Gessner, T.

Smart Systems Integration 2008

Barcelona, Spain, April 9-10, 2008, 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICS and Electronic Components

2008, 570 Seiten, DIN A4, gebunden,
ISBN 978-3-8007-3081-0

Rabatt

119,00 €

Fachbuch

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Getting smaller and smarter are the major challenges for research and development in Europe and worldwide. A multitude of technologies, materials and processes require the right, optimal combination for bridging the gap between the nanometer scale and the customers macro world. A main focus in microsystems or MEMS development will lie on integrated smart systems which are able to sense and diagnose, describe and qualify a special situation. In most cases they are able to interface, interact and communicate with their environment and with other smart systems. With the Smart Systems Integration Conference 2008 we try to show a snap shot of the European research work on this field. Scientists from industry and institutes will show certain ways for creating new smart systems, their ideas for smart technologies as well as the intelligent combination of materials and processes for a new age in smart systems integration.

Dieser Tagungsband enthält folgende Beiträge, die Sie einzeln als PDF-Download erwerben können:


1	European Research in Micro-Nano-Technology and Systems: Opportunities in Framework Programe 7 Autoren: Albuquerque, Augusto de

2	Recent advancements on semiconductor radiation sensors for digital mammography Autoren: Lozano, Manuel

3	From MEMS to Smart Systems Integration Autoren: Finkbeiner, Stefan

4	MEMS based inertial measurement unit for attitude and heading reference systems Autoren: Bartholomeycz, J.; Zimmermann, S.; Breng, U.; Gutmann, W.; Hafen, M.; Handrich, E.; Huber, M.; Kempfer, U.; Kopmann, H.; Kunz, J.; Leinfelder, P.; Ohmberger, R.; Probst, U.; Ruf, M.; Spahlinger, G.; Rasch, A.; Straub-Kalthoff, J.; Stroda, M.; Stumpf, K.; Weber, C.; Zimmermann, M.; Geiger, W.

5	New High Resolution Optical Incremental Rotary Encoder Autoren: Mayer, V.; Schneider, M.; Seybold, J.; Botzelmann, T.; Fritz, K.-P.; Kück, H.

6	Fully-Integrated wireless CMOS smart sensor Autoren: Segura-Quijano, Fredy; Sacristán, Jordi; García-Canton, Jesús; Oses, Teresa; Baldi, Antonio

7	A readout circuit for remote interrogation of capacitance transducers Autoren: Nowak, Michel; Delorme, Nicolas; Colinet, Eric; Jacquemod, Gilles; Conseil, François

8	Cost-Driven Design of Smart Micro Systems Autoren: Niedermayer, Michael; Hefer, Jan; Reichl, Herbert; Guttowski, Stephan

9	Approaches of local stress measurement on microsystem devices Autoren: Vogel, Dietmar; Auerswald, Ellen; Gollhardt, Astrid; Luczak, Falk; Sabate, Neus; Michel, Bernd

10	Novel Stress Measurement System for Evaluation of Package Induced Stress Autoren: Kittel, Hartmut; Endler, Stefan; Osterwinter, Heinz; Oesterle, Sonja; Schindler-Saefkow, Florian

11	Long-Term Performance of Ultrasonic Transducers Used for Energy and Data Transmission Autoren: Ngo, Luong van; Kluge, Martin; Sabater, Jordi; Schalk, Josef; Seidel, Helmut; Schmid, Ulrich

12	Reliability Improvement in Smart Systems Integration Autoren: Hertl, Michael; Lecomte, Jean-Claude; Weidmann, Diane

13	Microsecurity and Nanosecurity – Security Research Using the Advantages of Smart System Integration Autoren: Michel, Bernd; Winkler, Thomas

14	Application of high-resolution X-ray microscopy to image backend-of- line structures Autoren: Zschech, Ehrenfried; Braun, Stefan; Yun, Wenbing

15	Smart Micromachined Ultrasonic Probe with advanced imaging performances Autoren: Meynier, Cyril; Meynier, Cyril; Legros, Mathieu; Ferin, Guillaume; Certon, Dominique; Nguyen-Dinh, An; Dufait, Rémi

16	Improved methods of system integration for MEMS-based laser projection systems Autoren: Scholles, Michael; Frommhagen, Klaus; Gerwig, Christian; Grueger, Heinrich; Knobbe, Jens; Lakner, Hubert; Schlebusch, Dirk; Schwarzenberg, Markus; Vogel, Uwe

