ETG – Energietechnische Gesellschaft im VDE (ETG) (Hrsg)

ETG-Fb. 148: CIPS 2016

9th International Conference on Integrated Power Electronics Systems, Proceedings March, 8 – 10, 2016, Nuremberg/Germany

ETG-Fachberichte

2016, 586 pages, Slimlinebox, CD-Rom
ISBN 978-3-8007-4171-7
Personal VDE Members are entitled to a 10% discount on this title

Content Foreword

The Conference focus is today more important than ever, with the issue of increasing energy efficiency and system reliability by decreasing costs.
Energietechnische Gesellschaft im VDE (ETG)
Die ETG bündelt im VDE die Fachkompetenz der Elektrischen Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern in Fachbereichen und Fachausschüssen. Ungefähr 300 Experten aus Industrie, Forschung, Versorgungsunternehmen, Hochschulen und Behörden sind dort ehrenamtlich tätig und bilden damit die technisch-wissenschaftliche Basis für die Aktivitäten der ETG.

1

Highly integrated SiC module with thick-film dielectric allows for high frequency operation

Authors:
Meisser, Michael; Schmenger, Max; Bernd, Martin; Leyrer, Benjamin; Demattio, Horst; Hamilton, Dean; Mawby, Philip; Blank, Thomas
2

Case Sensitive Condition Monitoring of an IGBT Inverter in a Hybrid Car

Authors:
Denk, Marco; Bakran, Mark-M.; Schafferhans, Stephan
3

Life-time modeling of DBC-based MOSFET-power modules

Authors:
Faust-Ellsaesser, Carmen; Proepper, Thomas; Riester, Konrad; Duerr, Johannes
4

PCB Embedded Power Electronics for Low Voltage Applications

Authors:
Kearney, Daniel; Kicin, Slavo; Bianda, Enea; Krivda, Andrej; Bauman, David
5

A Parametric Layout Study of Radiated Emission from High-Frequency Half-Bridge Switching Cells

Authors:
Seliger, Norbert; Stubenrauch, Franz; Schmitt-Landsiedel, Doris
6

Requirements of short-circuit detection methods and turn-off for wide band gap semiconductors

Authors:
Maerz, Andreas; Bertelshofer, Teresa; Horff, Roman; Bakran, Mark-M.
7
8

Damage protection of power modules

Authors:
Hohlfeld, Olaf
9
10

An Overview of Advanced Power Semiconductor Packaging for Automotive System

Authors:
Wang, Yangang; Dai, Xiaoping; Liu, Guoyou; Li, Daohui; Jones, Steve
11
12

Dimensioning of a Novel Design Concept for MMC Submodules

Authors:
Waltrich, U.; Ruccius, B.; Malipaard, D.; Schletz, A.; Maerz, M.
13

Mechanical properties of silver sintered bond lines: Aspects for a reliable material data base for numerical simulations

Authors:
Letz, Sebastian; Hutzler, Aaron; Waltrich, Uwe; Zischler, Sigrid; Schletz, Andreas
14

Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength

Authors:
Bayer, Christoph Friedrich; Waltrich, Uwe; Schneider, Richard; Soueidan, Amal; Baer, Eberhard; Schletz, Andreas
15
16
17

Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (ΔVCE_ΔVGE) Method with Series Resistance Removal

Authors:
Baker, Nick; Iannuzzo, Francesco; Munk-Nielsen, Stig; Dupont, Laurent; Avenas, Yvan
18

Low Temperature Bonding Technology for 250 °C-Operating SiC Power Modules Using Nano-Composite Cu/Sn Paste

Authors:
Lang, Fengqun; Kato, Fumiki; Nakagawa, Hiroshi; Yamaguchi, Hiroshi; Sato, Hiroshi; Kimura, Ryuji; Ikeda, Hiroaki; Shimokawa, Koichi; Tamaki, Rei; Sekine, Shigenobu
19

Low Temperature Silver Sinter Processes on ENIG Surfaces

Authors:
Blank, T.; Bruns, M.; Kuebel, C.; Leyrer, B.; Meisser, M.; Weber, M.; Rudzki, J.; Osterwald, F.; Wilke, K.; Busche, N.; Eisele, R.
20

