Power Engineering Society within VDE (ETG) (Hrsg)

ETG-Fb. 133: CIPS 2012

7th International Conference on Integrated Power Electronics Systems, Proceedings March, 6 - 8, 2012 Nuremberg / Germany

ETG-Fachberichte

2012, 478 pages, Din A4, Broschur
ISBN 978-3-8007-3414-6
Supplement: CD
Personal VDE Members are entitled to a 10% discount on this title

Content

As in the previous years CIPS is organized as a stand alone conference, while in 2004 and 2006 it was held in conjunction with the International Symposium on Power Semiconductor Devices and Integrated Circuits, ISPSD-2006, and the IEEE PESC 2004. CIPS 2012 is organized by ETG, the Power Engineering Society within VDE and co-organized by ECPE, the European Center for Power Electronics.

1

Advanced Cooling for Power Electronics

Authors:
Kang, Sukhvinder S.
2

Electromagnetic Modeling of EMI Input Filters

Authors:
Kovacevic, Ivana; Müsing, Andreas; Friedli, Thomas; Kolar, Johann. W.
3
4

Comparative Evaluation of Individual and Coupled Inductor Arrangements for Input Filters of PV Inverter Systems

Authors:
Cougo, Bernardo; Friedli, Thomas; Boillat, David O.; Kolar, Johann W.
5

Analysis and Reduction of Radiated EMI of Power Modules

Authors:
Domurat-Linde, André; Hoene, Eckart
6
7

Integrated Power Electronics Interface for Plug-In Hybrid Electric Vehicle Applications

Authors:
Hegazy, Omar; Mierlo, Joeri Van; Lataire, Philippe; Baghdadi, Mohamed El
8
9

Reliability driven virtual prototyping of power electronic equipment - a case study

Authors:
Huesgen, Till; Riedel, Gernot J.; Drofenik, Uwe
10

New Methods Help Better Evaluate Risks Via Simulation

Authors:
Schingale, Angelika; Wolf, Daniela; Schießl, Andreas; Tarnovetchi, Marius
11

Separating Failure Modes in Power Cycling Tests

Authors:
Schmidt, Ralf; Scheuermann, Uwe
12

In-situ Bond Wire and Solder Layer Health Monitoring Circuit for IGBT Power Modules

Authors:
Ji, Bing; Pickert, Volker; Zahawi, Bashar
13
14

Lifetime Evaluation of IGBT Power Modules Applying a Nonlinear Saturation Voltage Observer

Authors:
Wagenitz, Dennis; Hambrecht, Andreas; Dieckerhoff, Sibylle
15

Influence of thermal cross-couplings on power cycling lifetime of IGBT power modules

Authors:
Poller, Tilo; D'Arco, Salvatore; Hernes, Magnar; Lutz, Josef
16

Combined Reliability Testing: An approach to assure reliability under complex loading conditions

Authors:
Wittler, Olaf; Jaeschke, Johannes; Bochow-Neß, Olaf; Middendorf, Andreas; Lang, Klaus-Dieter
17

System Approach for Reliability of Low-power Power Electronics; How to Break Down into Their Constructed Parts

Authors:
Tarashioon, S.; Tarashioon, S.; Driel, W. D. van; Zhang, G. Q.
18

Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors

Authors:
Goehre, Jens; Geißler, Ute; Schneider-Ramelow, Martin; Lang, Klaus-Dieter
19

Microstructural and Mechanical Characterization of Ceramic Substrates with Different Metallization for Power Applications

Authors:
Böttge, Bianca; Klengel, Sandy; Schischka, Jan; Lorenz, Georg; Knoll, Heiko
20

Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

Authors:
Riedel, G. J.; Schmidt, R.; Liu, C.; Beyer, H.; Alaperä, I.
21

Effect of Input Power Interruptions on Power Electronics Reliability

Authors:
Pippola, J.; Frisk, L.; Kokko, K.; Kiilunen, J.; Marttila, T.
22

Efficient nonlinear inductors for PV inverters and active PFC

Authors:
Stadler, Alexander; Gulden, Christof
23
24
25

Laminated Bus Bar Structure for Low Induced Noise

Authors:
Ariga, Zen-nosuke; Wada, Keiji
26
27

Micro-fabricated thin-film inductors for on-chip power conversion

Authors:
Harburg, Daniel V.; Yu, Xuehong; Herrault, Florian; Levey, Christopher G.; Allen, Mark G.; Sullivan, Charles R.
28
29

An Improved Parasitic Capacitance Cancellation Method for Planar Differential Mode Inductor in EMI Filters

Authors:
Tan, Wenhua; Margueron, Xavier; Duquesne, Thierry; Idir, Nadir
30

Hybrid Integrated EMC filter for CM and DM EMC Suppression in a DC-DC Power converter

Authors:
Ali, Marwan; Laboure, Eric; François Costa,; Revol, Bertrand; Gautier, Cyrille
31

Integrated High Power Modules

Authors:
Johnson, C. Mark; Castellazzi, Alberto; Skuriat, Robert; Evans, Paul; Li, Jianfeng; Agyakwa, Pearl
32

Alternative lead free die attach for power module packaging

Authors:
Morelle, Jean Michel; Tan, Ky Lim; Vivet, Laurent; Leon, Renan; Lavrentieff, Serge
33

Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure

Authors:
Liang, Zhenxian; Ning, Puqi; Wang, Fred; Marlino, Laura
34

New assembly and interconnect technologies for power modules

Authors:
Guth, K.; Oeschler, N.; Böwer, L.; Speckels, R.; Strotmann, G.; Heuck, N.; Krasel, S.; Ciliox, A.
35

Direct cooled modules - integrated heat sinks

Authors:
Hohlfeld, Olaf; Herbrandt, Alexander
36

Stacked substrates for high voltage applications

Authors:
Hohlfeld, Olaf; Bayerer, R.; Hunger, Th.; Hartung, H.
37

SiC and GaN Devices - Competition or Coexistence?

