Energietechnische Gesellschaft im VDE (ETG) (Ed.)

ETG-Fb. 156: CIPS 2018

10th International Conference on Integrated Power Electronics Systems, Proceedings March, 20 – 22, 2018, Stuttgart/Germany

ETG-Fachberichte

2018, 622 pages, Slimlinebox, CD-Rom
ISBN 978-3-8007-4540-1
Personal VDE Members are entitled to a 10% discount on this title

Content Foreword

In the next decades, power electronic system development will be driven by energy saving systems, intelligent energy management, power quality, system miniaturization and high reliability. Monolithic and hybrid system integration will include advanced device concepts including wide bandgap devices, new packaging technologies and the overall integration of actuators/drives (mechatronic integration).

CIPS is consequently focused on the following main aspects:
- assembly and interconnect technology for power electronic devices and converters
- integration of hybrid systems and mechatronic systems with high power density
- systems‘ and components‘ operational behavior and reliability

Basic technologies for integrated power electronic systems as well as upcoming new important applications will be presented in interdisciplinary invited papers.
In 2018 the successful story of CIPS will continue as the conference focus is today more important than ever - increasing functionality, energy efficiency and system reliability while decreasing cost.

We are pleased to welcome all engineers coming from industry and academia engaged in power electronics-related
- system development
- component development
- reliability engineering
- research
to share their research and technical achievements joining CIPS 2018.
ETG – Energietechnische Gesellschaft im VDE (ETG)
Die ETG bündelt im VDE die Fachkompetenz der Elektrischen Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern in Fachbereichen und Fachausschüssen. Ungefähr 300 Experten aus Industrie, Forschung, Versorgungsunternehmen, Hochschulen und Behörden sind dort ehrenamtlich tätig und bilden damit die technisch-wissenschaftliche Basis für die Aktivitäten der ETG.

1

Integration solutions for clean and safe switching of high speed devices

Authors:
Schanen, Jean-Luc; Jeannin, Pierre-Olivier
2
3
4
5

The Promise of GaN in Light of Future Requirements for Power Electronics

Authors:
Deboy, Gerald; Kasper, Matthias; Garcia, Alfredo Medina; Schlenk, Manfred
6
7

Test Strategies in Industrial Companies

Authors:
Rimestad, Lars
8
9

Condition and Health Monitoring in Power Electronics

Authors:
Mollov, Stefan; Blaabjerg, Frede
10

Analytics for Power Electronic Components - Methods to figure out root causes of failures

Authors:
Petzold, Matthias; Klengel, Sandy; Boettge, Bianca; Tismer, Sebastian; Patzig, Christian; Brand, Sebastian; Altmann, Frank
11

Limitation of Power Module Lifetime Derived from Active Power Cycling Tests

Authors:
Scheuermann, Uwe; Junghaenel, Marion
12

Optimizing integrated Common- and Differential-Mode chokes with the PermeabilityLink-method

Authors:
Schliewe, Joern; Koeppen, Matthias; Gauss, August; Lange, Detlef; Weber, Stefan
13

Thermistor Die for Power Module Applications

Authors:
Schuurman, Sophie; Mattens, Erik; Beneden, Bruno Van; Mattiuzzo, Emilio; Turnaturi, Marcello
14

Benchmark of the gate driver supplies' architectures for "N" power devices in series connection

Authors:
Nguyen, Van-Sang; Lefranc, Pierre; Crebier, Jean-Christophe
15

SMPS electromagnetic noise in System-on-Chip: Resonant frequency and amplitude dependencies

Authors:
Feltrin, Eric; Chesneau, David; Vollaire, Christian
16

C-V Characterization Technique for Four-Terminal GaN-on-Si HEMTs Based on 3-Port S-Parameter Measurements

Authors:
Salcinesa, Cristino; Moench, Stefan; Spudic, Boris; Kallfass, Ingmar
17

Ferrite embedding for Power SiPs – a packaging view

Authors:
Thomas, Tina; Schneider-Ramelow, Martin; Hoffmann, Stefan; Becker, Karl-Friedrich; Walter, Hans; Bader, Volker; Braun, Tanja; Hoene, Eckart
18
19

