|
Rubrik:
Proceedings
| ||||
|
||||
Barcelona, Spain, April 9-10, 2008, 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, MOEMS, ICS and Electronic Components
2008, 570 Seiten, DIN A4, gebunden,
|
119,00 € Fachbuch
|
|||
| Getting smaller and smarter are the major challenges for research and development in Europe and worldwide. A multitude of technologies, materials and processes require the right, optimal combination for bridging the gap between the nanometer scale and the customers macro world. A main focus in microsystems or MEMS development will lie on integrated smart systems which are able to sense and diagnose, describe and qualify a special situation. In most cases they are able to interface, interact and communicate with their environment and with other smart systems. With the Smart Systems Integration Conference 2008 we try to show a snap shot of the European research work on this field. Scientists from industry and institutes will show certain ways for creating new smart systems, their ideas for smart technologies as well as the intelligent combination of materials and processes for a new age in smart systems integration. | ||||
|
|
| 1 |
European Research in Micro-Nano-Technology and Systems: Opportunities in Framework Programe 7 Autoren:
Albuquerque, Augusto de
|
| 2 |
Recent advancements on semiconductor radiation sensors for digital mammography Autoren:
Lozano, Manuel
|
| 3 |
From MEMS to Smart Systems Integration Autoren:
Finkbeiner, Stefan
|
| 4 |
MEMS based inertial measurement unit for attitude and heading reference systems Autoren:
Bartholomeycz, J.; Zimmermann, S.; Breng, U.; Gutmann, W.; Hafen, M.; Handrich, E.; Huber, M.; Kempfer, U.; Kopmann, H.; Kunz, J.; Leinfelder, P.; Ohmberger, R.; Probst, U.; Ruf, M.; Spahlinger, G.; Rasch, A.; Straub-Kalthoff, J.; Stroda, M.; Stumpf, K.; Weber, C.; Zimmermann, M.; Geiger, W.
|
| 5 |
New High Resolution Optical Incremental Rotary Encoder Autoren:
Mayer, V.; Schneider, M.; Seybold, J.; Botzelmann, T.; Fritz, K.-P.; Kück, H.
|
| 6 |
Fully-Integrated wireless CMOS smart sensor Autoren:
Segura-Quijano, Fredy; Sacristán, Jordi; García-Canton, Jesús; Oses, Teresa; Baldi, Antonio
|
| 7 |
A readout circuit for remote interrogation of capacitance transducers Autoren:
Nowak, Michel; Delorme, Nicolas; Colinet, Eric; Jacquemod, Gilles; Conseil, François
|
| 8 |
Cost-Driven Design of Smart Micro Systems Autoren:
Niedermayer, Michael; Hefer, Jan; Reichl, Herbert; Guttowski, Stephan
|
| 9 |
Approaches of local stress measurement on microsystem devices Autoren:
Vogel, Dietmar; Auerswald, Ellen; Gollhardt, Astrid; Luczak, Falk; Sabate, Neus; Michel, Bernd
|
| 10 |
Novel Stress Measurement System for Evaluation of Package Induced Stress Autoren:
Kittel, Hartmut; Endler, Stefan; Osterwinter, Heinz; Oesterle, Sonja; Schindler-Saefkow, Florian
|
| 11 |
Long-Term Performance of Ultrasonic Transducers Used for Energy and Data Transmission Autoren:
Ngo, Luong van; Kluge, Martin; Sabater, Jordi; Schalk, Josef; Seidel, Helmut; Schmid, Ulrich
|
| 12 |
Reliability Improvement in Smart Systems Integration Autoren:
Hertl, Michael; Lecomte, Jean-Claude; Weidmann, Diane
|
| 13 |
Microsecurity and Nanosecurity – Security Research Using the Advantages of Smart System Integration Autoren:
Michel, Bernd; Winkler, Thomas
|
| 14 |
Application of high-resolution X-ray microscopy to image backend-of- line structures Autoren:
Zschech, Ehrenfried; Braun, Stefan; Yun, Wenbing
|
| 15 |
