|
Rubrik: Proceedings
- Allgemeine Proceedings
|
|||
Barcelona, Spain, April 9-10, 2008, 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICS and Electronic Components
2008, 570 Seiten, DIN A4, gebunden, |
|
||
Getting smaller and smarter are the major challenges for research and development in Europe and worldwide. A multitude of technologies, materials and processes require the right, optimal combination for bridging the gap between the nanometer scale and the customers macro world. A main focus in microsystems or MEMS development will lie on integrated smart systems which are able to sense and diagnose, describe and qualify a special situation. In most cases they are able to interface, interact and communicate with their environment and with other smart systems. With the Smart Systems Integration Conference 2008 we try to show a snap shot of the European research work on this field. Scientists from industry and institutes will show certain ways for creating new smart systems, their ideas for smart technologies as well as the intelligent combination of materials and processes for a new age in smart systems integration.
|
|
| 1 |
European Research in Micro-Nano-Technology and Systems: Opportunities in Framework Programe 7Autoren:
Albuquerque, Augusto de
|
| 2 |
Recent advancements on semiconductor radiation sensors for digital mammographyAutoren:
Lozano, Manuel
|
| 3 |
From MEMS to Smart Systems IntegrationAutoren:
Finkbeiner, Stefan
|
| 4 |
MEMS based inertial measurement unit for attitude and heading reference systemsAutoren:
Bartholomeycz, J.; Zimmermann, S.; Breng, U.; Gutmann, W.; Hafen, M.; Handrich, E.; Huber, M.; Kempfer, U.; Kopmann, H.; Kunz, J.; Leinfelder, P.; Ohmberger, R.; Probst, U.; Ruf, M.; Spahlinger, G.; Rasch, A.; Straub-Kalthoff, J.; Stroda, M.; Stumpf, K.; Weber, C.; Zimmermann, M.; Geiger, W.
|
| 5 |
New High Resolution Optical Incremental Rotary EncoderAutoren:
Mayer, V.; Schneider, M.; Seybold, J.; Botzelmann, T.; Fritz, K.-P.; Kück, H.
|
| 6 |
Fully-Integrated wireless CMOS smart sensorAutoren:
Segura-Quijano, Fredy; Sacristán, Jordi; García-Canton, Jesús; Oses, Teresa; Baldi, Antonio
|
| 7 |
A readout circuit for remote interrogation of capacitance transducersAutoren:
Nowak, Michel; Delorme, Nicolas; Colinet, Eric; Jacquemod, Gilles; Conseil, François
|
| 8 |
Cost-Driven Design of Smart Micro SystemsAutoren:
Niedermayer, Michael; Hefer, Jan; Reichl, Herbert; Guttowski, Stephan
|
| 9 |
Approaches of local stress measurement on microsystem devicesAutoren:
Vogel, Dietmar; Auerswald, Ellen; Gollhardt, Astrid; Luczak, Falk; Sabate, Neus; Michel, Bernd
|
| 10 |
Novel Stress Measurement System for Evaluation of Package Induced StressAutoren:
Kittel, Hartmut; Endler, Stefan; Osterwinter, Heinz; Oesterle, Sonja; Schindler-Saefkow, Florian
|
| 11 |
Long-Term Performance of Ultrasonic Transducers Used for Energy and Data TransmissionAutoren:
Ngo, Luong van; Kluge, Martin; Sabater, Jordi; Schalk, Josef; Seidel, Helmut; Schmid, Ulrich
|
| 12 |
Reliability Improvement in Smart Systems IntegrationAutoren:
Hertl, Michael; Lecomte, Jean-Claude; Weidmann, Diane
|
| 13 |
Microsecurity and Nanosecurity – Security Research Using the Advantages of Smart System IntegrationAutoren:
Michel, Bernd; Winkler, Thomas
|
| 14 |
Application of high-resolution X-ray microscopy to image backend-of- line structuresAutoren:
Zschech, Ehrenfried; Braun, Stefan; Yun, Wenbing
|
| 15 |