A SiC MOSFET Power ModuleWith Integrated Gate Drive for 2.5 MHz Class E Resonant Converters

Authors:
Jorgensena, Asger Bjorn; Nairb, Unnikrishnan Raveendran; Munk-Nielsena, Stig; Uhrenfeldt, Christian
20

Pressureless sintering of large dies by infrared radiation

Authors:
Schmitt, Wolfgang; Chew, Ly May; Miller, Robert
21

Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling

Authors:
Mueter, Ulf; Radvan, Jens; Richter, Stefan; Hoffmann, Klaus F.
22

Vias in DBC Substrates for Embedded Power Modules

Authors:
Bach, Hoang Linh; Yu, Zechun; Letz, Sebastian; Bayer, Christoph Friedrich; Waltrich, Uwe; Schletz, Andreas; Maerz, Martin
23

Fabrication of PCB Embedded 1200V/50A Power Module and Benchmarking with Commercial DBC-based Package

Authors:
Sharma, Ankit Bhushan; Schnur, Johann; Haag, Niko; Kuwan, Thomas; Stogel, Armin; Huesgen, Till
24

Dielectric Properties and Partial Discharge Inception Voltage of Aluminum Nitride Insulating Substrate at High Temperatures

Authors:
Abe, Tsuyoshi; Suenaga, Michiya; Akihiro Imakiire; Kozako, Masahiro; Hikita, Masayuki; Shiota, Hiroki; Nishimura, Takashi; Muto, Hirotaka
25

Electrochemical Corrosion on Ceramic Substrates for Power Electronics – Causes, Phenomenological Description, and Outlook

Authors:
Bayer, Christoph Friedrich; Diepgen, Antonia; Filippi, Thomas; Fuchs, Carmen; Wuestefeld, Sophie; Kellner, Simon; Waltrich, Uwe; Schletz, Andreas
26

On the reliability of stacked metallized ceramic substrates under thermal cycling

Authors:
Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark
27

Thermal Characteristic Evaluation and Transient Thermal Analysis of Next-generation SiC Power Module at 250 °C

Authors:
Imakiire, Akihiro; Kozako, Masahiro; Hikta, Masayuki; Inagaki, Masakazu; Iizuka, Tomonori; Narimatsu, Hiroaki; Sato, Nobuaki; Shimizu, Koji; Ueda, Kazutoshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro; Iida, Makio; Toda, Keiji
28

Die-bonding performance of micron Ag particle paste for high power devices

Authors:
Takemasa, Tetsu; Ueshima, Minoru; Jiu, Jinting; Seino, Junko; Suganuma, Katsuaki
29

Integrated LED Driver based on 800V Si L-IGBTs

Authors:
Aliyu, Attahir Murtala; Elliott, Alwyn; Pathirana, Vasantha; Udugampola, V. Nishad; Rajaguru, Pushparajah
30

Novel Partial Discharge Location Algorithm for Next Generation Power Module using Small Loop Sensors

Authors:
Maki, Jyunya; Akinaga, Yuya; Kozako, Masahiro; Hikita, Masayuki; Nakamura, Yoko; Taniguchi, Katsumi; Ikeda, Yoshinari; Okamoto, Kenji
31

Surge Current Capability of IGBTs Used in Low Voltage DC/AC Hybrid Circuit Breaker

Authors:
Askan, Kenan; Bartonek, Michael; Sobe, Klaus
32

Direct Copper Bonding (DCB) alumina substrates with preapplied solder pads for simplified die soldering and improved manufacturing yield

Authors:
Richter, Hans-Juergen; Liu, Pan; Schaefer, Michael; Fritzsche, Sebastian; Watzal, Dieter; Fery, Christophe
33

A High Efficiency and Power Density, High Step-Up, Non-isolated DC-DC Converter Based on Multicell Approach

Authors:
Andreta, Andre G.; Lamorelle, Theo; Lembeye, Yves; Kerachev, Lyubomir; Sarrafin, Farshid; Fernando, Luiz; Villa, Lavado; Crebier, Jean Christophe
34

Comparison of thermal and reliability performance between a SiC MOSFET module with embedded decoupling capacitors and commercial Si IGBT power modules