Processing and Properties of Chip-bonding on Copper by Low-temperature Sintering a Nanosilver Paste

Authors:
Zheng, Hanguang; Gao, Shan; Ngo, Khai; Lu, Guo-Quan; Lu, Guo-Quan
21

Evaluation of electrochemical migration into an isolated sintered power module

Authors:
Cosiansi, Fernando; Mattiuzzo, Emilio; Turnaturi, Marcello; Candido, Pirri Fabrizio
22

Dual-Side Ceramic Power Module for Fast Switching Silicon Carbide Transistors

Authors:
Mueter, U.; Luerkens, P.; Garcia i Tormo, A.; Bast, M.; Hoffmann, K.F.; Eisele, R.
23

Passive thermal cycling of power diodes under controlled atmospheric conditions - effects on metallization degradation

Authors:
Brincker, Mads; Bonderup Pedersen, Kristian; Kristensen, Peter Kjaer; Popok, Vladimir
24

400 A, 1200 V SiC power module with 1nH commutation inductance

Authors:
Beckedahl, Peter; Buetow, Sven; Maul, Andreas; Roeblitz, Martin; Spang, Matthias
25

Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation

Authors:
Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Schneider, Richard; Baer, Eberhard; Schletz, Andreas
26

Monitoring of IGBT modules - temperature and degradation simulation

Authors:
Bonderup Pedersen, Kristian; Brincker, Mads; Ghimire, Pramod; Pedersen, Kjeld
27

Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling

Authors:
Ehrhardt, Christian; Geissler, Ute; Hoefer, Jan; Broll, Marian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schmitz, Stefan
28
29
30

High heat dissipation and high heat durability technologies for transfer-molded power modules with insulating sheets

Authors:
Nishimura, Takashi; Mimura, Kenji; Yamamoto, Kei; Idaka, Shiori; Shinohara, Toshiaki
31

Application-specific micro Rogowski coil for power modules - Design tool, novel coil pattern and demonstration

Authors:
Koga, M.; Tsukuda, M.; Tsukuda, M.; Nakashima, K.; Omura, I.
32

Silver Sintering at Low Temperatures Without Using Pressure: An Approach for Joining Large Area Copper-to-Copper Interconnects

Authors:
Oestreicher, Annerose; Lerch, Martin; Rabay, Battist; Roehrich, Tobias
33
34

Towards Highly Integrated, Automotive Power SoCs Using Capacitors Operating at 100 V implemented in TSV

Authors:
Gruenler, S.; Rattmann, G.; Erlbacher, T.; Bauer, A. J.; Krach, F.; Frey, L.
35
36

Wear optimized consumables for copper wire bonding in industrial mass production

Authors:
Broekelmann, Michael; Siepe, Dirk; Hunstig, Matthias; Guth, Karsten; Schnietz, Mark
37
38

Simulation of the Lifetime of Wire Bonds Modified through Wedge Trenches for Higher Reliability

Authors:
Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter
39

Non-Destructive Assessment of Reliability and Quality related Properties of Power Electronic Devices for the In-Line Application of Scanning Acoustic Microscopy

Authors:
Brand, Sebastian; Naumann, Falk; Tismer, Sebastian; Boettge, Bianca; Rudzki, Jacek; Osterwald, Frank; Petzold, Matthias
40

Influence of the Magnetic’s Parasitic Capacitance in the switching of High-Voltage Cascode GaN HEMT

Authors:
Galanos, N.; Popovic, J.; Ferreira, J. A.; Gerber, M.
41

Microstructure and thermophysical characterization of innovative plastic materials for power electronics

Authors:
Klengel, S.; Boettge, B.; Naumann, F.; Mittag, M.; Hirsch, U.; Ehrich, C.
42

Full SiC power module with substrate integrated liquid cooling for battery electric vehicles

Authors:
An, Bao Ngoc; Bernd, Martin; Leyrer, Benjamin; Blank, Thomas; Weber, Marc; Loges, Andre; Wetzel, Thomas; Kolb, Johannes
43

Innovative monolithic RC-snubber for fast switching power modules

Authors:
Krach, Florian; Heckel, Thomas; Frey, Lothar; Bauer, Anton J.; Erlbacher, Tobias; Maerz, Martin
44