Smart Micromachined Ultrasonic Probe with advanced imaging performances Autoren:
Meynier, Cyril; Meynier, Cyril; Legros, Mathieu; Ferin, Guillaume; Certon, Dominique; Nguyen-Dinh, An; Dufait, Rémi
|
| 16 |
Improved methods of system integration for MEMS-based laser projection systems Autoren:
Scholles, Michael; Frommhagen, Klaus; Gerwig, Christian; Grueger, Heinrich; Knobbe, Jens; Lakner, Hubert; Schlebusch, Dirk; Schwarzenberg, Markus; Vogel, Uwe
|
| 17 |
Monolithic integration of MEMS resonators in a 0.35µm CMOS technology for gravimetric sensor and radiofrequency applications Autoren:
Abadal, Gabriel; Teva, Jordi; Verd, Jaume; Torres, Francesc; López, Joan Lluis; Uranga, Arantxa; Esteve, Jaume; Pérez-Murano, Francesc; Barniol, Núria
|
| 18 |
MEMS Package in a Harsh Environment for Aeronautic Applications Autoren:
Friedberger, Alois; Gradolph, Christian; Klettner, Florian; Müller, Gerhard; Wilde, Jürgen
|
| 19 |
Advanced Adhesives based on Carbon Nanotube Technology Autoren:
Fecht, Hans-Jörg; Leson, Andreas; Michel, Bernd; Werner, Matthias
|
| 20 |
Integration of optical and microfluidic functions in a hollow waveguide platform Autoren:
McNie, Mark; Jenkins, Michael; Wilkinson, Alan-Shaun; Turner, Andrew; Durante, Guido Spinola; Harvey, Tom; Cox, Timothy; Bosshard, Christian; Janus, Pawel
|
| 21 |
3D Wafer Level System Integration – Requirements & Technologies Autoren:
Klumpp, A.; Wolf, M. J.; Ramm, P.; Wunderle, B.; Reichl, H.
|
| 22 |
Ultra small system-in-package for medical applications Autoren:
Couderc, Pascal; Val, Christian
|
| 23 |
Batch Fabrication Methods for Active Polymer Microsystems Autoren:
Grund, Thomas; Kohl, Manfred
|
| 24 |
Implantable Packaging Technique Featuring Through Wafer Interconnects and Low Temperature Direct Bond Autoren:
Lee, James
|
| 25 |
Waferbond technologies and quality assessment Autoren:
Wiemer, Maik; Frömel, Jörg; Geßner, Thomas; Geßner, Thomas
|
| 26 |
Electromagnetic inertial microgenerators for vibrational energy scavenging: Implementation of a Si technology based modular process for optimised devices Autoren:
Fondevilla, Núria; Serre, Christophe; Martínez, Susanna; Pérez-Rodríguez, Alejandro; Morante, Joan Ramón; Martincic, Emile; Montserrat, Josep; Jaume Esteve
|
| 27 |
Wearable self-powered wireless devices with thermoelectric energy scavengers Autoren:
Leonov, Vladimir; Gyselinckx, Bert; Hoof, Chris Van; Torfs, Tom; Yazicioglu, Refet Firat; Vullers, Ruud J. M.; Fiorini, Paolo
|
| 28 |
An electromagnetic energy harvester for low frequency excitation Autoren:
Hohlfeld, Dennis; Vullers, Ruud; Boeck, Jo de
|
| 29 |
Wireless power transmission for RF-MEMS devices integrated into large-scale radiating apertures Autoren:
Dussopt, Laurent
|
| 30 |
Presentation of Platforms for Wireless Advanced Networks of Sensors for aeronautics application Autoren:
Moreau, Katell; Rouet, Vincent
|
| 31 |
Fabrication of nanomechanical sensors monolithically integrated on CMOS by full wafer nanostencil lithography Autoren:
Arcamone, Julien; Boogaart, Marc A F van den; Serra-Graells, Francesc; Fraxedas, Jordi; Brugger, Jürgen; Pérez-Murano, Francesc
|
| 32 |
Laser machining of thin films on top of flexible substrate carriers Autoren:
Petsch, Tino; Hänel, Jens; Keiper, Bernd; Bleul, Karsten
|
| 33 |
INKtelligent printing of metal and metal alloys for sensor structures Autoren:
Maiwald, M.; Günther, B.; Ruttkowski, V.; Werner, C.; Müller, M.; Godlinski, D.; Wirth, I.; Zöllmer, V.; Busse, M.
