VDE/VDI-Gesellschaft Mikroelektronik Mikrosystem- und Feinwerktechnik (GMM) (Hrsg)

ICPT 2012

International Conference on Planarization/CMP Technology October, 15 -17, 2012, Grenoble, France

2012, 420 pages, 170 x 240 mm, Festeinband
ISBN 978-3-8007-3452-8
Supplement: CD
Personal VDE Members are entitled to a 10% discount on this title

Content

As the result of increased co-operation between local CMP users groups in Europe, Japan, Korea, Taiwan, and the United States of America, the International Conference on Planarization/CMP Technology ICPT has been established as the most respected annual gathering on this topic.
The ICPT program 2012 covers the following topical interests
- front-end dielectrics
- front-end metals
- equipment, endpoint and control
- 3D, TSV & MEMS
- consumables metrology
- fundamentals
- new CMP applications
- consumables

1

Slurry selectivity influence on STI and POP processes for RMG application

Authors:
Euvrard, C.; Perrot, C.; Seignard, A.; Dettoni, F.; Rivoire, M.
2

CMP process development for high mobility channel materials

Authors:
Ong, Patrick; Gillot, Christophe; Ansar, Sheik; Noller, Bastian
3

Scratch Reduction by using Nano-colloidal Ceria Slurry with Multiselectivity of SiO2/Si3N4/Poly-Si Films in STI-CMP

Authors:
Kang, Hyun-Goo; Koh, Jeong-Deog; Han, Seung-Woo; Lee, Jin Won; Lee, Byoun-Gki; Pyi, Seung- Ho; Lee, Byung-Seok; Kim, Jin-Woong; Reiss, Brian; Jeong, Jae-Deok; Nam, Chul-Woo; Jang, Ju-Yeon; Choi, Kyo-Se; Dysard, Jeffrey; Woodland, Daniel
4

Performance of a Novel Slurry Injection System on an Ebara F-REX200® Polisher for a Silicon Dioxide CMP Application

Authors:
Borucki, Leonard; Zhuang, Yun; Sampurno, Yasa; Philipossian, Ara; Kreutzer-Schneeweiss, Sascha
5

Buried Tungsten Metal Gate Formation with Chemical Mechanical Polishing Technique and Involved Issues

Authors:
Hwang, Kyungho; Kwon, Hyuk; Kim, Hyunghwan; Kang, Hyosang
6
7

Innovative Barrier CMP Process: Benefit of High Selective Approach on Morphological and Electrical Performances

Authors:
Robin, O.; Nemouchi, F.; Charrion, E.; Hinsinger, O.; Galpin, D.; Rivoire, M.
8

Planarization Efficiency of Copper Protrusion

Authors:
Lin, Jie; Poutasse, Charles A.
9

Direct Polish STI HSS CMP with Improved Planarity and Defect Performance

Authors:
Iyer, A.; Yang, T.; Li, T.; Diao, J.; Lee, C. H.; Leung, G.; Osterheld, T.
10

Chemical Mechanical Planarization (CMP) In-Situ pad groove monitor through Fault Detection and Classification (FDC) system

Authors:
Del Monaco, S.; Calderone, F.; Fritah, M.; Tiec, T. Le; Laurent, A.
11

Global Thickness Measurement System for Metal Layer on Wafer

Authors:
Yu, Qiang; Zhao, Dewen; Li, Hongkai; Qu, Zilian; Qian Zhao; Lu, Xinchun; Meng, Yonggang
12

Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers

Authors:
Dettoni, F.; Beitia, C.; Euvrard, C.; Morand, Y.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
13

Feature analysis and simulation of optical endpoint traces in tungsten CMP

Authors:
Mazzone, Giovanni; Gianni, Davide M.; Bano, Giuseppe; Castelletti, Luca
14

Cu Layer thickness monitoring in CMP process by using eddy current sensor

Authors:
Qu, Zilian; Zhao, Qian; Yu, Qiang; Zhao, Dewen; Li, Hongkai; Lu, Xinchun; Meng, Yonggang
15

STI CMP stop in Silicon Nitride controlled by FullVision™ endpoint

Authors:
Perrot, C.; Pitard, F.; Cui, S.; Lam, G.; Del Medico, S.; Bennett, D.; Gaillard, S.; Hinsinger, O.
16

In Situ Profile Control with Titan Edge™ Heads for Dielectric Planarization of Advanced CMOS Devices

Authors:
Dhandapani, S.; Qian, J.; Cherian, B.; Menk, G.; Garretson, C.; Lee, H.; Bennett, D.; Osterheld, T.
17

