Rubrik: Proceedings - ETG-Fachberichte

ETG ; ECPE

CIPS 2008 (ETG-FB 111)

5th International Conference on Integrated Power Electronics Systems, Proceedings, March, 11-13, 2008 Nuremberg/Germany

ETG-Fachbericht Band 111

2008, 410 Seiten, DIN A4, kartoniert,
ISBN 978-3-8007-3089-6

Rabatt

198,00 €

Fachbuch

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Conference Topics:
1. Power Electronics Systems
Device and System Packaging, Assembly Concepts and System Integration
Mechatronics – Integration of Power Electronics and Actuators
Thermal Management
Passive Integration Concepts
Embedded Power Systems
Electromagnetic Interference
Advanced Filter Designs
Technologies for High Temperature Applications
New Materials and Components for Hybrid Integration
Sensor and Driver Developments
Design for Reliability – Virtual Qualification
Design Methods and Tools
Life Cycle Costs (LCC) – Cost Analysis, Maintenance, Repair, Recycling, System partitioning
2. High and Medium Power Modules
Advanced Module Concepts
System Partitioning
3. Monolithic Power Electronic System Integration
Advanced Monolithic Power Electronic Systems
Technologies for “Systems-on-Chip”
SOI-Technologies
Chip Interfacing Technologies (Bonding)

Dieser Tagungsband enthält folgende Beiträge, die Sie einzeln als PDF-Download erwerben können:


1	Robustness Validation – An Improved Qualification Method for Semiconductor Devices in Automotive Autoren: Keller, Helmut; Keller, Helmut

2	Predictive Reliability, Prognostics and Risk Assessment for Power Modules Autoren: Bailey, C.; Lu, H.; Yin, C.; Ridout, S.

3	Lifetime Modeling and Prediction of Power Devices Autoren: Ciappa, Mauro

4	Model for Power Cycling lifetime of IGBT Modules – various factors influencing lifetime Autoren: Bayerer, Reinhold; Herrmann, Tobias; Licht, Thomas; Lutz, Josef; Feller, Marco

5	Proposition of IGBT modules assembling technologies for aeronautical applications Autoren: Zéanh, A.; Zéanh, A.; Zéanh, A.; Zéanh, A.; Dalverny, O.; Karama, M.; Woirgard, E.; Azzopardi, S.; Bouzourene, A.; Casutt, J.; Mermet-Guyennet, M.

6	Test System for the Reliability Management of Power Modules Autoren: Wernicke, Thies; Middendorf, Andreas; Dieckerhoff, Sibylle; Guttowski, Stephan; Reichl, Herbert

7	Power cycling induced failure mechanisms in the viewpoint of rough temperature environment Autoren: Lutz, J.; Herrmann, T.; Feller, M.; Bayerer, R.; Licht, T.; Amro, Raed

8	DBC substrate based EMC Transfer Molded Power Module Autoren: Lee, Keunhyuk; Jeon, Oseob; Lim, Seungwon; Park, Sungmin; Lee, Byoungok; Lee, Taekkeun

9	Built-in EMC for integrated power electronics systems Autoren: Schanen, Jean-Luc; Roudet, James

10	EMC in Power Electronics Autoren: Hoene, Eckart

11	Design and assembly of power semiconductors with double-sided water cooling Autoren: Schneider-Ramelow, Martin; Baumann, Thomas; Hoene, Eckart

12	Compact thermal model for the analysis of power devices thermal interactions Autoren: Bruno, Allard; Xavier, Jordà; Sabrine, M’Rad; Xavier, Perpinya

13	Thermal Power Density Barriers of Converter Systems Autoren: DROFENIK, Uwe; KOLAR, Johann W.

14	Review on Highly Integrated Solutions for Power Electronic Devices Autoren: Schulz-Harder, Jürgen

15	The Road to the Next Generation Power Module – 100% Solder Free Design Autoren: Scheuermann, Uwe; Beckedahl, Peter

16	Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment Autoren: Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan; Calata, Jesus N.; Calata, Jesus N.; Lei, Thomas G.; Lei, Thomas G.