|
| 34 |
Smart Power SoC: Technology Challenges and Innovations Autoren:
Tack, Marnix; Moens, Peter; Gillon, Renaud; Janssens, Johan
|
| 35 |
MEMS-based spectroscopic ellipsometry Autoren:
Saupe, Ray; Otto, Thomas; Gruska, Bernd; Weiss, Alexander; Stock, Volker; Gessner, Thomas
|
| 36 |
Implantable brain stimulator for epilepsy seizure inhibit Autoren:
Boero, Cristina; Mazza, Marco; Ionescu, Adrian M.; Bertrand, Daniel
|
| 37 |
An all-polymer microfluidic system for protein sensing applications with integrated low-cost pumps, surface modification and sealing Autoren:
Nestler, Joerg; Hiller, Karla; Gessner, Thomas; Gavillet, Jérôme; Auerswald, Janko; Knapp, Helmut; Griffiths, Christian; Bigot, Samuel; Beckers, Marie-Claire
|
| 38 |
COB vs. Flip Chip - A technology and cost comparison based on a real product Autoren:
Kloeser, Joachim
|
| 39 |
A Smartsystem based on a Lab on a Card for detection of Salmonella spp. In faeces Autoren:
Agirregabiria, M.; Olabarria, G.; Verdoy, L.; Tijero, M.; Berganzo, J.; Fernandez, L. J.; Mayora, K.; Ruano-López, J. M.
|
| 40 |
Tunable/Switchable Thin Film Bulk Acoustic Wave (BAW) resonator using thin electrostrictive film under oe bias for GHz applications Autoren:
lvira, Brice; Reinhardt, Alexandre; Volatier, Alexandre; Defay, Emmanuel; Aid, Marc; Ancey, Pascal
|
| 41 |
A 5-bit K-Band MEMS Phase Shifter in a 1-Level Plastic Package Autoren:
Bastioli, S.; Maggio, F. Di; Farinelli, P.; Giacomozzi, F.; Margesin, B.; Ocera, A.; Pomona, I.; Russo, M.; Sorrentino, R.
|
| 42 |
Ultrasonic micro hot embossing of polymers exemplified by a micro thermal flow sensor Autoren:
Khuntontong, Puttachat; Blaser, Thomas; Schomburg, Werner Karl
|
| 43 |
Liquid chromatography miniaturised system for agrofood applications Autoren:
Benvenuto, Antonella; Lorenzelli, Leandro; Malfatti, Mattia; Francioso, Luca; Siciliano, Pietro; Vilà, Anna; Verrelli, Giorgio
|
| 44 |
Printing of UHF modulators on embedded silicon in semi-passive RFID Autoren:
Nilsson, H-E.; Mattsson, C. G.; Sidén, J.; Geyer, U.
|
| 45 |
Hybrid Chip-Scale Integration of Inertial MEMS by Chip-to-Wafer Vacuum Bonding Autoren:
Marenco, Norman; Kostner, Hannes; Reinert, Wolfgang; Hill, Gerhard
|
| 46 |
Smart System Integration, an option for a future MEMS-product management Autoren:
Herrnsdorf, Johannes
|
| 47 |
MEMS markets and newapplications Autoren:
Mounier, Eric
|
| 48 |
From MST components to Smart System: example of IMU Autoren:
Bouchaud, Jérémie; Dixon, Richard
|
| 49 |
Microcantilever-based sensor array tor amine detection in agro-tood applications Autoren:
Adami, Andrea; Decarli, Massimiliano; Lorenzelli, Leandro; Guarnieri, Vittorio; Malfatti, Mattia; Apetrei, Constantin; Mendez, Maria Luz Rodriguez
|
| 50 |
Development and Characterization of Platinum Thin Films for Gas Analysis Microsystem Autoren:
Dow, Ali Badar Alamin; Sklorz, Adam; Benecke, Wolfgang; Lang, Walter
|
| 51 |
Innovative micropower solutions for Wireless Autonomous Sensor Nodes Autoren:
Altena, G.; Sterken, T.; Puers, R.; Vullers, R. J. M.; Pop, V.