17	Monolithic integration of MEMS resonators in a 0.35µm CMOS technology for gravimetric sensor and radiofrequency applications Autoren: Abadal, Gabriel; Teva, Jordi; Verd, Jaume; Torres, Francesc; López, Joan Lluis; Uranga, Arantxa; Esteve, Jaume; Pérez-Murano, Francesc; Barniol, Núria

18	MEMS Package in a Harsh Environment for Aeronautic Applications Autoren: Friedberger, Alois; Gradolph, Christian; Klettner, Florian; Müller, Gerhard; Wilde, Jürgen

19	Advanced Adhesives based on Carbon Nanotube Technology Autoren: Fecht, Hans-Jörg; Leson, Andreas; Michel, Bernd; Werner, Matthias

20	Integration of optical and microfluidic functions in a hollow waveguide platform Autoren: McNie, Mark; Jenkins, Michael; Wilkinson, Alan-Shaun; Turner, Andrew; Durante, Guido Spinola; Harvey, Tom; Cox, Timothy; Bosshard, Christian; Janus, Pawel

21	3D Wafer Level System Integration – Requirements & Technologies Autoren: Klumpp, A.; Wolf, M. J.; Ramm, P.; Wunderle, B.; Reichl, H.

22	Ultra small system-in-package for medical applications Autoren: Couderc, Pascal; Val, Christian

23	Batch Fabrication Methods for Active Polymer Microsystems Autoren: Grund, Thomas; Kohl, Manfred

24	Implantable Packaging Technique Featuring Through Wafer Interconnects and Low Temperature Direct Bond Autoren: Lee, James

25	Waferbond technologies and quality assessment Autoren: Wiemer, Maik; Frömel, Jörg; Geßner, Thomas; Geßner, Thomas

26	Electromagnetic inertial microgenerators for vibrational energy scavenging: Implementation of a Si technology based modular process for optimised devices Autoren: Fondevilla, Núria; Serre, Christophe; Martínez, Susanna; Pérez-Rodríguez, Alejandro; Morante, Joan Ramón; Martincic, Emile; Montserrat, Josep; Jaume Esteve

27	Wearable self-powered wireless devices with thermoelectric energy scavengers Autoren: Leonov, Vladimir; Gyselinckx, Bert; Hoof, Chris Van; Torfs, Tom; Yazicioglu, Refet Firat; Vullers, Ruud J. M.; Fiorini, Paolo

28	An electromagnetic energy harvester for low frequency excitation Autoren: Hohlfeld, Dennis; Vullers, Ruud; Boeck, Jo de

29	Wireless power transmission for RF-MEMS devices integrated into large-scale radiating apertures Autoren: Dussopt, Laurent

30	Presentation of Platforms for Wireless Advanced Networks of Sensors for aeronautics application Autoren: Moreau, Katell; Rouet, Vincent

31	Fabrication of nanomechanical sensors monolithically integrated on CMOS by full wafer nanostencil lithography Autoren: Arcamone, Julien; Boogaart, Marc A F van den; Serra-Graells, Francesc; Fraxedas, Jordi; Brugger, Jürgen; Pérez-Murano, Francesc

32	Laser machining of thin films on top of flexible substrate carriers Autoren: Petsch, Tino; Hänel, Jens; Keiper, Bernd; Bleul, Karsten

33	INKtelligent printing of metal and metal alloys for sensor structures Autoren: Maiwald, M.; Günther, B.; Ruttkowski, V.; Werner, C.; Müller, M.; Godlinski, D.; Wirth, I.; Zöllmer, V.; Busse, M.

34	Smart Power SoC: Technology Challenges and Innovations Autoren: Tack, Marnix; Moens, Peter; Gillon, Renaud; Janssens, Johan

35	MEMS-based spectroscopic ellipsometry Autoren: Saupe, Ray; Otto, Thomas; Gruska, Bernd; Weiss, Alexander; Stock, Volker; Gessner, Thomas

36	Implantable brain stimulator for epilepsy seizure inhibit Autoren: Boero, Cristina; Mazza, Marco; Ionescu, Adrian M.; Bertrand, Daniel

37	An all-polymer microfluidic system for protein sensing applications with integrated low-cost pumps, surface modification and sealing Autoren: Nestler, Joerg; Hiller, Karla; Gessner, Thomas; Gavillet, Jérôme; Auerswald, Janko; Knapp, Helmut; Griffiths, Christian; Bigot, Samuel; Beckers, Marie-Claire

38	COB vs. Flip Chip - A technology and cost comparison based on a real product Autoren: Kloeser, Joachim

39	A Smartsystem based on a Lab on a Card for detection of Salmonella spp. In faeces Autoren: Agirregabiria, M.; Olabarria, G.; Verdoy, L.; Tijero, M.; Berganzo, J.; Fernandez, L. J.; Mayora, K.; Ruano-López, J. M.

