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Rubrik:
Proceedings
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23rd European Mask and Lithography Conference, Lectures held at the GMM Conference January 22 - 26, 2007 in Grenoble, France, Proceedings of SPIE in cooperation with VDE/VDI/ GMM
2007, CD-ROM
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| 1 |
Optimization of Source Distribution for half-wavelength DOEAutoren:
Horiguchi, Ryuji; Toyama, Nobuhito; Itoh, Kimio; Yoshida, Kouji; Kurihara, Masaaki
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| 2 |
Revisiting Mask Contact Hole MeasurementsAutoren:
Higuchia, Masaru; Gallagher, Emily; Ceperley, Daniel; Brunner, Timothy; Bowley, Reg; McGuire, Anne
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| 3 |
Mask Industry Assessment Trend Analysis 2006Autoren:
Shelden, Gilbert; Marmillion, Patricia
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| 4 |
Current status of water immersion lithography and prospect of higher index methodAutoren:
Owa, Soichi; Nakano, Katsushi; Nagasaka, Hiroyuki; Kohno, Hirotaka; Ohmura, Yasuhiro; McCallum, Martin
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| 5 |
Contact angles and liquid loss behavior of high index fluidsAutoren:
Harder, Paul M.; Shedd, Timothy A.
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| 6 |
Characteristics optimization of mask materials for Hyper-NA lithographyAutoren:
Morikawa, Yasutaka; Suto, Takanori; Nagai, Takaharu; Inazuki, Yuichi; Adachi, Takashi; Kitahata, Yasuhisa; Yokoyama, Toshifumi; Toyama, Nobuhito; Mohri, Hiroshi; Hayashi, Naoya
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| 7 |
Investigation of Hyper-NA Scanner Emulation for Photomask CDU PerformanceAutoren:
Poortinga, Eric; Scheruebl, Thomas; Conley, Will; Sundermann, Frank
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| 8 |
Investigation on Immersion Defectivity Root CauseAutoren:
Farys, V.; Gaugiran, S.; Cruau, D.; Mestadi, K.; Warrick, S.; Benndorf, M.; Feilleux, R.; Sourd, C.
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| 9 |
Programmed Defects Study on masks for 45nm Immersion Lithography using the novel AIMS(TM)45-193iAutoren:
Scherübl, Thomas; Dürr, Arndt C.; Böhm, Klaus; Birkner, Robert; Richter, Rigo; Strößner, Ulrich
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| 10 |
Production Evaluation of Automated Reticle Defect Printability Prediction ApplicationAutoren:
Howard, William B.; Pomeroy, Scott; Moses, Raphael; Thaler, Thomas
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| 11 |
A Cost Model Comparing Image Qualification Using Test Wafer and Direct Mask InspectionAutoren:
Bhattacharyya, Kaustuve; Hazari, Viral; Sutherland, Doug; Higashiki, Tatsuhiko
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| 12 |
Electron beam lithography simulation based on a single convolution approach – Application for sub-45nm nodesAutoren:
Le denmat, J. C.; Manakli, S.; Icard, B.; Soonekindt, C.; Minghetti, B.; Le borgne, O.; Pain, L.
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| 13 |
Aerial Imaging Performance of ALTA4700 Printed Mask for 130nm Design RuleAutoren:
Hsu, Jyh Wei; Wu, Chun Hung; Cheng, Kevin
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| 14 |
?omplete set of the special process equipment for the defect-free production of reticlesAutoren:
Avakaw, Syarhei; Iouditski, Valerian; Pushkin, Leanid; Tsitko, Alena
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| 15 |
Mask qualification strategies in a wafer fabAutoren:
Jaehnert, Carmen; Kunowski, Angela
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| 16 |
Damage free megasonic resonance cleaning for the 45nm design ruleAutoren:
Osbome, Steve; Baudiquez, Valentine; Rode, Thomas; Chovino, Christian; Takahashi, Hidekazu; Woster, Eric
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| 17 |
Resist and BARC organic outgassing measured by TD-GCMS: Investigation during the exposure or the bake steps of the lithographic processAutoren:
Tiron, Raluca; Sourd, Claire; Fontaine, Hervé; Cetre, Sylviane; Mortini, Bénédicte
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| 18 |
Effects of heat curing on adhesive strength between microsized SU-8 and Si substrateAutoren:
Ishiyama, C.; Sone, M.; Higo, Y.
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| 19 |
Evaluation of an alternative UV-NIL mold fabrication processAutoren:
Voisin, P.; Voisin, P.; Voisin, P.; Leveder, T.; Zelsmann, M.; Gourgon, C.; Boussey, J.