|
| 52 |
From the flexible / rigid-flexible circuit board solution to the mechatronic 3D unit Autoren:
Bäcker, Dirk
|
| 53 |
Efficient Wireless powering of single-chip systems Autoren:
Baldi, Antonio; Segura-Quijano, Fredy; García-Canton, Jesús; Sacristán, Jordi; Oses, Ma Teresa
|
| 54 |
A new method for wafer level integration of silicon components on LTCC Autoren:
Bartsch de Torres, H.; Fischer, M.; Gade, R.; Mach, M.; Müller, J.; Hoffmann, M.; Pawlowski, B.; Barth, S.
|
| 55 |
MICRO Machining Technologies for Non Silicon Materials Autoren:
Baum, Mario; Rota, Astrid; Sal, Natalie; Otto, Thomas; Gessner, Thomas
|
| 56 |
Integrated multi-domain modeling and simulation of complex 3D micro- and nanostructures Autoren:
Bieniek, T.; Janczyk, G.; Janus, P.; Kociubinski, A.; Grabiec, P.; Szynka, J.
|
| 57 |
Sensors and Actuators Based on Microcoils Autoren:
Bolzmacher, Christian; Bauer, Karin
|
| 58 |
Development of a piston type condenser microphone for reconfigurable acoustic arrays Autoren:
Calaza, Carlos
|
| 59 |
Micro/nano integration of organic/inorganic hybrid nanostructures on the basis of molecular self-assembly and dielectrophoresis Autoren:
Csáki, Andrea
|
| 60 |
MiniMags – Microtechnical Challenges Miniaturizing Electro-Magnetic Valves Autoren:
Dittrich, Lars; Kallenbach, Matthias; Hoffmann, Martin
|
| 61 |
Planarity Optimization of Spatial Light Modulators Autoren:
Duerr, Peter; Wolschke, Steffen; Ludewig, Thomas; Dauderstädt, Ulrike; Kunze, Detlef; Wagner, Michael; Lakner, Hubert
|
| 62 |
Tunable bio-doped sol-gel glasses for the fabrication of photonic sensors Autoren:
Fernández-Sánchez, César; Cadarso, Victor J.; Darder, Margarita; Domínguez, Carlos; Llobera, Andreu
|
| 63 |
Novel test structures for stiction characterization by adhesion force measurement Autoren:
Friedrich, Thomas; Raudzis, Carsten; Müller-Fiedler, Roland; Bagdahn, Jörg
|
| 64 |
Closed Loop Controlled Liquid Dosing System Autoren:
Götz, Martin; Ashauer, Matthias; Storz, Matthias; Kleiser, Michael; Zengerle, Roland
|
| 65 |
Smart microscopic slide providing electro-acoustic actuation of a small fluidic sample and various microscopic illumination schemes Autoren:
Bonerz, Christian; Gruber, Matthias
|
| 66 |
Optoelectronic Sensors based on OLED-on-CMOS Autoren:
Vogel, Uwe; Kreye, Daniel; Reckziegel, Sven; Grüger, Heinrich; Pügner, Tino; Törker, Michael; Amelung, Jörg; Scholles, Michael
|
| 67 |
A Multilayer Process for the Connection of Fine-Pitch-Elements on Three-Dimensionally Molded Interconnect Devices (3D-MIDs) Autoren:
Leneke, Thomas; Majcherek, Soeren; Hirsch, Soeren; Schmidt, Bertram
|
| 68 |
Analysis of Thermomechanical Stress in Bare Die Assemblies on Polymer Substrates Autoren:
Majcherek, Soeren; Leneke, Thomas; Hirsch, Soeren; Schmidt, Bertram
|
| 69 |
Technology of hybrid integration of silicon MEMS and CMOS structures using polymer Autoren:
Janus, P.; Grabiec, P.; Domanski, K.; Kociubinski, A.; Szmigiel, D.
