VDE e.V.; ETG (Hrsg)

ETG-Fb. 141: CIPS 2014

8th International Conference on Integrated Power Electronics Systems, Proceedings February, 25-27, 2014 Nuremberg/Germany

ETG-Fachberichte

2014, 522 pages, Din A4, Broschur
ISBN 978-3-8007-3578-5
Supplement: CD
Personal VDE Members are entitled to a 10% discount on this title

Content

The CIPS 2014 event is held to be a technical and scientific forum for engineers and researchers engaged in all the aspects of hybrid integration and reliability of power electronics systems.

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3

A proposal of embedded SoC power supply compatible with a digital block design flow

Authors:
Souvignet, Thomas; Allard, Bruno; Trochut, Severin; Hasbani, Frederic
4

Ultra-low Power Autonomous Power Management System with Effective Impedance Matching for RF Energy Harvesting

Authors:
Adami, Salah-Eddine; Vollaire, Christian; Allard, Bruno; Costa, François; Haboubi, Walid; Cirio, Laurent
5

GaN Power Semiconductors for PV Inverter Applications – Opportunities and Risks

Authors:
Stubbe, Thorsten; Mallwitz, Regine; Rupp, Roland; Pozzovivo, Gianmauro; Bergner, Wolfgang; Haeberlen, Oliver; Kunze, Mike
6

Design of Photovoltaic Microinverter for Off-Grid and Grid-Parallel Applications

Authors:
Felgemacher, Christian; Jaeger, Philipp; Kobeissi, Ali; Pfeiffer, Jonas; Wiegand, Dennis; Kruschel, Wolfram; Dombert, Benjamin; Vasconcelos Araújo, Samuel; Zacharias, Peter
7

An Improved Method of Controlling IGBT Modules Using an Optimized Gate Current Waveform

Authors:
Cenusa, Marius; Cretu, Gabriel; Pfost, Martin
8

Impact of the control on the size of the output capacitor in the integration of Buck converters

Authors:
Cortes, Jorge; Švikovic, Vladimir; Alou, Pedro; Oliver, Jesús A.; Cobos, José A.
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10

Power Semiconductor Packaging in PV Inverters up to 30 kW power, a difficult choice

Authors:
Hinze, Juliane; Zacharias, Peter; Araujo, Samuel; Friebe, Jens; Leifert, Torsten
11

Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding

Authors:
Unger, Andreas; Sextro, Walter; Althoff, Simon; Meyer, Tobias; Neumann, Klaus; Reinhart, René Felix; Broekelmann, Michael; Guth, Karsten; Bolowski, Daniel
12

Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications

Authors:
Vivet, L.; Joudrier, A.-L.; Tan, K.-L.; Morelle, J.-M.; Etcheberry, A.; Chalumeau, L.
13

Challenges on Diagnostics of Power Electronics Modules and Assemblies

Authors:
Albrecht, H.-J.; Busche, N.; Strogies, J.; Wilke, K.; Schuster, M.; Cassigniol, C.
14

Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints

Authors:
Wang, Yun; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark; Li, Shuguang; Wang, Yun; Wang, Yun
15
16

Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling

Authors:
Aoues, Younes; Makhloufi, Abderahman; Pougnet, Philippe; El-Hami, Abdelkhalak
17

Internal degradation monitoring of power devices during power cycling test

Authors:
Watanabe, Akihiko; Tsukuda, Masahiro; Omura, Ichiro
18

Characterization of different wire bonding materials during passive thermal test

Authors:
Cosiansi, Fernando; Mattiuzzo, Emilio; Turnaturi, Marcello; Thomas, Sven; Koetter, Steffen
19

Manufacturability and Reliability Assessment of Power Sandwich Technology

Authors:
Josifovic, I.; Huesgen, T.; Mengotti, E.; Popovic-Gerber, J.; Ferreira, J.A.; Drofenik, U.
20

Reliability Prediction Approach of DC-DC Converter with Electrical Stress Analysis

Authors:
Kim, Jemin; Choi, Sungsoon; Lee, Kwanhun; Lee, Kwanhun
21

A Multi-Disciplinary Virtual Prototyping Design Tool for Power Electronics

Authors:
Evans, P. L.; Castellazzi, A.; Johnson, C. M.
22

Evolution of Electrical Performance in New Generation of SiC MOSFET for High Temperature Applications

Authors:
Ouaida, Rémy; Calvez, Cyril; Podlejski, Anne-Sophie; Brosselard, Pierre; Ouaida, Rémy
23

