to the science, technology, engineering and application of mask and lithography technologies and associated processes, and gives an overview of the present status in mask and lithography technologies and the future strategy where mask producers and users have the opportunity to become acquainted with new developments and results. This years sessions included: "Double Patterning”, “Simulation”, “Mask Business & Mask Data Prep”, “Mask Cleaning & Haze”, Inspection & Repair”, “Resist”, “Metrology”, “RET”, “EUV” and “NIL”. A small Poster Session was also included.
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| 1 |
Mask Industry Assessment Trend AnalysisAuthors:
Shelden, Gilbert; Marmillion, Patrica; Hughes, Greg
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| 2 |
Progress of Nil Template MakingAuthors:
Yusa, Satoshi; Hiraka, Takaaki; Mizuochi, Jun; Fujii, Akiko; Sakai, Yuko; Kuriyama, Koki; Sakaki, Masashi; Sasaki, Shiho; Morikawa, Yasutaka; Mohri, Hiroshi; Hayashi, Naoya
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| 3 |
3-Dimensional bridged structures by thermal-UV imprint using a novel maskAuthors:
Okuda, Keisuke; Kawata, Hiroaki; Hirai, Yoshihiko
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| 4 |
Polarization-induced astigmatism caused by topographic masksAuthors:
Ruoff, Johannes; Neumann, Jens Timo; Schmitt-Weaver, Emil; Setten, Eelco van; Masson, Nicolas le; Progler, Chris; Geh, Bernd; Geh, Bernd
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| 5 |
Practical use of hard mask process to fabricate fine photomasks for 45nm node and beyondAuthors:
Kushida, Yasuyuki; Handa, Hitoshi; Maruyama, Hiroshi; Abe, Yuuki; Fujimura, Yukihiro; Yokoyama, Toshifumi
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| 6 |
Double Exposure Technology for KrF LithographyAuthors:
Geisler, S.; Bauer, J.; Haak, U.; Stolarek, D.; Schulz, K.; Wolf, H.; Meier, W.; Trojahn, M.; Matthus, E.; Beyer, H.; Old, G.; Marschmeyer, St.; Kuck, B.
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| 7 |
Wafer Based Mask Characterization for Double Patterning LithographyAuthors:
Kruif, Robert de; Bubke, Karsten; Janssen, Gert-Jan; Heijden, Eddy van der; Fochler, Jörg; Dusa, Mircea; Peters, Jan Hendrik; Haas, Paul de; Connolly, Brid
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| 8 |
Topological and Model Based approach to Pitch decomposition for Double PatterningAuthors:
Nikolsky, Peter; Davydova, Natalia; Goossens, Ronald
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| 9 |
Fast rigorous simulation of mask diffraction using the waveguide method with parallelized decomposition techniqueAuthors:
Shao, Feng; Evanschitzky, Peter; Reibold, David; Erdmann, Andreas
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| 10 |
Three Dimensional Mask Effects in OPC Process Model Development From First Principles SimulationAuthors:
Melvin III, Lawrence S.; Schmoeller, Thomas; Kalus, Christian K.; Lia, Jianliang
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| 11 |
Key improvement Schemes of Accuracies in EB Mask Writing for Double Patterning LithographyAuthors:
Sunaoshi, Hitoshi; Kamikubo, Takashi; Nishimura, Rieko; Tsuruta, Kaoru; Katsumata, Takehiko; Ohnishi, Takayuki; Anze, Hirohito; Takamatsu, Jun; Yoshitake, Shusuke; Tamamushi, Shuichi
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| 12 |
Mask Data Rank (MDR) and its ApplicationAuthors:
Kato, Kokoro; Endo, Masakazu; Inoue, Tadao; Yamabe, Masaki
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| 13 |
MEDEA+ project 2T302 MUSCLE “Masks through user’s supply chain: leadership by excellence”Authors:
Torsy, Andreas; Torsy, Andreas
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| 14 |
Printing of sub resolution shots in electron beam direct write with variable shaped beam machinesAuthors:
Thrum, Frank; Kretz, Johannes; Hohle, Christoph; Choi, Kang-Hoon; Keil, Katja
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| 15 |
Assessment of molecular contamination in mask podAuthors:
Foray, Jean Marie; Dejaune, Patrice; Sergent, Pierre; Gough, Stuart; Davene, Magali; Favre, Arnaud; Rude, C.; Trautmann, T.; Tissier, Michel; Cheung, D.; Fontaine, H.; Veillerot, M.; Avary, K.; Hollein, I.; Lerit, R.