Smart Micromachined Ultrasonic Probe with advanced imaging performancesAutoren:
Meynier, Cyril; Meynier, Cyril; Legros, Mathieu; Ferin, Guillaume; Certon, Dominique; Nguyen-Dinh, An; Dufait, Rémi
|
| 16 |
Improved methods of system integration for MEMS-based laser projection systemsAutoren:
Scholles, Michael; Frommhagen, Klaus; Gerwig, Christian; Grueger, Heinrich; Knobbe, Jens; Lakner, Hubert; Schlebusch, Dirk; Schwarzenberg, Markus; Vogel, Uwe
|
| 17 |
Monolithic integration of MEMS resonators in a 0.35µm CMOS technology for gravimetric sensor and radiofrequency applicationsAutoren:
Abadal, Gabriel; Teva, Jordi; Verd, Jaume; Torres, Francesc; López, Joan Lluis; Uranga, Arantxa; Esteve, Jaume; Pérez-Murano, Francesc; Barniol, Núria
|
| 18 |
MEMS Package in a Harsh Environment for Aeronautic ApplicationsAutoren:
Friedberger, Alois; Gradolph, Christian; Klettner, Florian; Müller, Gerhard; Wilde, Jürgen
|
| 19 |
Advanced Adhesives based on Carbon Nanotube TechnologyAutoren:
Fecht, Hans-Jörg; Leson, Andreas; Michel, Bernd; Werner, Matthias
|
| 20 |
Integration of optical and microfluidic functions in a hollow waveguide platformAutoren:
McNie, Mark; Jenkins, Michael; Wilkinson, Alan-Shaun; Turner, Andrew; Durante, Guido Spinola; Harvey, Tom; Cox, Timothy; Bosshard, Christian; Janus, Pawel
|
| 21 |
3D Wafer Level System Integration – Requirements & TechnologiesAutoren:
Klumpp, A.; Wolf, M. J.; Ramm, P.; Wunderle, B.; Reichl, H.
|
| 22 |
Ultra small system-in-package for medical applicationsAutoren:
Couderc, Pascal; Val, Christian
|
| 23 |
Batch Fabrication Methods for Active Polymer MicrosystemsAutoren:
Grund, Thomas; Kohl, Manfred
|
| 24 |
Implantable Packaging Technique Featuring Through Wafer Interconnects and Low Temperature Direct BondAutoren:
Lee, James
|
| 25 |
Waferbond technologies and quality assessmentAutoren:
Wiemer, Maik; Frömel, Jörg; Geßner, Thomas; Geßner, Thomas
|
| 26 |
Electromagnetic inertial microgenerators for vibrational energy scavenging: Implementation of a Si technology based modular process for optimised devicesAutoren:
Fondevilla, Núria; Serre, Christophe; Martínez, Susanna; Pérez-Rodríguez, Alejandro; Morante, Joan Ramón; Martincic, Emile; Montserrat, Josep; Jaume Esteve
|
| 27 |
Wearable self-powered wireless devices with thermoelectric energy scavengersAutoren:
Leonov, Vladimir; Gyselinckx, Bert; Hoof, Chris Van; Torfs, Tom; Yazicioglu, Refet Firat; Vullers, Ruud J. M.; Fiorini, Paolo
|
| 28 |
An electromagnetic energy harvester for low frequency excitationAutoren:
Hohlfeld, Dennis; Vullers, Ruud; Boeck, Jo de
|
| 29 |
Wireless power transmission for RF-MEMS devices integrated into large-scale radiating aperturesAutoren:
Dussopt, Laurent
|
| 30 |
Presentation of Platforms for Wireless Advanced Networks of Sensors for aeronautics applicationAutoren:
Moreau, Katell; Rouet, Vincent
|
| 31 |
Fabrication of nanomechanical sensors monolithically integrated on CMOS by full wafer nanostencil lithographyAutoren:
Arcamone, Julien; Boogaart, Marc A F van den; Serra-Graells, Francesc; Fraxedas, Jordi; Brugger, Jürgen; Pérez-Murano, Francesc
|
| 32 |
Laser machining of thin films on top of flexible substrate carriersAutoren:
Petsch, Tino; Hänel, Jens; Keiper, Bernd; Bleul, Karsten
|
| 33 |
INKtelligent printing of metal and metal alloys for sensor structuresAutoren:
Maiwald, M.; Günther, B.; Ruttkowski, V.; Werner, C.; Müller, M.; Godlinski, D.; Wirth, I.; Zöllmer, V.; Busse, M.