Authors:
Yang, Li; Agyakwa, Pearl; Corfield, Martin; Johnson, Mark; Harris, Anne; Packwood, Matthew; Paciura, Krzysztof
35

Reliability Design of Dual Sided Cooled Power Semiconductor Module for Hybrid and Electric Vehicles

Authors:
Wang, Yangang; Li, Yun; Liu, Xuyu; Li, Helong; Dai, Xiaoping; Wu, Yibo; Liu, Guoyou
36

A High Performance 1200 V/120 A SiC Power Module Based On a Novel Multi-DBCs Hybrid Packaging Structure

Authors:
Li, Yuxiong; Huang, Zhizhao; Chen, Lichuan; Chen, Cai; Zou, Kaifeng; Kang, Yong; Luo, Fang; Li, Sichao
37

A Novel Double Sided Cooled Leadframe Power Module for Automotive Application based on ceramic-free Substrates

Authors:
Ngoc An, Bao; Kaestner, Peter; Meisser, Michael; Leyrer, Benjamin; Demattio, Horst; Noetzel, Dorit; Scherer, Torsten; Mail, Matthias; Kolb, Johannes; Blank, Thomas; Weber, Marc; Hannemann, Thomas
38

How asymmetric busbar design causes symmetric switching behavior of paralleled IGBT modules

Authors:
Wissen, Matthias; Domes, Daniel; Brekel, Waleri; Yilmaz, Koray
39

Effects of different working frequencies on the joint formation in copper wire bonding

Authors:
Schemmel, Reinhard; Althoff, Simon; Sextro, Walter; Unger, Andreas; Hunstig, Matthias; Broekelmann, Michael
40
41

FEM based enhancement of system lifetime by improvement of the die top connection of power electronic semiconductors

Authors:
Becker, Martin; Hinrich, Andreas; Klein, Andreas; Miric, Anton Z.; Fabian, Benjamin; Schmitt, Wolfgang; Kalajica, Marko
42

In-situ condition monitoring system to study the ageing of power semi-conductor devices in photovoltaic inverters

Authors:
Dbeiss, Mouhannad; Avenas, Yvan; Zara, Henri; Dupont, Laurent
43

Investigations on the Evolution of Dynamic Ron of GaN Power Transistors during Switching Cycles

Authors:
Elharizi, Malika; Khatir, Zoubir; Lallemand, Richard; Ousten, Jean-Pierre
44

An Investigation of Frequency Response Analysis Method for Junction Temperature Estimation of SiC Power Device

Authors:
Lu, Xiang; Chen, Cuili; Al-Greer, Maher; Pickert, Volker; Tsimenidis, Charalampos
45

Lifetime Testing Method for Ceramic Capacitors for Power Electronics Applications

Authors:
Dresel, Fabian; Tham, Nils; Erlbacher, Tobias; Schletz, Andreas
46
47
48
49

Novel specimen design to test engineering plastics for power electronic applications

Authors:
Boettge, Bianca; Bernhardt, Rico; Klengel, Sandy; Wels, Sebastian; Claudi, Albert
50

A mitigation solution for bifurcations in a low-power 4-Switch Buck-Boost converter (4SBB)

Authors:
Malou, Amokrane; Allard, Bruno; Lin-Shi, Xuefang; Hijazi, Alaa; Le Men, Berengere
51

Identifying the Stray Elements of the Experimental Setup Used in the Semiconductor Datasheets

Authors:
Delhommais, Mylene; Schanen, Jean-Luc; Wurtz, Frederic; Avenas, Yvan; Rigaud, Cecile; Chardon, Sylvain
52
53
54

Thermo-mechanical stress and deformation behavior of joined semiconductor devices using different die attach technologies

Authors:
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Ebensperger, Christina; Oehling, Stefan
55
56

Improvement of Power Module System Solders by Directional Solidification

Authors:
Hutzler, Aaron; Oetzel, Christoph; Friker, Emil
57

Power Chip Interconnections Based on TLP and Sintering of CTEMatched Conductors

Authors:
Feisst, Markus; Schaetzle, Philip; Wilde, Juergen
58
59

Parasitic Extraction Procedures for SiC Power Modules

Authors:
Kovacevic-Badstuebner, Ivana; Stark, Roger; Grossner, Ulrike; Guacci, Mattia; Kolar, Johann W.
60