17	3D Integration of Power Semiconductor Devices based on Surface Bump Technology Autoren: Mermet-Guyennet, Michel; Castellazzi, Alberto; Lasserre, Philippe; Saiz, José

18	A Study of Pressed Contact Technology on IGBT Devices between -40°C and +200°C Autoren: Banckaert, Guillaume; Mermet-Guyennet, Michel; Castellazzi, Alberto

19	An Investigation of Gate Drive Circuits and Losses in Power Devices of Multilevel Converters for Circuit Integration to Realize High Output Power Density Autoren: Kamaga, Masamu; Kamaga, Masamu; Sung, Kyungmin; Sung, Kyungmin; Hayashi, Yusuke; Sato, Yukihiko; Sato, Yukihiko; Ohashi, Hiromichi

20	High Efficiency Isolated Half-Bridge Gate Driver with PCB Integrated Transformer Autoren: Zeltner, Stefan

21	Low-cost digital control for SMPS integration Autoren: Lin-Shi, Xuefang; Allard, Bruno; Guo, Shuibao; Gao, Yanxia

22	Optimisation of DC-link capacitors Autoren: Kriegel, K.; Otto, J.; Rackles, J.

23	Duplex pulse controlled inverter with a film capacitor DC-link Autoren: Kleimaier, A.; Hoffmann, B.; Scherer, A.

24	Polymer bonded soft magnetic particles for planar inductive devices Autoren: Egelkraut, Sven; März, Martin; Ryssel, Heiner

25	Printed circuit board integrated multi-output transformer Autoren: Waffenschmidt, Eberhard

26	DCDC Converter for Hybrid Vehicle Applications Autoren: Schmidt, Wolfgang

27	Modularity bridging future Power Electronics in automotive volume applications – speeding up HEV applications Autoren: Rekofsky, Andreas; Brey, Roland; Thoben, Markus; Mertens, Christian; Löcher, Günter

28	Automotive DC-DC Converter Designed for High Power-Density and High Efficiency Autoren: Pavlovsky, Martin; Tsuruta, Yukinori; Kawamura, Atsuo

29	Influence of Parasitic Elements on the Commutation of a Resonant Matrix Converter Autoren: Schulz, Sebastian; Ecklebe, Andreas; Lindemann, Andreas

30	System Design of Compact Low-Power Inverters for the Application in Photovoltaic AC-Modules Autoren: Sahan, Benjamin; Henze, Norbert; Engler, Alfred; Zacharias, Peter; Licht, Thomas

31	Cost Reduction of PV-Inverters with SiC-DMOSFETs Autoren: Burger, Bruno; Kranzer, Dirk; Stalter, Olivier

32	Two-Stage Power Architecture for Voltage Regulator Application based on Coupled Magnetic Structure Autoren: González, M. C.; Alou, P.; García, O.; Cobos, J. A.; Visairo-Cruz, H.

33	VHDL-AMS simulation of integrated power systems: a unified solution for multi-domain multi-level abstraction analysis Autoren: Castellazzi, Alberto; Ciappa, Mauro; Mermet-Guyennet, Michel; Fichtner, Wolfgang

34	Compact Power Electronics due to SiC Devices Autoren: Friedrichs, Peter

35	Normally-On devices and circuits, SiC and high temperature: using SiC JFETs in power converters Autoren: Bergogne, Dominique; Morel, Hervé; Tournier, Dominique; Allard, Bruno; Planson, Dominique; Raynaud, Christophe; Lazar, Mihai

36	Issues and Options for Planar Packaging of High-Voltage SiC Diodes Autoren: Xu, Jing; Ngo, Khai D. T.; Calata, Jess; Wyk, J. D. van; Wyk, J. D. van

37	SiC JFET for high temperature power switches Autoren: Bergogne, Dominique; Tournier, Dominique; Mousa, Rami; Koor, Mohsen Shafiee; Planson, Dominique; Morel, Hervé; Allard, Bruno

38	Current limiting with SiC JFET structures Autoren: Tournier, Dominique; Bergogne, Dominique; Hamoud, Asif; Planson, Dominique; Mousa, Rami; Morel, Hervé; Allard, Bruno; Brevet, Olivier

39	600V Converter/Inverter/Brake (CIB) - Module with integrated SOI Gate Driver IC for Medium Power Applications Autoren: Vogler, B.; Roßberg, M.; Herzer, R.; Reusser, L.

40	Life time prediction and design for reliability of Smart Power devices for automotive exterior lighting Autoren: letor, Romeo; Russo, Sebastiano; Crisafulli, Roberto

41	System integration using advanced power semiconductors Autoren: Deboy, Gerald

42	A high number of phases enables high frequency techniques and a better thermal management in medium power converters Autoren: Garcia, O.; Alou, P.; Oliver, J. A.; Zumel, P.; Cobos, J. A.