|
| 34 |
Smart Power SoC: Technology Challenges and InnovationsAutoren:
Tack, Marnix; Moens, Peter; Gillon, Renaud; Janssens, Johan
|
| 35 |
MEMS-based spectroscopic ellipsometryAutoren:
Saupe, Ray; Otto, Thomas; Gruska, Bernd; Weiss, Alexander; Stock, Volker; Gessner, Thomas
|
| 36 |
Implantable brain stimulator for epilepsy seizure inhibitAutoren:
Boero, Cristina; Mazza, Marco; Ionescu, Adrian M.; Bertrand, Daniel
|
| 37 |
An all-polymer microfluidic system for protein sensing applications with integrated low-cost pumps, surface modification and sealingAutoren:
Nestler, Joerg; Hiller, Karla; Gessner, Thomas; Gavillet, Jérôme; Auerswald, Janko; Knapp, Helmut; Griffiths, Christian; Bigot, Samuel; Beckers, Marie-Claire
|
| 38 |
COB vs. Flip Chip - A technology and cost comparison based on a real productAutoren:
Kloeser, Joachim
|
| 39 |
A Smartsystem based on a Lab on a Card for detection of Salmonella spp. In faecesAutoren:
Agirregabiria, M.; Olabarria, G.; Verdoy, L.; Tijero, M.; Berganzo, J.; Fernandez, L. J.; Mayora, K.; Ruano-López, J. M.
|
| 40 |
Tunable/Switchable Thin Film Bulk Acoustic Wave (BAW) resonator using thin electrostrictive film under oe bias for GHz applicationsAutoren:
lvira, Brice; Reinhardt, Alexandre; Volatier, Alexandre; Defay, Emmanuel; Aid, Marc; Ancey, Pascal
|
| 41 |
A 5-bit K-Band MEMS Phase Shifter in a 1-Level Plastic PackageAutoren:
Bastioli, S.; Maggio, F. Di; Farinelli, P.; Giacomozzi, F.; Margesin, B.; Ocera, A.; Pomona, I.; Russo, M.; Sorrentino, R.
|
| 42 |
Ultrasonic micro hot embossing of polymers exemplified by a micro thermal flow sensorAutoren:
Khuntontong, Puttachat; Blaser, Thomas; Schomburg, Werner Karl
|
| 43 |
Liquid chromatography miniaturised system for agrofood applicationsAutoren:
Benvenuto, Antonella; Lorenzelli, Leandro; Malfatti, Mattia; Francioso, Luca; Siciliano, Pietro; Vilà, Anna; Verrelli, Giorgio
|
| 44 |
Printing of UHF modulators on embedded silicon in semi-passive RFIDAutoren:
Nilsson, H-E.; Mattsson, C. G.; Sidén, J.; Geyer, U.
|
| 45 |
Hybrid Chip-Scale Integration of Inertial MEMS by Chip-to-Wafer Vacuum BondingAutoren:
Marenco, Norman; Kostner, Hannes; Reinert, Wolfgang; Hill, Gerhard
|
| 46 |
Smart System Integration, an option for a future MEMS-product managementAutoren:
Herrnsdorf, Johannes
|
| 47 |
MEMS markets and newapplicationsAutoren:
Mounier, Eric
|
| 48 |
From MST components to Smart System: example of IMUAutoren:
Bouchaud, Jérémie; Dixon, Richard
|
| 49 |
Microcantilever-based sensor array tor amine detection in agro-tood applicationsAutoren:
Adami, Andrea; Decarli, Massimiliano; Lorenzelli, Leandro; Guarnieri, Vittorio; Malfatti, Mattia; Apetrei, Constantin; Mendez, Maria Luz Rodriguez
|
| 50 |
Development and Characterization of Platinum Thin Films for Gas Analysis MicrosystemAutoren:
Dow, Ali Badar Alamin; Sklorz, Adam; Benecke, Wolfgang; Lang, Walter
|
| 51 |
Innovative micropower solutions for Wireless Autonomous Sensor NodesAutoren:
Altena, G.; Sterken, T.; Puers, R.; Vullers, R. J. M.; Pop, V.