Technology, industry and market trends in WBG power module packaging

Authors:
Roussel, Philippe; Azemar, Jerome
24

Novel Layout and Packaging for Lateral, Low-Resistance GaN-on-Si Power Transistors

Authors:
Reiner, R.; Waltereit, P.; Benkhelifa, F.; Walcher, H.; Quay, R.; Schlechtweg, M.; Ambacher, O.
25

High Temperature Discrete Integrated Coreless Signal Insulator

Authors:
Bergogne, Dominique; Martin, Christian; Allard, Bruno; El Falahi, Khalil; Picun, Gonzalo; Ezzeddine, Hilal; Pintout, Cedric
26

Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules

Authors:
Uhlemann, Andre; Fath, Thorsten; Hymon, Erwin
27

Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery

Authors:
Gschwend, Dominic; Tick, Timo; Oggioni, Stefano; Paredes, Stephan; Matsumoto, Keiji; Tiwari, Manish K.; Poulikakos, Dimos; Brunschwiler, Thomas
28

A Simple Method to Evaluate Substrate Layout for Power Modules

Authors:
Zhu, Nan; Chen, Min; Xu, Dehong
29

Planar, double-layer magnetic inductors for low power, high frequency DC-DC converters

Authors:
Haddad, Elias; Martin, Christian; Joubert, Charles; Allard, Bruno; Buttay, Cyril; Tannous, Tony Abi; Bevilacqua, Pascal
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31

High-throughput DBC-assembled IGBT screening for power module

Authors:
Tsukuda, Masanori; Okoda, Seiichi; Noda, Ryuzo; Tashiro, Katsuji; Omura, Ichiro; Tsukuda, Masanori
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33

Power cycling capability of Modules with SiC-Diodes

Authors:
Herold, Ch.; Schaefer, M.; Sauerland, F.; Poller, T.; Lutz, J.; Schilling, O.
34

A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application

Authors:
Ghimire, Pramod; Pedersen, Kristian Bonderup; Vega, Angel Ruiz de; Rannestad, Bjorn; Munk-Nielsen, Stig; Thogersen, Paul Bach
35

Thermal path integrity monitoring for IGBT power electronics modules

Authors:
Eleffendi, Mohd. Amir; Johnson, C. Mark
36

Reliability assessment of molded Smart Power Modules

Authors:
Thomas, Tina; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Joerg; Lang, Klaus-Dieter
37

Microstructural study of the fatigue mechanism of aluminum cladded copper wires

Authors:
Naumann, Falk; Maerz, Benjamin; Klengel, Robert; Schischka, Jan; Petzold, Matthias
38

Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling

Authors:
Heuck, N.; Guth, K.; Thoben, M.; Mueller, A.; Oeschler, N.; L. Boewer; Speckels, R.; Krasel, S.; Ciliox, A.
39

High resolution failure analysis of silver-sintered contact interfaces for power electronics

Authors:
Boettge, Bianca; Maerz, Benjamin; Schischka, Jan; Klengel, Sandy; Petzold, Matthias
40

A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

Authors:
Agyakwa, Pearl A.; Yang, Li; Corfield, Martin R.; Johnson, C. Mark
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45

Power Supply with Integrated PassivEs - The EU FP7 PowerSwipe Project

Authors:
Mathuna, Cian O.; Wang, Ningning; Kulkarni, Santosh; Anthony, Ricky; Cordero, Nicolas; Oliver, Jesus; Alou, Pedro; Svikovic, Vladimir; Cobos, Jose Antonio; Cortes, Jorge; Neveu, Florian; Martin, Christian; Allard, Bruno; Voiron, Frederic; Knott, Bernhard; Sandner, Christoph; Maderbacher, Gerhard; Pichler, Joachim; Agostinelli, Matteo; Anca, Anamaria; Breig, Markus; Mathuna, Cian O.; Anthony, Ricky
46

Review of high frequency, highly integrated inductive DC-DC converters

Authors:
Neveu, F.; Martin, C.; Allard, B.
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48

Losses Comparison of Gallium Nitride and Silicon Transistors in a High Frequency Boost Converter

Authors:
Wang, Wenbo; Pansier, Frans; Haan, S. W. H. de; Ferreira, J. A.
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52

3D Packaging for vertical power devices

Authors:
Rouger, N.; Widiez, J.; Benaissa, L.; Imbert, B.; Gondcharton, P.; Letowski, B.; Crebier, JC.; Letowski, B.
53