43	System integration approach for high power density drives Autoren: Popovic-Gerber, J.; Gerber, M.; Ferreira, J. A.

44	An Integrated Electronic Ballast for High Intensity Discharge (HID) Lamps Autoren: Jiang, Yan; Lee, Fred C.; Wyk, J. D. van; Wyk, J. D. van; Liang, Yan; Liu, Wenduo

45	Current Sensor Dedicated for High Temperature Integrated Power Electronics Autoren: Grecki, Filip; Koczara, Wlodzimierz; Iwanski, Grzegorz; Lastowiecki, Jozef

46	IPEM-Based Power Electronics System Integration Autoren: Boroyevich, Dushan; Fred. C. Lee; Wyk, J. Daan van; Lu, Guo-Quan; Scott, Elaine P.; Xu, Ming; Burgos, Rolando; Wang, Fred; Jahns, Thomas M.; Lipo, Thomas A.; Lorenz, Robert D.; Chow, T. Paul

47	The ECPE Roadmap Initiative Autoren: Harder, Thomas; Lorenz, Leo

48	Power Electronics Technology Roadmaps – a Bottom-up Approach Autoren: Wolfgang, Eckhard; Harder, Thomas

49	Automotive Power Electronics Roadmap Autoren: Kolar, J. W.; März, M.

50	Power Electronics Technology Roadmap: High Frequency Power Supplies (P<1kW) Autoren: Cobos, José A.; O’Mathuna, Cian

51	ECPE Power Electronics Research and Technology Roadmaps: Team No.5: High Frequency Power Conversion > 1kW Autoren: Reimann, Tobias

52	Base Plate Shape Optimisation for High-Power IGBT Modules Autoren: Sommer, Johann-Peter; Bayerer, Reinhold; Tschirbs, Roman; Michel, Bernd

53	Non-Destructive Experimental Investigation about RBSOA in High Power IGBT Modules Autoren: Busatto, Giovanni; Abbate, Carmine; Abbate, Benedetto; Iannuzzo, Francesco

54	Extraction of Efficient Thermal Models for Life Limiting Interfaces in Power Modules Autoren: Musallam, Mahera; Johnson, C. Mark

55	Direct Substrate Cooling of Power Electronics Autoren: Skuriat, Robert; Johnson, C. M.

56	Cooling of Insulated Assemblies Autoren: Förster, Stefan; Lindemann, Andreas

57	A digital control technique for high-performances DC-DC converters Autoren: Boscaino, V.; Capponi, G.; Blasi, G. M. di; Livreri, P.; Marino, F.

58	Comparative study of three transformer concepts for high current dual active bridge converters Autoren: Wang, Y.; Roodenburg, B.; Haan, S. W. H. de

59	Adjustable Speed Generation System with Axial Flux Permanent Magnet Generator Autoren: Koczara, Wlodzimierz; Brown, Neil L.; Al-Tayie, Jawad; Khayat, Nazar Al; Seliga, Robert; Ernest, Emil; Krasnodebski, Artur

60	EMS Analysis on Digital Pulse Width Modulators Autoren: Orietti, Enrico; Saggini, Stefano; Mattavelli, Paolo; Spiazzi, Giorgio

61	Robustness Analysis of DC Distributed Power Systems by Means of Behavioral DC-DC Converter Models Autoren: Oliver, J. A.; Prieto, R.; Laguna, L.; Cobos, J. A.

62	The ESBT(R) (Emitter-Switched Bipolar Transistor): a new monolithic power actuator technology devoted to high voltage and high frequency applications Autoren: Ronsisvalle, Cesare; Enea, Vincenzo

63	Trade-off between energy savings and execution time applying DVS to a microprocessor Autoren: Vasic, Miroslav; García, Oscar; Alou, Pedro; Oliver, Jesús A.; Cobos, José A.

64	Analysis of STI Thin-SOI LDMOS transistors for Smart Power and high frequency applications Autoren: Cortes, I.; Fernandez-Martinez, P.; Flores, D.; Hidalgo, S.; Rebollo, J.

65	Performance Comparison of a Buck Converter Using Shielded-Substrate and Co-Packaged Planar Inductors Autoren: Lim, M. H. F.; Gilham, D.; Wyk, J. D. van; Wyk, J. D. van; Lee, F. C.; Ngo, K. D. T.

66	PEEC-Based Numerical Optimization of Compact Radial Position Sensors for Active Magnetic Bearings Autoren: MÜSING, Andreas; ZINGERLI, Claudius; IMOBERDORF, Philipp; KOLAR, Johann W.

ETG ; ECPE

CIPS 2008 (ETG-FB 111)

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