Integration Using the Hybrid Silicon Platform
Proceedings:
Conference:
ECOC 2009 - 35th European Conference on Optical Communication
Town:
Vienna, Austria
Date:
09/20/2009 - 09/24/2009
Authors:
Bowers, John E.; Chen, Hui-Wen; Liang, Di (Department of Electrical and Computer Engineering, University of California, Santa Barbara, California, 93106, USA)
Oakley, Douglas C.; Napoleone, Antonio; Chapman, David C.; Chen, Chang-Lee; Juodawlkis, Paul W. (Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts, 02420, USA)
Oakley, Douglas C.; Napoleone, Antonio; Chapman, David C.; Chen, Chang-Lee; Juodawlkis, Paul W. (Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts, 02420, USA)
File size:
121,88 kB
Pages:
2
Language:
english
Type:
Price:
15.00 €
Payment:
Abstract:
A brief review of recent progress in photonic integrated circuits (PIC) and connection to the electronic IC roadmap is presented. High-quality wafer bonding, electrically pumped lasers and high speed modulators are essential technologies for high speed interconnects and mass production of optoelectronics.
