Pure Low Temperature Joining Technique Power Module for Automotive Production Needs
Proceedings:
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
Town:
Nuremberg, Germany
Date:
03/16/2010 - 03/18/2010
Authors:
Schulze, Elisabeth; Mertens, Christian (Volkswagen AG, Wolfsburg, Germany)
Lindemann, Andreas (Otto-von-Guericke-Universität, Magdeburg, Germany)
Lindemann, Andreas (Otto-von-Guericke-Universität, Magdeburg, Germany)
File size:
616,88 kB
Pages:
6
Language:
english
Type:
Price:
15.00 €
Payment:
Abstract:
Power electronics is a key technology for all vehicles with electric power train. The Low Temperature Joining Technique shows promising properties to meet the specific requirements for automotive power electronic systems such as compact design, high reliability and long life time. However, high complexity and high costs of production were in contrary to application of this technique for automotive power electronic. In this paper a power module using exclusively Low Temperature Joining Technique for all joints on top and bottom side of the semiconductor chips and a method establishing all these joints in only one processing step are presented.