Reduction of Edge Exclusion by EPC ring in CMP process

Authors:
Park, Yeongbong; Lee, Youngkyun; Yuh, Minjong; Jeong, Haedo
18

Development of linear roll CMP system for large area micropatterns

Authors:
Kim, Seongsoo; Kim, Jiyoon; Lee, Changsuk; Jeong, Haedo
19

Smart pad dressing for double-side polishing

Authors:
Kanzow, J.; Werth, S.; Mörsch, G.
20
21

Particle Reduction in W-CMP Process through Optimizing Post Cleaner

Authors:
Kim, Nam Yun; Kim, Kuen Byul; Jang, Young Seok; Lee, Jae Chang; Hong, Jin Suk; Baek, Kye Hyun; Kim, Hee Seok; Cho, Han Ku
22

The Synergetic Effect of Polishing Debris Cleaning in Real-time

Authors:
Kim, Hojoong; Kim, Mingu; Qin, Hongyi; Yang, Ji Chul; Lim, Donghyun; Choi, Hoomi; Kim, Taesung
23

Development of new copper post-CMP cleaning solutions that allow direct bonding

Authors:
Ouerd, Aziz; Dulphy, Hervé; Lelièvre, Vincent; Cioccio, Léa Di; Rivoire, Maurice
24

Interferometry: a direct die level characterization technique

Authors:
Dettoni, F.; Beitia, C.; Morand, Y.; Euvrard, C.; Balan, V.; Peak, J.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
25

FullVision™ Endpoint for CMP of SiGe Fin Structures

Authors:
Menk, G.; Dhandapani, S.; Huang, Y.-C.; Wood, B.; Qian, J.; Cherian, B.; Garretson, C.; Osterheld, T.
26

CMP Defect Monitoring in HKMG Loop on Monitor Wafers

Authors:
Peng, Ren; Hsu, Chun Wei; Hsieh, Duckblood; Lin, Welch; Huang, Climbing; Wu, JY; Palamadai, Chandar; Sapre, Prasanna; Chang, Timothy; Wang, Tony; Huang, Eros; Cheng, Harvey; Hu, Debbie
27
28

CMP Process Optimization for Bonding Applications

Authors:
Balan, Viorel; Seignard, Aurélien; Scevola, Daniel; Lugand, Jean-François; Di Cioccio, Léa; Rivoire, Maurice
29

Process Optimization of Grinding and CMP for Thinning of Si

Authors:
Feeney, Paul; Shumway, Lynn
30

Influence of different anneal processes on copper surfaces pre - and post - CMP

Authors:
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Dobritz, S.; Grafe, J.; Boettcher, M.; Wolf, M. J.
31

TSV CMP Process Development and Pitting Defect Reduction

Authors:
Lin, Paul-Chang; Xu, Jinhai; Li, Pei; Ding, Yujie; Ma, Zhiyong; Xing, Charles; Jing, Judy; Wang, Yuchun
32

Advances in CMP for TSV Reveal

Authors:
Rhoades, Robert L.; Malta, Dean
33

Application of an Abrasive-Free Cu Slurry for MEMS Devices

Authors:
Steible, Benjamin; Stoldt, Michael; Tack, Michael; Zwicker, Gerfried
34
35

Identification of Nonlinear Viscoelasticity of Polishing Pad Using an On- Machine Compression Tester

Authors:
Suzuki, Norikazu; Asaba, Masakazu; Hashimoto, Yohei; Shamoto, Eiji
36

Additive/Abrasive Interactions in Solution: Investigation of the Surface Chemistry and Adsorption Behaviour of CMP Abrasives

Authors:
England, Ashley N.; Rawat, Ashwani; Moinpour, Mansour; Remsen, Edward E.
37
38

Effect of Slurry Chemistry on W CMP Performance

Authors:
Kang, Mincheol; Kim, Kyungbo; Jung, Taeyeon; Park, Hyungsoon; Kim, Hyunghwan; Kang, Hyosang
39

Microreplicated Pad Conditioner for Copper Barrier CMP Applications

Authors:
Zabasajja, John; Le-huu, Duy; Gould, Charles
40

CVD Diamond-Coated CMP Polishing Pad Conditioner With Asperity Height Variation

Authors:
Choi, Joo Hoon; Lee, Yong Bin; Kim, Byung Ki
41

Chemical Mechanical Polishing Slurry for Aluminum Substrate

Authors:
Wang, Liangyong; Liu, Weili; Song, Zhitang
42

Surface adsorption mechanism of water-soluble polymer in polishing slurry

Authors:
Tsuchiya, Kohsuke; Takahashi, Shuhei; Kubo, Megumi; Morinaga, Hitoshi
43

Oxide Rate and Selectivity as a Function of Pad Chemistry,

Authors:
Renteln, Peter; Hsu, Oscar
44

Slurry Development for Copper/Barrier CMP

Authors:
Zhang, Baoguo; Liu, Yuling
45

CMP Evaluation of Reusable Polishing Pad using Auxiliary Plate

Authors:
Daventure, Nicolas; Del Monaco, Silvio; Suzuki, Tatsutoshi; Balan, Viorel; Rivoire, Maurice
46