40	Tunable/Switchable Thin Film Bulk Acoustic Wave (BAW) resonator using thin electrostrictive film under oe bias for GHz applications Autoren: lvira, Brice; Reinhardt, Alexandre; Volatier, Alexandre; Defay, Emmanuel; Aid, Marc; Ancey, Pascal

41	A 5-bit K-Band MEMS Phase Shifter in a 1-Level Plastic Package Autoren: Bastioli, S.; Maggio, F. Di; Farinelli, P.; Giacomozzi, F.; Margesin, B.; Ocera, A.; Pomona, I.; Russo, M.; Sorrentino, R.

42	Ultrasonic micro hot embossing of polymers exemplified by a micro thermal flow sensor Autoren: Khuntontong, Puttachat; Blaser, Thomas; Schomburg, Werner Karl

43	Liquid chromatography miniaturised system for agrofood applications Autoren: Benvenuto, Antonella; Lorenzelli, Leandro; Malfatti, Mattia; Francioso, Luca; Siciliano, Pietro; Vilà, Anna; Verrelli, Giorgio

44	Printing of UHF modulators on embedded silicon in semi-passive RFID Autoren: Nilsson, H-E.; Mattsson, C. G.; Sidén, J.; Geyer, U.

45	Hybrid Chip-Scale Integration of Inertial MEMS by Chip-to-Wafer Vacuum Bonding Autoren: Marenco, Norman; Kostner, Hannes; Reinert, Wolfgang; Hill, Gerhard

46	Smart System Integration, an option for a future MEMS-product management Autoren: Herrnsdorf, Johannes

47	MEMS markets and newapplications Autoren: Mounier, Eric

48	From MST components to Smart System: example of IMU Autoren: Bouchaud, Jérémie; Dixon, Richard

49	Microcantilever-based sensor array tor amine detection in agro-tood applications Autoren: Adami, Andrea; Decarli, Massimiliano; Lorenzelli, Leandro; Guarnieri, Vittorio; Malfatti, Mattia; Apetrei, Constantin; Mendez, Maria Luz Rodriguez

50	Development and Characterization of Platinum Thin Films for Gas Analysis Microsystem Autoren: Dow, Ali Badar Alamin; Sklorz, Adam; Benecke, Wolfgang; Lang, Walter

51	Innovative micropower solutions for Wireless Autonomous Sensor Nodes Autoren: Altena, G.; Sterken, T.; Puers, R.; Vullers, R. J. M.; Pop, V.

52	From the flexible / rigid-flexible circuit board solution to the mechatronic 3D unit Autoren: Bäcker, Dirk

53	Efficient Wireless powering of single-chip systems Autoren: Baldi, Antonio; Segura-Quijano, Fredy; García-Canton, Jesús; Sacristán, Jordi; Oses, Ma Teresa

54	A new method for wafer level integration of silicon components on LTCC Autoren: Bartsch de Torres, H.; Fischer, M.; Gade, R.; Mach, M.; Müller, J.; Hoffmann, M.; Pawlowski, B.; Barth, S.

55	MICRO Machining Technologies for Non Silicon Materials Autoren: Baum, Mario; Rota, Astrid; Sal, Natalie; Otto, Thomas; Gessner, Thomas

56	Integrated multi-domain modeling and simulation of complex 3D micro- and nanostructures Autoren: Bieniek, T.; Janczyk, G.; Janus, P.; Kociubinski, A.; Grabiec, P.; Szynka, J.

57	Sensors and Actuators Based on Microcoils Autoren: Bolzmacher, Christian; Bauer, Karin

58	Development of a piston type condenser microphone for reconfigurable acoustic arrays Autoren: Calaza, Carlos

59	Micro/nano integration of organic/inorganic hybrid nanostructures on the basis of molecular self-assembly and dielectrophoresis Autoren: Csáki, Andrea

60	MiniMags – Microtechnical Challenges Miniaturizing Electro-Magnetic Valves Autoren: Dittrich, Lars; Kallenbach, Matthias; Hoffmann, Martin