Considerations on the influence of the current ripple and switching frequency towards the differential mode EMI filter

Authors:
Schittler, Andressa C.; Kleeb, Thiemo; Kazanbas, Mehmet; Araujo, Samuel V.; Zacharias, Peter
45

IGBT Online-Temperature Monitoring using Turn-Off Delay as a Temperature Sensitive Electrical Parameter

Authors:
Felgemacher, Christian; Dombert, Benjamin; Noeding, Christian; Zacharias, Peter
46

Loss evaluation of GaN GIT in a high frequency boost converter in different operation modes

Authors:
Wang, Wenbo; Pansier, Frans; Popovic, Jelena; Ferreira, J. A.
47

Potential failure risks causing delamination of sinter joints

Authors:
Boettge, Bianca; Reissaus, Stephan; Klengel, Sandy
48
49

Power Cycling Tests in High Temperature Conditions of SiC-MOSFET Power Modules and Ageing Assessment

Authors:
Ibrahim, A.; Ousten, J. P.; Lallemand, R.; Khatir, Z.
50

Evaluation of Cycling Stress Imposed on IGBT Modules in PV Central Inverters in Sunbelt Regions

Authors:
Felgemacher, Christian; Araujo, Samuel; Noeding, Christian; Zacharias, Peter; Ehrlich, Alexander; Schidleja, Martin
51

Mechanical Reliability of Power Electronic Systems

Authors:
Schriefer, T.; Hofmann, M.
52

Adaptive, Iterative Closed-Loop Control for the Turn-on of IGBTs with Improved Efficiency

Authors:
Cenusa, Marius; Cretu, Gabriel; Pfost, Martin
53

Thermal Performance of High-Temperature Stable Die-Attachments for GaN HEMTs

Authors:
Bajwa, A. A.; Reiner, R.; Quay, R.; Wilde, J.
54

Integrated High-Temperature Isolation barrier with Coreless Transformer

Authors:
Perrin, Remi; Allard, Bruno; Martin, Christian; Buttay, Cyril
55

A Health Monitoring Framework for IGBT Power Modules

Authors:
Eleffendi, Mohd. Amir; Johnson, C. Mark
56

Low inductance 2.5 kV packaging technology for SiC switches

Authors:
Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark; Erlbacher, Tobias; Friedrichs, Peter
57
58
59
60

Integrated converter network for active balancing structure of battery

Authors:
Phung, Thanh Hai; Mestrallet, Fabien; Vladimirova, Kremena; Collet, Alexandre; Kerachev, Lyubomir; Lembeye, Yves; Crebier, Jean-Christophe
61

Optimization of a Gallium Nitride HEMT design for a high frequency DC-DC converter application

Authors:
Cucak, D.; Vasic, M.; Garcia, O.; Oliver, J. A.; Alou, P.; Cobos, J. A.
62

High temperature thermal cycling performance of DBA, AMB and thick film power module substrates

Authors:
Hamilton, Dean. P.; Riches, Steve; Meisser, Michael; Mills, Liam; Mawby, Philip
63

High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints

Authors:
Hamilton, Dean. P.; Syed-Khaja, Aarief; Franke, Joerg; Mawby, Philip
64
65
66

Metallurgical structure of lead free solder alloy to improve the reliability of power module

Authors:
Tan, K.-L.; Morelle, J.-M.; Vivet, L.; Lavrentieff, S.
67

Rapid Sintering of Nanosilver Paste Using Current for attaching IGBT Chips

Authors:
Feng, Shuang-Tao; Mei, Yun-Hui; Li, Xin; Lu, Guo-Quan
68

Electrothermal Considerations for Power Cycling in SiC Technologies

Authors:
Ortiz Gonzalez, Jose Angel; Alatise, Olayiwola; Nobeen, Nadeesh; Hu, Ji; Ran, Li; Mawby, Phil
69

Investigations of Power Semiconductor Modules using Conductive Adhesive for Chip Assembly

Authors:
Grieger, Folkhart; Middelstaedt, Lars; Lindemann, Andreas; Moeller, Eike; Wilde, Juergen
70
71
72