Role of Abrasive Type and Media Surface Energy on Nanoparticle Adsorption

Authors:
Kaiser, Jordan; Streit, Michael; Connor, Patrick; Levy, Patrick; Keleher, Jason J.
47

The Synthesis of PS-Si02 Raspberry Structure Nanopartide for CMP Slurry

Authors:
Qin, Hongyi; Kim, Hojoong; Choi, Hoomi; Kim, Mingu; Kim, Taesung
48

The Study of POU Filters Performance and Life-time in the CMP Slurry Supply System

Authors:
Jang, Sunjae; Lim, Donghyun; Ji Chul Yang; Kim, Hojoong; Nam, Miyeon; Kim, Taesung
49
50

The Study to Minimize the Variation of Polishing Time According to the Pad Used Time

Authors:
Yang, Ji Chul; Jang, Won Moon; Won, Jae-Hyung
51

Determination of Adhesion Force of Particles on Substrate Surface using Atomic Force Microscopy

Authors:
Shin, Woonki; An, Joonho; Kim, Jiyoon; Jeong, Haedo
52

Investigation on Analysis and Design of Pad Conditioning Process in Double Side Polishing

Authors:
Lee, Sangjik; Kim, Hyoungjae; Lee, Hyunseop; Jeong, Haedo
53
54
55

Processing Properties of Strong Oxidizing Slurry and Effect of Processing Atmosphere in SiC-CMP

Authors:
Yin, Tao; Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu; Yamazaki, Tsutomu; Wang, Zhida; Tan, Zhe
56

A Study on the Damaged Layer Characteristic of Wafer by using Chemical-Mechanical Polishing

Authors:
Park, Chuljin; Jeon, Minhyon; Lee, Sangjik; Kim, Doyeon; Lee, Taekyung; Kim, Hyoungjae
57
58

Slurry Abrasive Particle Agglomeration Experimentation and Modeling for Chemical Mechanical Planarization (CMP)

Authors:
Johnson, Joy M.; Boning, Duane S.; Kim, Gwang-Soo; Safier, Paul; Knutson, Karson
59

Tribological, Thermal, and Kinetic Attributes of 300 vs. 450 mm Chemical Mechanical Planarization Processes

Authors:
Jiao, Yubo; Liao, Xiaoyan; Wu, Changhong; Zhuang, Yun; Sampurno, Yasa; Theng, Siannie; Godlstein, Michael; Philipossian, Ara
60

Development of chemical mechanical polishing process for carbon nanotube interconnects on 300 mm wafer

Authors:
Ito, Ban; Nishide, Daisuke; Matsumoto, Takashi; Katagiri, Masayuki; Saito, Tatsuro; Wada, Makoto; Watanabe, Masahito; Sakuma, Naoshi; Kajita, Akihiro; Sakai, Tadashi
61

Chemical-Mechanical Planarization of Aluminium Damascene Structures

Authors:
Künzelmann, U.; Mueller, M. R.; Kallis, K. T.; Schuette, F.; Menzel, S.; Engels, S.; Fong, J.; Lin, C.; Dysard, J.; Bartha, J. W.; Knoch, J.
62

The effect of H2O2 and Ammonia sulfate on the CMP of Molybdenum

Authors:
Chen, Fei; Zeng, Xu; Xu, Jing-Bo; Lu, Hai-Sheng; Qu, Xin-Ping
63

Study on Polishing Properties for Phase Change Memory

Authors:
Bae, Jinwoo; Lee, Wonjun; Park, Seungho; Lee, Jae-Dong; Hwang, Inseak; Nam, Seok-Woo
64

Biomaterials Applications of Chemical Mechanical Polishing

Authors:
Basim, G. Bahar; Ozdemir, Zeynep; Mutlu, Ozal
65

Correlation of Polishing Pad Property and Pad Debris on Scratch Formation during CMP

Authors:
Kwon, Tae-Young; Cho, Byoung-Jun; Venkatesh, R. Prasanna; Park, Jin-Goo
66
67

Low Surface Roughness Epic™ D2xx soft pads for CMP Applications

Authors:
Nair, Jay; Lu, Shaoning; Page, Joseph; Bigoin, Gilles; Sun, Fred; Gaudet, Greg
68

Evaluation of Glass Lapping using Fixed Abrasive Pad

Authors:
Kim, Hyuk-Min; Manivannan, R.; Moon, Deog-Ju; Kwon, Tae-Young; Noh, Jin-Hyeong; Park, Jin-Goo
69

Challenges of CMP Consumables Metrology

Authors:
Tregub, A.; Rawat, A.