61	Planarity Optimization of Spatial Light Modulators Autoren: Duerr, Peter; Wolschke, Steffen; Ludewig, Thomas; Dauderstädt, Ulrike; Kunze, Detlef; Wagner, Michael; Lakner, Hubert

62	Tunable bio-doped sol-gel glasses for the fabrication of photonic sensors Autoren: Fernández-Sánchez, César; Cadarso, Victor J.; Darder, Margarita; Domínguez, Carlos; Llobera, Andreu

63	Novel test structures for stiction characterization by adhesion force measurement Autoren: Friedrich, Thomas; Raudzis, Carsten; Müller-Fiedler, Roland; Bagdahn, Jörg

64	Closed Loop Controlled Liquid Dosing System Autoren: Götz, Martin; Ashauer, Matthias; Storz, Matthias; Kleiser, Michael; Zengerle, Roland

65	Smart microscopic slide providing electro-acoustic actuation of a small fluidic sample and various microscopic illumination schemes Autoren: Bonerz, Christian; Gruber, Matthias

66	Optoelectronic Sensors based on OLED-on-CMOS Autoren: Vogel, Uwe; Kreye, Daniel; Reckziegel, Sven; Grüger, Heinrich; Pügner, Tino; Törker, Michael; Amelung, Jörg; Scholles, Michael

67	A Multilayer Process for the Connection of Fine-Pitch-Elements on Three-Dimensionally Molded Interconnect Devices (3D-MIDs) Autoren: Leneke, Thomas; Majcherek, Soeren; Hirsch, Soeren; Schmidt, Bertram

68	Analysis of Thermomechanical Stress in Bare Die Assemblies on Polymer Substrates Autoren: Majcherek, Soeren; Leneke, Thomas; Hirsch, Soeren; Schmidt, Bertram

69	Technology of hybrid integration of silicon MEMS and CMOS structures using polymer Autoren: Janus, P.; Grabiec, P.; Domanski, K.; Kociubinski, A.; Szmigiel, D.

70	Fabrication of a Low-Frequency Ultrasonic Transducer Autoren: Jia, Chenping; Wiemer, Maik; Hiller, Karla; Otto, Thomas; Gessner, Thomas; Gessner, Thomas

71	Microsystems Engineering Solutions for Inductive Components with High Ampacity Autoren: Kallenbach, Matthias; Mühlke, Christian; Hoffmann, Martin

72	Intelligent silicon substrates for a shorter microsystem design cycle Autoren: Karttunen, Jani; Mäkinen, Jari; Tilli, Markku

73	A NEMS array for a signal to noise ratio improvement and mechanical filter design Autoren: Kharrat, Chady; Colinet, Eric; Voda, Alina

74	Application of Higher Order Sensitivity FE Method for Parametric MEMS Design Autoren: Kolchuzhin, Vladimir; Doetzel, Wolfram; Mehner, Jan

75	Thermal mass flow sensor for measurement of liquids (water) Autoren: Lange, Peter; Melani, Massimiliano; Bertini, Lorenzo; Marinis, Marco De

76	Multimedia SIM card testing Autoren: Laqli, Rachid

77	Complex Miniaturized Analysis System for Nuclear Magnetic Resonance Spectroscopy of Nanoliter Amounts of Biological Sample Material Autoren: Leidich, S.; Riemer, T.; Braun, M.; Kurth, S.; Gessner, T.; Gessner, T.

78	Smart multihop communication for wireless sensor networks Autoren: Karakehayov, Zdravko; Andersen, Niels Lervad

79	Reliability Improvement of Sub 100 µm Lead Free FC Solder Joint by a Pre-bonding Technique Autoren: Luo, Le; Lin, Xiaoqin

80	Minimizing the impact of fabrication tolerance on embedded filters Autoren: Fotheringham, Gerhard; Maaß, Uwe; Ndip, Ivan; Reichl, Herbert

81	802.15.4 Wireless Sensor Network Autoren: Maglione, Alfredo; Battisti, Nicola

82	Integrated Microneedle Arrays and Assembly Techniques for Drug Delivery Applications Autoren: Mahadevan, Geetha; Selvaganapathy, Ponnambalam; Sheardown, Heather

83	Systemintegration for eletromechanical actuators in automobiles Autoren: Maier, Johann

84	Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process Autoren: Malecki, Krzysztof; Bock, Gernot; Hillmann, Gerhard; Friedel, Kazimierz

85	Broadband Parameters of Compact FT Spectrometer based on Fabry-Perot Interferometer Integrated with Detector Autoren: Manuilskiy, Anatoliy; Andersson, Henrik; Thungström, Göran; Nilsson, Hans-Erik

86	Time-dependent reliability of ultra-scaled CMOS devices and its impact on circuit performance Autoren: Martín-Martínez, J.; Gerardin, S.; Rodríguez, R.; Nafría, M.; Paccagnella, A.; Aymerich, X.; Ghidini, G.