Scalable high frequency converters for motor drives based on switching cells

Authors:
Schulz, Martin; Kapaun, Florian; Marquardt, Rainer
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55

Integrated gate driver circuits with an ultra-compact design and high level of galvanic isolation for power transistors

Authors:
To, N.-D.; Rouger, N.; Arnould, J.-D.; Corrao, N.; Crebier, J.-C.; Lembeye, Y.
56
57

Foil Based Transient Liquid Phase Bonding as a Die-Attachment Method for High Temperature Devices

Authors:
Bajwa, A. A.; Qin, Y. Y.; Zeiser, R.; Wilde, J,
58

Partial transient liquid phase bonding for high-temperature power electronics using Sn/Zn/Sn sandwich structure solder

Authors:
Park, S. W.; Nagao, S.; Sugahara, T.; Katoh, Y.; Ishino, H.; Sugiura, K.; Suganuma, K.
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61

Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

Authors:
Ocklenburg, Johanna; Rastjagaev, Eugen; Moeller, Eike; Wilde, Juergen
62

Conducted EMI and Systems Integration

Authors:
Boroyevich, Dushan; Zhang, Xuning; Bishinoi, Hemant; Burgos, Rolando; Mattavelli, Paolo; Wang, Fred
63

Power Electronics for Renewable Energy Systems – Status and Trends

Authors:
Blaabjerg, Frede; Ma, Ke; Yang, Yongheng
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65

System Integration of GaN Converters – Paradigm Shift – Challenges and Opportunities

Authors:
Popovic, J.; Ferreira, J. A.; Wyk, J. D. van; Pansier, F.
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67

Analyzing the State of Health of Diode Layers by using Structure Functions

Authors:
Richter, Martin; Kopp, Michael; Schroth, Ruediger; Lutz, Josef
68

Electro – Thermal Simulations and Experimental Results on the Surge – Current Capability of 1200 V SiC MPS Diodes

Authors:
Fichtner, Susanne; Lutz, Josef; Basler, Thomas; Rupp, Roland; Gerlach, Rolf
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70

Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Authors:
Rudzki, Jacek; Becker, Martin; Eisele, Ronald; Poech, Max; Osterwald, Frank
71

New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate

Authors:
Terasaki, Nobuyuki; Nagatomo, Yoshiyuki; Nagase, Toshiyuki; Kuromitsu, Yoshirou
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73

Influence of Cu/Ni(P) Metallized Si3N4 Ceramic Substrate in Bond Reliability of Power Components at 250 °C

Authors:
Lang, Fengqun; Yamaguchi, Hiroshi; Nakagawa, Hiroshi; Sato, Hiroshi
74

DCB-based low-inductive SiC modules for high frequency operation

Authors:
Meisser, Michael; Hamilton, Dean; Mawby, Philip
75

1200 V-360 A SiC Power Module with Phase Leg Clustering Concept for Low Parasitic Inductance and High Speed Switching

Authors:
Takao, Kazuto; Shinohe, Takashi; Yamamoto, Takashi; Hasegawa, Kohei; Ishida, Masaaki
76

Comparison of thermo-mechanical reliability of high-temperature bonding materials for attachment of SiC devices

Authors:
Li, Jianfeng; Yaqub, Imran; Corfield, Martin; Agyakwa, Pearl; Johnson, Christopher Mark
77

Robust Top Side Contact Technology on Power Semiconductors – Results from the Public Funded Project ‘ProPower’

Authors:
Rittner, Martin; Gross, David; Guyenot, Michael; Guenther, Michael; Haag, Sabine; Kaden, Thomas; Reinold, Manfred; Thoben, Markus; Stegmeier, Stefan; Weidner, Karl; Kock, Mathias
78

Packaging Very Fast Switching Semiconductors

Authors:
Hoene, Eckart; Ostmann, Andreas; Marczok, Christoph
79

Multi-chip circuit designs for silicon carbide power electronics

Authors:
Nee, Hans-Peter; Rabkowski, Jacek; Peftitsis, Dimosthenis
80

Present and Future of GaN Power Devices

Authors:
Ueda, Daisuke; Fukuda, Takeshi; Nagai, Shuichi; Sakai, Hiroyuki; Otsuka, Nobuyuki; Morita, Tatsuo; Negoro, Noboru; Ueda, Tetsuzo; Tanaka, Tsuyoshi