|
| 52 |
From the flexible / rigid-flexible circuit board solution to the mechatronic 3D unitAutoren:
Bäcker, Dirk
|
| 53 |
Efficient Wireless powering of single-chip systemsAutoren:
Baldi, Antonio; Segura-Quijano, Fredy; García-Canton, Jesús; Sacristán, Jordi; Oses, Ma Teresa
|
| 54 |
A new method for wafer level integration of silicon components on LTCCAutoren:
Bartsch de Torres, H.; Fischer, M.; Gade, R.; Mach, M.; Müller, J.; Hoffmann, M.; Pawlowski, B.; Barth, S.
|
| 55 |
MICRO Machining Technologies for Non Silicon MaterialsAutoren:
Baum, Mario; Rota, Astrid; Sal, Natalie; Otto, Thomas; Gessner, Thomas
|
| 56 |
Integrated multi-domain modeling and simulation of complex 3D micro- and nanostructuresAutoren:
Bieniek, T.; Janczyk, G.; Janus, P.; Kociubinski, A.; Grabiec, P.; Szynka, J.
|
| 57 |
Sensors and Actuators Based on MicrocoilsAutoren:
Bolzmacher, Christian; Bauer, Karin
|
| 58 |
Development of a piston type condenser microphone for reconfigurable acoustic arraysAutoren:
Calaza, Carlos
|
| 59 |
Micro/nano integration of organic/inorganic hybrid nanostructures on the basis of molecular self-assembly and dielectrophoresisAutoren:
Csáki, Andrea
|
| 60 |
MiniMags – Microtechnical Challenges Miniaturizing Electro-Magnetic ValvesAutoren:
Dittrich, Lars; Kallenbach, Matthias; Hoffmann, Martin
|
| 61 |
Planarity Optimization of Spatial Light ModulatorsAutoren:
Duerr, Peter; Wolschke, Steffen; Ludewig, Thomas; Dauderstädt, Ulrike; Kunze, Detlef; Wagner, Michael; Lakner, Hubert
|
| 62 |
Tunable bio-doped sol-gel glasses for the fabrication of photonic sensorsAutoren:
Fernández-Sánchez, César; Cadarso, Victor J.; Darder, Margarita; Domínguez, Carlos; Llobera, Andreu
|
| 63 |
Novel test structures for stiction characterization by adhesion force measurementAutoren:
Friedrich, Thomas; Raudzis, Carsten; Müller-Fiedler, Roland; Bagdahn, Jörg
|
| 64 |
Closed Loop Controlled Liquid Dosing SystemAutoren:
Götz, Martin; Ashauer, Matthias; Storz, Matthias; Kleiser, Michael; Zengerle, Roland
|
| 65 |
Smart microscopic slide providing electro-acoustic actuation of a small fluidic sample and various microscopic illumination schemesAutoren:
Bonerz, Christian; Gruber, Matthias
|
| 66 |
Optoelectronic Sensors based on OLED-on-CMOSAutoren:
Vogel, Uwe; Kreye, Daniel; Reckziegel, Sven; Grüger, Heinrich; Pügner, Tino; Törker, Michael; Amelung, Jörg; Scholles, Michael
|
| 67 |
A Multilayer Process for the Connection of Fine-Pitch-Elements on Three-Dimensionally Molded Interconnect Devices (3D-MIDs)Autoren:
Leneke, Thomas; Majcherek, Soeren; Hirsch, Soeren; Schmidt, Bertram
|
| 68 |
Analysis of Thermomechanical Stress in Bare Die Assemblies on Polymer SubstratesAutoren:
Majcherek, Soeren; Leneke, Thomas; Hirsch, Soeren; Schmidt, Bertram
|
| 69 |
Technology of hybrid integration of silicon MEMS and CMOS structures using polymerAutoren:
Janus, P.; Grabiec, P.; Domanski, K.; Kociubinski, A.; Szmigiel, D.