Applying magnetoresistive current sensors in difficult operating environments

Authors:
Slatter, Rolf; Brusius, Matthias; Glenske, Claudia
61
62

Integration Concept for a Traction Inverter with 3D-Printed Embedded Cooling Technology realizing Highest Power Density

Authors:
Schnack, Jasper; Hilper, Dominik; Schuemann, Ulf; Eisele, Ronald; Osterwald, Frank; Beer, Holger; Ebel, Thomas
63
64

Full SiC Integrated Power Converter Module with Replaceable Build-ing Blocks

Authors:
Aliyu, Attahir Murtala; Castellazzi, Alberto; Lasserrre, Philippe; Delmonte, Nicola; Cova, Paolo
65

Making Thermal Grease Obsolete: Fully Isolated Discrete Power Package with High Thermal and Electrical Performance

Authors:
Kasztelan, Christian; Basler, Thomas; Schmidt, Matthias; Pedone, Daniel; Fuergut, Edward
66

Transfer molding for power semiconductor modules

Authors:
Schuderer, Juergen; Lindstroem, Viktor; Liu, Chunlei; Mohn, Fabian
67

Thermal and thermo-mechanical design of an integrated substrate and heat sink for planar power module

Authors:
Li, Jianfeng; Lin, Xi; Dai, Jingru; Mouawad, Bassem; Johnson, Christopher Mark; Zhang, Hui; Liu, Xuejian; Huang, Zhengren
68

Design and Fabrication of PCB Embedded Power Module with Integrated Heat Exchanger for Dielectric Coolant

Authors:
Schnur, Johann; Sharma, Ankit Bhushan; Haag, Niko; Kuwan, Thomas; Stogel, Armin; Huesgen, Till
69

Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules

Authors:
Chen, Cuili; Pickert, Volker; Tsimenidis, Charalampos; Lu, Xiang; Al-Greer, Maher; Logenthiran, Thillainathan; Ng, Chong; Jia, Chunjiang
70
71

Investigation of the usage of a chip integrated sensor to determine junction temperature during power cycling tests

Authors:
Kempiak, Carsten; Lindemann, Andreas; Thal, Eckhard; Idaka, Shiori
72

On-line Virtual Junction Temperature Measurement via DC Gate Current Injection

Authors:
Brandelero, Julio; Ewanchuk, Jeffrey; Mollov, Stefan
73
74

Direct Pressed Die (DPD) Technology - a Novel Packaging Solution for Power Modules

Authors:
Goebl, Christian; Bellu, R.; Vennebusch, C.
75

PCB-Embedding for GaN-on-Si Power Devices and ICs

Authors:
Reiner, Richard; Weiss, Beatrix; Meder, Dirk; Waltereit, Patrick; Gerrer, Thomas; Quay, Ruediger; Vockenberger, Christian; Ambacher, Oliver
76

The M-Shunt Structure Applied to Printed Circuit Boards

Authors:
Boedeker, Christian; Adelmund, Melanie; Kaminski, Nando
77

An Investigation of the Parasitic Impedance on the DC-Link Capacitor of EV Drive Inverters

Authors:
Piepenbreier, Stefan; Kaess, Albert; Maerz, Martin
78
79
80

Power cycling reliability of time-reduced sintering for attaching SiC diodes using nanosilver film

Authors:
Dai, Jingru; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark
81
82

Interpretation of Power Cycling Data derived from transient Cooling Curves

Authors:
Bayer, Martin; Hartmann, Samuel; Berg, Marianne; Moody, Robert; Paques, Gontran
83

Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses

Authors:
Kozak, Joseph P.; DeVoto, Douglas J.; Major, Joshua J.; Ngo, Khai D.T.
84

Double chips low side - high side configurable full gate driver circuits for high speed inverter leg

Authors:
Crebier, Jean-Christophe; Nguyen, Van-Sang; Lefranc, Pierre; Rouger, Nicolas; Grezaud, Romain; Ayel, Francois; Saboret, Xavier; Latimier, Paul-Emile
85

