Power Module with Additional Low Inductive Current Path
Proceedings:
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
Town:
Nuremberg, Germany
Date:
03/16/2010 - 03/18/2010
Authors:
Frisch, Michael (Vincotech GmbH, Biberger Str. 93, 82008 Unterhaching, Germany)
Ernö, Temesi (Vincotech Kft., Kossuth Lajos u. 59, 2060 Bicske, Hungary)
Ernö, Temesi (Vincotech Kft., Kossuth Lajos u. 59, 2060 Bicske, Hungary)
File size:
763,61 kB
Pages:
6
Language:
english
Type:

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Abstract:
Parasitic inductances are a major problem with power modules, in particular in fast switching applications. The parasitic inductance of the component interconnections causes an overvoltage condition and increases the switch-off losses in the semiconductor. Many initiatives have been investigated to reduce the parasitic inductance in power modules utilizing a complex mechanical construction of overlapping internal bus bars forming the DC path. An alternative to this approach, which is outlined within this writing, is a concept using today’s standard power module construction but providing an additional ultra low inductive path for the transient current.