|
| 70 |
Fabrication of a Low-Frequency Ultrasonic TransducerAutoren:
Jia, Chenping; Wiemer, Maik; Hiller, Karla; Otto, Thomas; Gessner, Thomas; Gessner, Thomas
|
| 71 |
Microsystems Engineering Solutions for Inductive Components with High AmpacityAutoren:
Kallenbach, Matthias; Mühlke, Christian; Hoffmann, Martin
|
| 72 |
Intelligent silicon substrates for a shorter microsystem design cycleAutoren:
Karttunen, Jani; Mäkinen, Jari; Tilli, Markku
|
| 73 |
A NEMS array for a signal to noise ratio improvement and mechanical filter designAutoren:
Kharrat, Chady; Colinet, Eric; Voda, Alina
|
| 74 |
Application of Higher Order Sensitivity FE Method for Parametric MEMS DesignAutoren:
Kolchuzhin, Vladimir; Doetzel, Wolfram; Mehner, Jan
|
| 75 |
Thermal mass flow sensor for measurement of liquids (water)Autoren:
Lange, Peter; Melani, Massimiliano; Bertini, Lorenzo; Marinis, Marco De
|
| 76 |
Multimedia SIM card testingAutoren:
Laqli, Rachid
|
| 77 |
Complex Miniaturized Analysis System for Nuclear Magnetic Resonance Spectroscopy of Nanoliter Amounts of Biological Sample MaterialAutoren:
Leidich, S.; Riemer, T.; Braun, M.; Kurth, S.; Gessner, T.; Gessner, T.
|
| 78 |
Smart multihop communication for wireless sensor networksAutoren:
Karakehayov, Zdravko; Andersen, Niels Lervad
|
| 79 |
Reliability Improvement of Sub 100 µm Lead Free FC Solder Joint by a Pre-bonding TechniqueAutoren:
Luo, Le; Lin, Xiaoqin
|
| 80 |
Minimizing the impact of fabrication tolerance on embedded filtersAutoren:
Fotheringham, Gerhard; Maaß, Uwe; Ndip, Ivan; Reichl, Herbert
|
| 81 |
802.15.4 Wireless Sensor NetworkAutoren:
Maglione, Alfredo; Battisti, Nicola
|
| 82 |
Integrated Microneedle Arrays and Assembly Techniques for Drug Delivery ApplicationsAutoren:
Mahadevan, Geetha; Selvaganapathy, Ponnambalam; Sheardown, Heather
|
| 83 |
Systemintegration for eletromechanical actuators in automobilesAutoren:
Maier, Johann
|
| 84 |
Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding ProcessAutoren:
Malecki, Krzysztof; Bock, Gernot; Hillmann, Gerhard; Friedel, Kazimierz
|
| 85 |
Broadband Parameters of Compact FT Spectrometer based on Fabry-Perot Interferometer Integrated with DetectorAutoren:
Manuilskiy, Anatoliy; Andersson, Henrik; Thungström, Göran; Nilsson, Hans-Erik
|
| 86 |
Time-dependent reliability of ultra-scaled CMOS devices and its impact on circuit performanceAutoren:
Martín-Martínez, J.; Gerardin, S.; Rodríguez, R.; Nafría, M.; Paccagnella, A.; Aymerich, X.; Ghidini, G.
|
| 87 |
Integration of micro-optical components for a blue ray DVD pickup systemAutoren:
Mohaupt, Matthias; Beckert, Erik; Eberhardt, Ramona; Tünnermann, Andreas
|
| 88 |
Evaluation of a low cost piezorresistive material for high resolution tactile sensorsAutoren:
Castellanos, Julián; Navas-González, Rafael; Ochoteco, Estíbalitz; Vidal-Verdú, Fernando
|
| 89 |
Highly integrated polymer-based technology platform for in-vitro diagnosticsAutoren:
Otto, T.; Nestler, J.; Morschhauser, A.; Schueller, M.; Gessner, T.; Krissler, J.; Ebling, F.; Wegener, M.; Grzesiak, A.; Burgard, M.; Brandenburg, A.; Sulz, G.; Nebling, E.; Hintsche, R.; Wirth, I.; Godlinski, D.; Tovar, G.; Weber, A.; Ehrentreich-Foerster, E.; Gajovic-Eichelmann, N.; Bier, F. F.