|
| 70 |
Fabrication of a Low-Frequency Ultrasonic Transducer Autoren:
Jia, Chenping; Wiemer, Maik; Hiller, Karla; Otto, Thomas; Gessner, Thomas; Gessner, Thomas
|
| 71 |
Microsystems Engineering Solutions for Inductive Components with High Ampacity Autoren:
Kallenbach, Matthias; Mühlke, Christian; Hoffmann, Martin
|
| 72 |
Intelligent silicon substrates for a shorter microsystem design cycle Autoren:
Karttunen, Jani; Mäkinen, Jari; Tilli, Markku
|
| 73 |
A NEMS array for a signal to noise ratio improvement and mechanical filter design Autoren:
Kharrat, Chady; Colinet, Eric; Voda, Alina
|
| 74 |
Application of Higher Order Sensitivity FE Method for Parametric MEMS Design Autoren:
Kolchuzhin, Vladimir; Doetzel, Wolfram; Mehner, Jan
|
| 75 |
Thermal mass flow sensor for measurement of liquids (water) Autoren:
Lange, Peter; Melani, Massimiliano; Bertini, Lorenzo; Marinis, Marco De
|
| 76 |
Multimedia SIM card testing Autoren:
Laqli, Rachid
|
| 77 |
Complex Miniaturized Analysis System for Nuclear Magnetic Resonance Spectroscopy of Nanoliter Amounts of Biological Sample Material Autoren:
Leidich, S.; Riemer, T.; Braun, M.; Kurth, S.; Gessner, T.; Gessner, T.
|
| 78 |
Smart multihop communication for wireless sensor networks Autoren:
Karakehayov, Zdravko; Andersen, Niels Lervad
|
| 79 |
Reliability Improvement of Sub 100 µm Lead Free FC Solder Joint by a Pre-bonding Technique Autoren:
Luo, Le; Lin, Xiaoqin
|
| 80 |
Minimizing the impact of fabrication tolerance on embedded filters Autoren:
Fotheringham, Gerhard; Maaß, Uwe; Ndip, Ivan; Reichl, Herbert
|
| 81 |
802.15.4 Wireless Sensor Network Autoren:
Maglione, Alfredo; Battisti, Nicola
|
| 82 |
Integrated Microneedle Arrays and Assembly Techniques for Drug Delivery Applications Autoren:
Mahadevan, Geetha; Selvaganapathy, Ponnambalam; Sheardown, Heather
|
| 83 |
Systemintegration for eletromechanical actuators in automobiles Autoren:
Maier, Johann
|
| 84 |
Thermo-Mechanical Modelling of Chip to Wafer Hermetic Vacuum Bonding Process Autoren:
Malecki, Krzysztof; Bock, Gernot; Hillmann, Gerhard; Friedel, Kazimierz
|
| 85 |
Broadband Parameters of Compact FT Spectrometer based on Fabry-Perot Interferometer Integrated with Detector Autoren:
Manuilskiy, Anatoliy; Andersson, Henrik; Thungström, Göran; Nilsson, Hans-Erik
|
| 86 |
Time-dependent reliability of ultra-scaled CMOS devices and its impact on circuit performance Autoren:
Martín-Martínez, J.; Gerardin, S.; Rodríguez, R.; Nafría, M.; Paccagnella, A.; Aymerich, X.; Ghidini, G.