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| 16 |
Photomask cleaning process improvement to minimize ArF hazeAuthors:
Graham, Michael; McDonald, Andrew
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| 17 |
Theoretical Study of Mask Haze FormationAuthors:
Wu, Banqiu; Kumar, Ajay
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| 18 |
EUV Blank InspectionAuthors:
Peters, J. H.; Tonk, C.; Spriegel, D.; Han, Hak-Seung; Wurm, Stefan
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| 19 |
Introduction of new database reflected tritone algorithm for application in mask productionAuthors:
Schulmeyer, Thomas; Schmalfuss, Heiko; Heumann, Jan; Lang, Michael
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| 20 |
Phase-shifting photomask repair and repair validation procedure for transparent & opaque defects relevant for the 45nm node and beyondAuthors:
Ehrlich, Christian; Buttgereit, Ute; Boehm, Klaus; Scheruebl, Thomas; Edinger, Klaus; Bret, Tristan
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| 21 |
Inspection results of advanced (sub-50nm design rule) reticles using the TeraScanHRAuthors:
Sier, Jean-Paul; Broadbent, William; Yu, Paul
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| 22 |
Alternative Approach to Transparent Stamps for UV-based Nanoimprint Lithography – Techniques and MaterialsAuthors:
Klukowska, Anna; Vogler, Marko; Kolander, Anett; Reuther, Freimut; Gruetzner, Gabi; Muehlberger, Michael; Bergmair, Iris; Schoeftner, Rainer
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| 23 |
Characterizing the imaging performance of Flash Memory masks using AIMS(TM)Authors:
Setten, Eelco van; Wismans, Onno; Grim, Kees; Finders, Jo; Dusa, Mircea; Birkner, Robert; Richter, Rigo; Scherübl, Thomas
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| 24 |
CDO BudgetingAuthors:
Nesladek, Pavel; Wiswesser, Andreas; Sass, Björn; Mauermann, Sebastian
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| 25 |
High-resolution and high-precision pattern placement metrology for the 45 nm node and beyondAuthors:
Klose, G.; Buttgereit, U.; Arnz, M.; Rosenkranz, N.
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| 26 |
Mask CD measurement approach by diffraction intensity for lithography equivalentAuthors:
Nagai, Takaharu; Mesuda, Kei; Sutou, Takanori; Inazuki, Yuichi; Hashimoto, Hiroyuki; Yokoyama, Toshifumi; Toyama, Nobuhito; Morikawa, Yasutaka; Mohri, Hiroshi; Hayashi, Naoya
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| 27 |
Influences on accuracy of SEM based CD mask metrology with a view to the 32 nm nodeAuthors:
Häßler-Grohne, W.; Frase, C. G.; Gnieser, D.; Bosse, H.; Richter, J.; Wiswesser, A.
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| 28 |
Comparative scatterometric CD and edge profile measurements on a MoSi mask using different scatterometersAuthors:
Wurm, M.; Diener, A.; Bodermann, B.
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| 29 |
Top surface imaging study by selective chemisorptions of poly(dimethyl siloxane) on diazoketo-functionalized polymeric surfaceAuthors:
Ganesan, Ramakrishnan; Youn, Seul Ki; Yun, Jei-Moon; Kim, Jin-Baek
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| 30 |
Optical Proximity Correction for 0.13 µm SiGe:C BiCMOSAuthors:
Geisler, S.; Geisler, S.; Bauer, J.; Haak, U.; Jagdhold, U.; Pliquett, R.; Matthus, E.; Schrader, R.; Wolf, H.; Baetz, U.; Beyer, H.; Niehoff, M.
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| 31 |
New alignment marks for improved measurement maturityAuthors:
Weidenmueller, U.; Alves, H.; Schnabel, B.; Icard, B.; Le-Denmat, J-C.; Manakli, S.; Pradelles, J.