Magnetic flux signal simulation with 16-channel sensor array to specify accurate IGBT current distribution

Authors:
Tsukuda, M.; Matsuo, K.; Tomonaga, H.; Okoda, S.; Noda, R.; Tashiro, K.; Omura, I.
73
74

Thermal Performance and Reliability of Copper Thick Film Substrates

Authors:
Gundel, Paul; Nowak, Torsten; Bawohl, Melanie; Challingsworth, Mark; Czwickla, Christoph; Garcia, Virginia; Nikolaidis, Ilias; Modes, Christina; Persons, Ryan; Reitz, Jessica; Shahbazi, Caitlin
75
76

Characterization and analysis of an innovative gate driver and power supplies architecture for HF power devices in harsh environment

Authors:
Nguyen, Van-Sang; Kerachev, Lyubomir; Lefranc, Pierre; Crebier, Jean-Christophe
77

Transient Thermal Impedance Model based on Online-Measurement of the On-State Voltage in IGBT Converters

Authors:
Hambrecht, Andreas; Klitzke, Reno; Lehmann, Stephan; Wagenitz, Dennis; Dieckerhoff, Sibylle
78

Empirical study on humidity conditions inside of power modules under varying external conditions

Authors:
Kremp, Sebastian; Schilling, Oliver; Mueller, Verena
79

HEV power modules robust against cyclic thermo-mechanical stress

Authors:
Leicht, Markus; Greif, Andreas; Muellmaier, Michael; Renner, Dietrich
80

Study on Packaging and Driver Integration with GaN Switches for Fast Switching

Authors:
Klein, Kirill; Hoene, Eckart; Reiner, Richard; Quay, Ruediger
81
82

Comparison of different technologies for the die attach of power semiconductor devices conducting active power cycling

Authors:
Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter
83

Coupled Electro-Thermo-Mechanical Analyses on Power Cycling Induced Loadings in Sintered Silver IGBT-Modules with and without Overmolding

Authors:
Dudek, Rainer; Doering, Ralf; Rzepka, Sven; Stegmeier, Stefan; Ehrhardt, Christian; Rittner, Martin; Rudzki, Jacek
84

Wide Band Gap Power Transistors Gate Driver Cutting Edge Bloc Functions

Authors:
Grezaud, Romain; Ayel, François; Chapel, Antoine; Bergogne, Dominique
85

Lifetime Analysis of IGBTs in Periodic Surge Current Operation

Authors:
Kemper, J.; Nevoigt, J.; Huebner, H.; Hoffmann, K.
86

A cost-controlled, 4.3 kW/l 1-Φ Inverter with a 97.2 % CEC efficiency

Authors:
Lefevre, Guillaume; Ewanchuk, Jeffrey; Degrenne, Nicolas; Lefevre, Yoan
87

Assessment of the Thermal Conductivity of Transient Liquid Phase Sintered Interconnects

Authors:
Greve, Hannes; Moeini, S. Ali; McCluskey, F. Patrick; Joshi, Shailesh
88

Thermal Impedance Identification of a SiC JFET Module

Authors:
Merkert, Arvid; Weber, Simon; Mertens, Axel
89

Review of Integration Trends in Power Electronics Systems and Devices

Authors:
Majumdar, Gourab; Oi, Takeshi; Terashima, Tomohide; Idaka, Shiori; Nakajima, Dai; Goto, Yoichi
90
91

Investigation of a power module with double sided cooling using a new concept for chip embedding

Authors:
Stahr, H.; Morianz, M.; Gross, S.; Unger, M.; Nicolics, J.; Boettcher, L.
92
93

Prospects for advances in power magnetics

Authors:
Sullivan, Charles R.
94
95

Challenges in low-voltage high-current applications – fathom the limits in system design

Authors:
Schwalbe, Ulf; Schilling, Marco; Koehnlechner, Benjamin; Reimann, Tobias
96

Photovoltaic Inverters in µ-Scale

Authors:
Mallwitz, Regine; Lippold, Florian
97
98

Current Trends for GaN on Si Power Devices for Industrial Applications

Authors:
Mitova, Radoslava; Dentella, Alain; Reilly, David; Miquel, Olivier; Blanchard, Xavier