|
| 87 |
Integration of micro-optical components for a blue ray DVD pickup system Autoren:
Mohaupt, Matthias; Beckert, Erik; Eberhardt, Ramona; Tünnermann, Andreas
|
| 88 |
Evaluation of a low cost piezorresistive material for high resolution tactile sensors Autoren:
Castellanos, Julián; Navas-González, Rafael; Ochoteco, Estíbalitz; Vidal-Verdú, Fernando
|
| 89 |
Highly integrated polymer-based technology platform for in-vitro diagnostics Autoren:
Otto, T.; Nestler, J.; Morschhauser, A.; Schueller, M.; Gessner, T.; Krissler, J.; Ebling, F.; Wegener, M.; Grzesiak, A.; Burgard, M.; Brandenburg, A.; Sulz, G.; Nebling, E.; Hintsche, R.; Wirth, I.; Godlinski, D.; Tovar, G.; Weber, A.; Ehrentreich-Foerster, E.; Gajovic-Eichelmann, N.; Bier, F. F.
|
| 90 |
In-Situ Determination of Multiple Properties of Films Using Hot- Stage Optical Microscopy and Micromachined Test Structures Autoren:
Pan, Chi Hsiang
|
| 91 |
Low Power Tracking System for Advanced Health Monitoring Autoren:
Rouet, Vincent; Venet, Julien
|
| 92 |
Selective Deposition of pH Sensitive Nanostructurated Films Autoren:
Zamarreño, Carlos R.; Goicoechea, Javier; Matias, Ignacio R.; Arregui, Francisco J.
|
| 93 |
Fabrication and characterization of a passive silicon-based direct methanol fuel cell Autoren:
Sabate, N.; Esquivel, J. P.; Santander, J.; Torres, N.; Gràcia, I.; Ivanov, P.; Fonseca, L.; Figueras, E.; Cané, C.
|
| 94 |
Package Induced Stress Simulation and Experimental Verification Autoren:
Schindler-Saefkow, Florian; Wittler, Olaf; Schreier-Alt, Thomas; Kittel, Hartmut; Michel, Bernd
|
| 95 |
Design and Implementation ot a Micro Structure Printer tor Rapid Prototyping ot Microimplantable Medical Devices Autoren:
Kraaijeveld, Leander; Schwarz, Markus
|
| 96 |
Test-structures for wafer level microsystems characterization Autoren:
Shaporin, Alexey; Forke, Roman; Schmiedel, Ralf; Dötzel, Wolfram; Mehner, Jan; Billep, Detlef; Gessner, Thomas
|
| 97 |
Integration of an elasotmer in micromachining technology Autoren:
Soulimane, S.; Charlot, S.; Bourrier, D.; Sudor, J.; Bancaud, A.; Gué, A.-M.; Camon, H.
|
| 98 |
Self-powered wireless sensor module Autoren:
Spies, Peter; Mateu, Loreto; Ebling, Dirk
|
| 99 |
Electron beam machining of microsystem products Autoren:
Tanasie, Gheorghe; Böhm, Stefan; Bärtle, Jan; Löwer, Thorsten; Reiter, Andrea; Franzkowiak, Michael; Reinhart, Gunther
|
| 100 |
Achievements and perspectives of the DRIE technology for the Microsystems Autoren:
Puech, M.; Thevenoud, J. M.; Gruffat, J. M.; Launay, N.; Godinat, P.; Barillec, O. Le
|
| 101 |
Calibration in a MEMS based measurement system or how to make a sensor-ASIC loop of high resolution work Autoren:
Vosskaemper, L. M.; Domingues, Christian; Engels, Lucille; Sibeud, Loïc
|
| 102 |
Changes in the MEMS industry 2007 - 2012 Autoren:
Wicht, Henning; Bouchaud, Jérémie
|
| 103 |
Thin substrate handling by electrostatic force Autoren:
Wieland, Robert; Bock, Karlheinz; Hacker, Erwin; Landesberger, Christof; Ramm, Peter
|
| 104 |
Integrated planar low-cost sensor for reflection interference spectroscopy Autoren:
Will, M.; Brodersen, O.; Steinke, A.; Pröll, F.; Steinle, L.; Gauglitz, G.
|
| 105 |
A Miniaturized Atmospheric Dielectric Barrier Discharge (DBD) Plasma System for Mass Spectrometry Analysis of Biosamples Autoren:
Yang, Chao-Chi; Shiea, Jen-Taie; Lin, Che-Hsin
|