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| 20 |
New Approach for Defect Inspection on Large Area MasksAutoren:
Scheuring, Gerd; Döbereiner, Stefan; Hillmann, Frank; Falk, Günther; Brück, Hans-Jürgen
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| 21 |
Accelerating Physical Verification Using STPRL: a Novel Language for Test Pattern GenerationAutoren:
Nouh, Ahmed
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| 22 |
Birefringence variation of quartz substrates during mask processAutoren:
Morikawa, Yasutaka; Kitahata, Yasuhisa; Yokoyama, Toshifumi; Yokoyama, Toshifumi; Kikuchi, Toshiharu; Kawaguchi, Atsushi; Ohkubo, Yasushi
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| 23 |
A novel model building flow for the simulation of proximity effects of mask processesAutoren:
Mas, Jonathan; Mittermeier, Engelbert
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| 24 |
Focused Electron Beam Induced Deposition of DUV transparent SiO2Autoren:
Perentes, Alexandre; Hoffmann, Patrik; Munnik, Frans
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| 25 |
Actinic inspection of sub-50 nm EUV mask blank defectsAutoren:
Lin, Jingquan; Weber, Nils; Maul, Jochen; Rott, Karsten; Hendel, Stefan; Merkel, Michael; Schoenhense, Gerd; Kleineberg, Ulf
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| 26 |
Improved CD uniformity for advanced masks using the Sigma7500 pattern generator and ProcessEqualizer(TM)Autoren:
Eklund, Robert; Österberg, Anders; Hellgren, Jonas; Fosshaug, Hans; Karlin, Tord; Newman, Tom
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| 27 |
Time Resolved Evolution of the Etch BiasAutoren:
Nesladek, Pavel; Paul, Jan
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| 28 |
OPC Structures for Maskshops Qualification for the CMOS65nm and CMOS45nm NodesAutoren:
Sundermann, Frank; Trouiller, Yorick; Urbani, Jean-Christophe; Couderc, Christophe; Belledent, Jérôme; Borjon, Amandine; Foussadier, Franck; Gardin, Christian; LeCam, Laurent; Rody, Yves; Saied, Mazen; Yesilada, Emek; Martinelli, Catherine; Wilkinson, Bill; Vautrin, Florent; Morgana, Nicolo; Robert, Frederic; Montgomery, Patrick; Kerrien, Gurwan; Planchot, Jonathan; Farys, Vincent; Maria, Jean-Luc Di
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| 29 |
Innovative Application of the RCWA Method for the Ultra-Sensitive Transmittance-Based CD Measurements on Phase-Shift MasksAutoren:
Gray, Alexander; Lam, John C.; Chen, Stanley
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| 30 |
The Effect of Intra-field CD Uniformity Control (CDC) on Mask BirefringenceAutoren:
Ben-Zvi, Guy; Zait, Eitan; Krugliakov, Vladimir; Dmitriev, Vladimir; Gottlieb, Gidi; Oshemkov, Sergey
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| 31 |
Metrology capabilities and performance of the new DUV Scatterometer of the PTBAutoren:
Wurm, Matthias; Bodermann, Bernd; Pilarski, Frank
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| 32 |
First Measurement Data Obtained On The New Vistec LMS IPRO4Autoren:
Adam, Dieter; Boesser, Artur; Heiden, Michael; Bender, Jochen; Laske, Frank; Röth, Klaus-Dieter
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| 33 |
Electron Beam Direct Write – Shaped Beam Overcomes Resolution ConcernsAutoren:
Stolberg, Ines; Pain, Laurent; Kretz, Johannes; Boettcher, Monika; Doering, Hans-Joachim; Gramss, Juergen; Hahmann, Peter
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| 34 |
Data Preparation for EBDWAutoren:
Thrum, Frank; Kretz, Johannes; Lutz, Tarek; Keil, Katja; Arndt, Christian; Choi, Kang-Hoon; Baetz, Ullrich; Belic, Nikola; Lemke, Melchior; Denker, Ulrich; Gramss, Juergen; Kliem, Karl-Heinz
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| 35 |
Masks for Flash Memory Gates for the 45nm node: Binary or attenuated?Autoren:
Setten, Eelco van; Engelen, Andre; Finders, Jo; Dusa, Mircea
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| 36 |
Electrical Test Structures for the Characterisation of Optical Proximity CorrectionAutoren:
Tsiamis, Andreas; Smith, Stewart; McCallum, Martin; Hourd, Andrew C.; Stevenson, J. Tom M.; Waltona, Anthony J.
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| 37 |
Improvement of Model Kernel Representation in Process Simulation by Taking Pattern Correlation into accountAutoren:
Li, Jianliang; Yan, Qiliang; Melvin III, Lawrence S.
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| 38 |
Investigation of capillary bridges growth in NIL processAutoren:
Landis, Stefan; Leveder, Tanguy; Chaix, Nicolas; Gourgon, Cecile
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| 39 |
Electron beam directed repair of fused silica imprint templatesAutoren:
Schmid, Gerard M.; Resnick, Douglas J.; Fettig, Rainer; Edinger, Klaus; Young, Steven R.; Dauksher, William J.