Characterization of ferrite core properties for FM-band filtering in automotive applications

Authors:
Boenisch, Sven; Hoffmann, Stefan; Hoene, Eckart; Schmidhuber, Michael
86
87

Improving 9-150 kHz EMI Performance of Single-Phase PFC Rectifier

Authors:
Davari, Pooya; Blaabjerg, Frede; Hoene, Eckart; Zare, Firuz
88

Advantages of Gallium Nitride over Silicon transistors in softswitched Resonant Switched Capacitor Converters

Authors:
Serrano, Diego; Toral, Victor; Vasic, Miroslav; Oliver, Jesus Angel; Alou, Pedro; Cobos, Jose A.
89

Fabrication and Characterization of a High-Power-Density, Planar 10 kV SiC MOSFET Power Module

Authors:
DiMarino, Christina; Johnson, Mark; Mouawad, Bassem; Li, Jianfeng; Skuriat, Robert; Wang, Meiyu; Tan, Yansong; Lu, G. Q.; Boroyevich, Dushan; Burgos, Rolando
90

A 3.3 kV SiC MOSFET Half-Bridge Power Module

Authors:
Mouawad, Bassem; Hussein, Abdallah; Castellazzi, Alberto
91

Towards Wafer Level 3D Power Integration

Authors:
Charbonnier, Jean; Rat, Venceslass; Carvalho, Hamilton de; Bergogne, Dominique; Siegert, Joerg; Pressel, Klaus
92

A transfer-molded high temperature SiC power module withstanding up to 250 °C

Authors:
Mitamura, Kazuhiro; Ozaki, Yui; Murakami, Yoshinori; Takahashi, Hiroki; Tanisawa, Hidekazu; Koui, Kenichi; Kato, Fumiki; Sato, Shinji; Yamaguchi, Hiroshi; Sato, Hiroshi
93

Highly Reliable Power Modules by Pressureless Sintering

Authors:
Waltrich, Uwe; Bayer, Christoph Friedrich; Zoetl, Stephanie; Tokarski, Adam; Zischler, Sigrid; Schletz, Andreas; Maerz, Martin
94

Pressureless Silver Nanopowder Sintered Bonds for Liquid Cooled IGBT Power Modules

Authors:
Kim, Namjee; Li, Rophina; Machler, Meinrad; Burgers, John; Winkler, Sooky; Ng, Wai Tung
95

Low Temperature Silver Sinter Processes on (EN)EPEAg Surfaces for High Temperature SiC Power Modules

Authors:
Blank, Thomas; Ishikawa, Dai; An, Bao Ngoc; Scherer, Torsten; Bruns, Michael; Helber, Jessica; Leyrer, Benjamin; Wurst, Helge; Meisser, Michael; Weber, Marc
96
97
98
99

Benefits of new CoolSiCTM MOSFET in HybridPACKTM Drive package for electrical drive train applications.

Authors:
Jakobi, Waldemar; Uhlemann, Andre; Thoben, Markus; Schweikert, Christian; Strenger, Christian; Pai, Ajay Poonjal; Beaurenaut, Laurent; Muenzer, Mark
100

Advanced Die-attach by Metal-powder Sintering: The Science and Practice

Authors:
Lu, Guo-Quan; Wang, Meiyu; Mei, Yunhui; Li, Xin
101

10 kV SiC Power Module Packaging

Authors:
Johnson, Mark; DiMarino, Christina; Mouawad, Bassem; Li, Jianfeng; Skuriat, Robert; Wang, Meiyu; Tan, Yansong; Lu, G. Q.; Burgos, Rolando
102

Power Electronic Integration and packaging for aeronautic application in harsh environment

Authors:
Meuret, Regis; Martineau, Donatien; Youssef, Toni; Martin, Christian; Yade, Ousseynou
103

Innovative Reliable Nitride based Power Devices and Applications ‒ The EU Public Funded Project ‘InRel-NPower‘

Authors:
Rittner, Martin; Kessler, Ulrich; Naundorf, Joerg; Kriegel, Kai; Schulz, Martin; Meneghesso, Gaudenzio