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| 32 |
Measuring Contact Hole Corner Rounding Uniformity Using Optical ScatterometryAuthors:
Lam, John C.; Gray, Alexander; Chen, Stanley; Richter, Jan
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| 33 |
Very High Sensitivity Mask DUV Transmittance Mapping and Measurements Based on Non Imaging OpticsAuthors:
Ben-Zvi, Guy; Dmitriev, Vladimir; Graitzer, Erez; Zait, Eitan; Sharoni, Ofir; Cohen, Avi
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| 34 |
Advances in Fabrication of X-ray Masks based on Vitreous Carbon using a new UV sensitive positive ResistAuthors:
Voigt, Anja; Kouba, Josef; Heinrich, Marina; Gruetzner, Gabi; Scheunemann, Heinz-Ulrich; Rudolph, I.; Waberski, Christoph
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| 35 |
New Results from DUV Water Immersion Microscopy Using the CD Metrology System LWM500 WI with a High NA CondenserAuthors:
Hillmann, Frank; Scheuring, Gerd; Brück, Hans-Jürgen
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| 36 |
High Resolution Patterning and Simulation on Mo/Si Multilayer for EUV MasksAuthors:
Tsikrikas, N.; Patsis, G. P.; Raptis, I.; Gerardino, A.
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| 37 |
Phame(R) - high resolution off-axis phase shift measurements on 45nm node featuresAuthors:
Buttgereit, Ute; Perlitz, Sascha; Seidel, Dirk
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| 38 |
Assessment and application of focus drilling for DRAM contact hole fabricationAuthors:
Noelscher, Christoph; Jauzion-Graverolle, Franck; Henkel, Thomas
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| 39 |
Design of pattern-specific mask grating for giving the effect of an off-axis illuminationAuthors:
Kim, Young-Seok; Song, Seok Ho; Lee, Jong Ung; Oh, Sung Hyun; Choi, Yong Kyoo; Kim, Munsik; O, Beom-Hoan; Park, Se-Geun; Lee, El-Hang; Lee, Seung Gol
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| 40 |
Overcoming Mask Etch Challenges for 45 nm & BeyondAuthors:
Chandrachood, M.; Leung, T. Y. B.; Yu, K.; Grimbergen, M.; Panayil, S.; Ibrahim, I.; Sabharwal, A.; Kumar, A.
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| 41 |
Desired IP Control methodology for EUV Mask in Current Mask ProcessAuthors:
Yoshitake, S.; Yoshitake, S.; Tamamushi, S.; Ogasawara, M.
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| 42 |
Use of EUV scatterometry for the characterization of line profiles and line roughness on photomasksAuthors:
Scholze, Frank; Laubis, Christian
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| 43 |
Strategies for hybrid techniques of UV lithography and thermal nanoimprintAuthors:
Wissen, M.; Bogdanski, N.; Moellenbeck, S.; Scheer, H.-C.
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| 44 |
Controlling Linewidth Roughness in Step and Flash Imprint LithographyAuthors:
Schmid, Gerard M.; Khusnatdinov, Niyaz; Brooks, Cynthia B.; LaBrake, Dwayne; Thompson, Ecron; Resnick, Douglas J.; Owens, Jordan; Ford, Arnie; Sasaki, Shiho; Toyama, Nobuhito; Kurihara, Masaaki; Hayashi, Naoya; Kobayashi, Hideo; Sato, Takashi; Nagarekawa, Osamu; Hart, Mark W.; Gopalakrishnan, Kailash; Shenoy, Rohit; Jih, Ron; Zhang, Ying; Sikorski, Edmund; Rothwell, Mary Beth; Yoshitake, Shusuke; Sunaoshi, Hitoshi; Yasui, Kenichi
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| 45 |
Status of EUVL Reticle ChuckingAuthors:
Engelstad, Roxann L.; Sohn, Jaewoong; Zeuske, Jacob R.; Battul, Venkata Siva; Vukkadala, Pradeep; Peski, Chris K. Van; Orvek, Kevin J.; Turner, Kevin T.; Mikkelson, Andrew R.; Nataraju, Madhura
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| 46 |
45nm Node Registration Metrology on LTEM EUV ReticlesAuthors:
Laske, Frank; Kinoshita, Hiroshi; Nishida, Naoki; Kenmochi, Daisuke; Ota, Hitoshi; Tanioka, Yukitake; Czerkas, Slawomir; Schmidt, Karl-Heinrich; Adam, Dieter; Roeth, Klaus-Dieter
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