|
| 90 |
In-Situ Determination of Multiple Properties of Films Using Hot- Stage Optical Microscopy and Micromachined Test StructuresAutoren:
Pan, Chi Hsiang
|
| 91 |
Low Power Tracking System for Advanced Health MonitoringAutoren:
Rouet, Vincent; Venet, Julien
|
| 92 |
Selective Deposition of pH Sensitive Nanostructurated FilmsAutoren:
Zamarreño, Carlos R.; Goicoechea, Javier; Matias, Ignacio R.; Arregui, Francisco J.
|
| 93 |
Fabrication and characterization of a passive silicon-based direct methanol fuel cellAutoren:
Sabate, N.; Esquivel, J. P.; Santander, J.; Torres, N.; Gràcia, I.; Ivanov, P.; Fonseca, L.; Figueras, E.; Cané, C.
|
| 94 |
Package Induced Stress Simulation and Experimental VerificationAutoren:
Schindler-Saefkow, Florian; Wittler, Olaf; Schreier-Alt, Thomas; Kittel, Hartmut; Michel, Bernd
|
| 95 |
Design and Implementation ot a Micro Structure Printer tor Rapid Prototyping ot Microimplantable Medical DevicesAutoren:
Kraaijeveld, Leander; Schwarz, Markus
|
| 96 |
Test-structures for wafer level microsystems characterizationAutoren:
Shaporin, Alexey; Forke, Roman; Schmiedel, Ralf; Dötzel, Wolfram; Mehner, Jan; Billep, Detlef; Gessner, Thomas
|
| 97 |
Integration of an elasotmer in micromachining technologyAutoren:
Soulimane, S.; Charlot, S.; Bourrier, D.; Sudor, J.; Bancaud, A.; Gué, A.-M.; Camon, H.
|
| 98 |
Self-powered wireless sensor moduleAutoren:
Spies, Peter; Mateu, Loreto; Ebling, Dirk
|
| 99 |
Electron beam machining of microsystem productsAutoren:
Tanasie, Gheorghe; Böhm, Stefan; Bärtle, Jan; Löwer, Thorsten; Reiter, Andrea; Franzkowiak, Michael; Reinhart, Gunther
|
| 100 |
Achievements and perspectives of the DRIE technology for the MicrosystemsAutoren:
Puech, M.; Thevenoud, J. M.; Gruffat, J. M.; Launay, N.; Godinat, P.; Barillec, O. Le
|
| 101 |
Calibration in a MEMS based measurement system or how to make a sensor-ASIC loop of high resolution workAutoren:
Vosskaemper, L. M.; Domingues, Christian; Engels, Lucille; Sibeud, Loïc
|
| 102 |
Changes in the MEMS industry 2007 - 2012Autoren:
Wicht, Henning; Bouchaud, Jérémie
|
| 103 |
Thin substrate handling by electrostatic forceAutoren:
Wieland, Robert; Bock, Karlheinz; Hacker, Erwin; Landesberger, Christof; Ramm, Peter
|
| 104 |
Integrated planar low-cost sensor for reflection interference spectroscopyAutoren:
Will, M.; Brodersen, O.; Steinke, A.; Pröll, F.; Steinle, L.; Gauglitz, G.
|
| 105 |
A Miniaturized Atmospheric Dielectric Barrier Discharge (DBD) Plasma System for Mass Spectrometry Analysis of BiosamplesAutoren:
Yang, Chao-Chi; Shiea, Jen-Taie; Lin, Che-Hsin
|



Kontaktinformationen
Newsletter
Weitere Services 