Authors:
Kaminski, Nando; Hilt, Oliver
38

Holistic Approach to Maximize Power Density in Industrial Inverter Designs

Authors:
Schulz, Martin; Lillo, Liliana De; Empringham, Lee
39

Integrated Anti-Short-Circuit Safety Circuit in CMOS SOI for Normally-On JFET

Authors:
Falahi, Khalil El; Dubois, Fabien; Bergogne, Dominique; Risaletto, Damien; Allard, Bruno
40

Electrical Analysis and Packaging Solutions for High-Current Fast-Switching SiC Components

Authors:
Mermet-Guyennet, Michel; Castellazzi, Alberto; Fabre, Joseph; Fabre, Joseph; Ladoux, Philippe
41

Design of an integrated power converter in Wide Band Gap for harsh environments

Authors:
Mogniotte, Jean-Francois; Tournier, Dominique; Bevilacqua, Pascal; Godignon, Philippe; Planson, Dominique
42
43

3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules

Authors:
Mouawad, Bassem; Buttay, Cyril; Soueidan, Maher; Morel, Hervé; Allard, Bruno; Fabrègue, Damien; Bley, Vincent
44
45

Low-pressure (< 5 MPa) Low-temperature Joining of Large-area Chips on Copper Using Nanosilver Paste

Authors:
Zheng, Hanguang; Zheng, Hanguang; Calata, Jesus; Calata, Jesus; Ngo, Khai; Ngo, Khai; Luo, Susan; Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan
46

Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

Authors:
Wereszczak, Andrew A.; Vuono, Daniel J.; Liang, Zhenxian; Fox, Ethan E.
47
48

Planar Interconnect Technology for Power Module System Integration

Authors:
Weidner, K.; Kaspar, M.; Seliger, N.
49
50
51
52

Scalable High Insulation Power Supply for Medium Voltage Power Converters

Authors:
Aizpuru, Iosu; Canales, Jose María; Fernández, Jesus
53

Amplitude Modulated Resonant Push-Pull Driver for Piezoelectric Transformers in Switching Power Applications

Authors:
Schwarzmann, Holger; Erlbacher, Tobias; Bauer, Anton J.; Ryssel, Heiner; Frey, Lothar; Frey, Lothar
54
55

Thermal Management Concepts for Power Sandwich Industrial Drive

Authors:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.
56

Reliable Integration of Double-Sided Cooled Stacked Power Switches based on 70 µm Thin IGBTs and Diodes

Authors:
Li, J. F.; Castellazzi, A.; Solomon, A.; Johnson, C. M.
57

Influence of baseplate design on cooling performance and reliability

Authors:
Kriegel, Kai; Komma, Thomas; Kiffe, Walter; Levchuk, Svetlana; Otto, Johann
58
59

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications

Authors:
Zürcher, J.; Goicochea, J.; Matsumoto, K.; Michel, B.; Brunschwiler, T.
60

Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications

Authors:
Rastjagaev, Eugen; Wilde, Jürgen; Wielage, Bernhard; Grund, Thomas; Kümmel, Sabine
61
62
63

Design Considerations of Very Low Profile Coupled Inductors for Flexible Photovoltaic Module

Authors:
Ouyang, Z.; Acanski, M.; Popovic, J.; Ferreira, J. A.; Thomsen, O. C.; Andersen, M. A. E.
64

Design of a PCB Rogowski Coil based on the PEEC Method

Authors:
Guillod, T.; Gerber, D.; Biela, J.; Müsing, A.
65

Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique

Authors:
Li, Jiping; Ngo, Khai D. T.; Lu, Guo-Quan; Xie, Huikai
66

Hybrid Hydraulic Piezo Actuator and its Control for Camless Internal Combustion Engines

Authors:
Mercorelli, Paolo; Werner, Nils; Becker, Udo; Harndorf, Horst
67
68

EMI Prediction of Power Converters using Switching Waveform Analysis

Authors:
Schulz, Sebastian; Kanschat, Peter; Lindemann, Andreas
69
70
71

How to Control SiC BJT with High Efficiency?

Authors:
Wang, Luyu; Bängtsson, Hans
72

Application of eGaN FETs for highly efficient Radio Frequency Power Amplifier

Authors:
Cucak, D.; Vasic, M.; García, O.; Oliver, J. A.; Alou, P.; Cobos, J. A.
73

Sinter materials for broad process windows in DCB packages - concepts and results

Authors:
Schmitt, Wolfgang; Fritzsche, Sebastian; Thomas, Muriel
74

Quality evaluation for silver sintering layers in power electronic modules

Authors:
Rudzki, Jacek; Jensen, Lars; Poech, Max; Schmidt, Lothar; Osterwald, Frank
75

Evaluation of silver-sintering die attach

Authors:
Sabbah,  W.; Sabbah,  W.; Sabbah,  W.; Riva, R.; Hascoët,  S.; Buttay,  C.; Azzopardi,  S.; Woirgard,  E.; Planson,  D.; Allard,  B.; Meuret, R.