87	Integration of micro-optical components for a blue ray DVD pickup system Autoren: Mohaupt, Matthias; Beckert, Erik; Eberhardt, Ramona; Tünnermann, Andreas

88	Evaluation of a low cost piezorresistive material for high resolution tactile sensors Autoren: Castellanos, Julián; Navas-González, Rafael; Ochoteco, Estíbalitz; Vidal-Verdú, Fernando

89	Highly integrated polymer-based technology platform for in-vitro diagnostics Autoren: Otto, T.; Nestler, J.; Morschhauser, A.; Schueller, M.; Gessner, T.; Krissler, J.; Ebling, F.; Wegener, M.; Grzesiak, A.; Burgard, M.; Brandenburg, A.; Sulz, G.; Nebling, E.; Hintsche, R.; Wirth, I.; Godlinski, D.; Tovar, G.; Weber, A.; Ehrentreich-Foerster, E.; Gajovic-Eichelmann, N.; Bier, F. F.

90	In-Situ Determination of Multiple Properties of Films Using Hot- Stage Optical Microscopy and Micromachined Test Structures Autoren: Pan, Chi Hsiang

91	Low Power Tracking System for Advanced Health Monitoring Autoren: Rouet, Vincent; Venet, Julien

92	Selective Deposition of pH Sensitive Nanostructurated Films Autoren: Zamarreño, Carlos R.; Goicoechea, Javier; Matias, Ignacio R.; Arregui, Francisco J.

93	Fabrication and characterization of a passive silicon-based direct methanol fuel cell Autoren: Sabate, N.; Esquivel, J. P.; Santander, J.; Torres, N.; Gràcia, I.; Ivanov, P.; Fonseca, L.; Figueras, E.; Cané, C.

94	Package Induced Stress Simulation and Experimental Verification Autoren: Schindler-Saefkow, Florian; Wittler, Olaf; Schreier-Alt, Thomas; Kittel, Hartmut; Michel, Bernd

95	Design and Implementation ot a Micro Structure Printer tor Rapid Prototyping ot Microimplantable Medical Devices Autoren: Kraaijeveld, Leander; Schwarz, Markus

96	Test-structures for wafer level microsystems characterization Autoren: Shaporin, Alexey; Forke, Roman; Schmiedel, Ralf; Dötzel, Wolfram; Mehner, Jan; Billep, Detlef; Gessner, Thomas

97	Integration of an elasotmer in micromachining technology Autoren: Soulimane, S.; Charlot, S.; Bourrier, D.; Sudor, J.; Bancaud, A.; Gué, A.-M.; Camon, H.

98	Self-powered wireless sensor module Autoren: Spies, Peter; Mateu, Loreto; Ebling, Dirk

99	Electron beam machining of microsystem products Autoren: Tanasie, Gheorghe; Böhm, Stefan; Bärtle, Jan; Löwer, Thorsten; Reiter, Andrea; Franzkowiak, Michael; Reinhart, Gunther

100	Achievements and perspectives of the DRIE technology for the Microsystems Autoren: Puech, M.; Thevenoud, J. M.; Gruffat, J. M.; Launay, N.; Godinat, P.; Barillec, O. Le

101	Calibration in a MEMS based measurement system or how to make a sensor-ASIC loop of high resolution work Autoren: Vosskaemper, L. M.; Domingues, Christian; Engels, Lucille; Sibeud, Loïc

102	Changes in the MEMS industry 2007 - 2012 Autoren: Wicht, Henning; Bouchaud, Jérémie

103	Thin substrate handling by electrostatic force Autoren: Wieland, Robert; Bock, Karlheinz; Hacker, Erwin; Landesberger, Christof; Ramm, Peter

104	Integrated planar low-cost sensor for reflection interference spectroscopy Autoren: Will, M.; Brodersen, O.; Steinke, A.; Pröll, F.; Steinle, L.; Gauglitz, G.

105	A Miniaturized Atmospheric Dielectric Barrier Discharge (DBD) Plasma System for Mass Spectrometry Analysis of Biosamples Autoren: Yang, Chao-Chi; Shiea, Jen-Taie; Lin, Che-Hsin