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| 40 |
Challenges of residual layer minimisation in thermal nanoimprint lithographyAutoren:
Bogdanski, Nicolas; Wissen, Matthias; Möllenbeck, Saskia; Scheer, Hella-Christin
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| 41 |
Hybrid nanoimprint for micro-nano mixture structureAutoren:
Okuda, Keisuke; Niimi, Naoyuki; Kawata, Hiroaki; Hirai, Yoshihiko
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| 42 |
Calibration of CD mask standards for the 65 nm node: CoG and MoSiAutoren:
Richter, J.; Heins, T.; Liebe, R.; Bodermann, B.; Diener, A.; Bergmann, D.; Frase, C. G.; Bosse, H.
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| 43 |
Characterization of photo masks by X3D AFMAutoren:
Froeck, C.; Ho, M.
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| 44 |
An Empirical Approach Addressing the Transfer of Mask Placement Errors During ExposureAutoren:
Alles, B.; Simeon, B.; Cotte, E.; Wandel, T.; Schulz, B.; Seltmann, R.
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| 45 |
Achieving Mask Order Processing Automation, Interoperability and Standardization based on P10Autoren:
Rodriguez, B.; Filies, O.; Sadran, D.; Tissier, Michel; Albin, D.; Stavroulakis, S.; Voyiatzis, E.
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| 46 |
Benchmark and gap analysis of current mask carriers vs future requirements: example of the carrier contaminationAutoren:
Fontaine, H.; Davenet, M.; Cheung, D.; Hoellein, I.; Richsteiger, P.; Dejaune, P.; Torsy, A.
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| 47 |
Reticle Haze: An Industrial ApproachAutoren:
Gough, Stuart; Gérard, Xavier; Bichebois, Pascal; Roche, Agnès; Sundermann, Frank; Guyader, Véronique; Bièron, Yann; Galvier, Jean; Nicoleau, Serge
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| 48 |
Fast near field simulation of optical and EUV masks using the waveguide methodAutoren:
Evanschitzky, Peter; Erdmann, Andreas
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| 49 |
EUV mask infrastructure challengesAutoren:
Wurm, Stefan; Seidel, Phil; Peski, Chris Van; He, Long; Han, Hakseung; Kearney, Pat; Cho, Wonil
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| 50 |
Enabling Defect-free Masks for Extreme Ultraviolet LithographyAutoren:
Jeon, Chan-Uk; Kearney, Patrick; Ma, Andy; Randive, Rajul; Reiss, Ira; Beier, Bernd; Uno, Toshiyuki
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| 51 |
Hydrogenated water application for particle removal on EUV mask blank substratesAutoren:
Eichenlaub, Sean; Rastegar, Abbas; Dress, Peter; Xu, Fei; Marmillion, Pat
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| 52 |
Assessment of EUV reticle blank availability enabling the use of EUV tools today and in the futureAutoren:
Jonckheere, R.; Lorusso, G. F.; Goethals, A.; Ronse, K.; Hermans, J.; Ruyter, R. De
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| 53 |
Predicting and Correcting for Image Placement Errors during the Fabrication of EUVL MasksAutoren:
Engelstad, R.; Sohn, J.; Mikkelson, A.; Nataraju, M.; Turner, K.
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| 54 |
Status Report on EUV Source Development and EUV Source Applications in EUVLAutoren:
Bakshi, Vivek; Lebert, Rainer; Jägle, Bernhard; Wies, Christian; Stamm, Uwe; Kleinschmidt, Juergen; Schriever, Guido; Ziener, Christian; Corthout, Marc; Pankert, Joseph; Bergmann, Klaus; Neff, Willi; Egbert, André; Gustafson, Debbie
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| 55 |
Surface chemistry of Ru: relevance to optics lifetime in EUVLAutoren:
Wasielewski, R.; Yakshinskiy, B. V.; Hedhili, M. N.; Ciszewski, A.; Madey, T. E.
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| 56 |
Progress in EUV Photoresist TechnologyAutoren:
Wallow, Thomas I.; Kim, Ryoung-han; Fontaine, Bruno La; Naulleau, Patrick P.; Anderson, Chris N.; Sandberg, Richard L.
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| 57 |
Quantitative Measurement of EUV Resist OutgassingAutoren:
Denbeaux, Greg; Garg, Rashi; Waterman, Justin; Mbanaso, Chimaobi; Netten, Jeroen; Brainard, Robert; Fan, Yu-Jen; Yankulin, Leonid; Antohe, Alin; DeMarco, Kevin; Jaffe, Molly; Waldron, Matthew; Dean, Kim
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