Power Engineering Society within VDE (ETG) (Hrsg.)

ETG-Fb. 133: CIPS 2012

7th International Conference on Integrated Power Electronics Systems, Proceedings March, 6 - 8, 2012 Nuremberg / Germany

ETG-Fachberichte

2012, 478 Seiten, Din A4, Broschur
ISBN 978-3-8007-3414-6
Beigefügt: CD
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis

As in the previous years CIPS is organized as a stand alone conference, while in 2004 and 2006 it was held in conjunction with the International Symposium on Power Semiconductor Devices and Integrated Circuits, ISPSD-2006, and the IEEE PESC 2004. CIPS 2012 is organized by ETG, the Power Engineering Society within VDE and co-organized by ECPE, the European Center for Power Electronics.

1

Advanced Cooling for Power Electronics

Autoren: Kang, Sukhvinder S.

2

Electromagnetic Modeling of EMI Input Filters

Autoren: Kovacevic, Ivana; Müsing, Andreas; Friedli, Thomas; Kolar, Johann. W.

3

4

Comparative Evaluation of Individual and Coupled Inductor Arrangements for Input Filters of PV Inverter Systems

Autoren: Cougo, Bernardo; Friedli, Thomas; Boillat, David O.; Kolar, Johann W.

5

Analysis and Reduction of Radiated EMI of Power Modules

Autoren: Domurat-Linde, André; Hoene, Eckart

6

7

Integrated Power Electronics Interface for Plug-In Hybrid Electric Vehicle Applications

Autoren: Hegazy, Omar; Mierlo, Joeri Van; Lataire, Philippe; Baghdadi, Mohamed El

8

9

Reliability driven virtual prototyping of power electronic equipment - a case study

Autoren: Huesgen, Till; Riedel, Gernot J.; Drofenik, Uwe

10

New Methods Help Better Evaluate Risks Via Simulation

Autoren: Schingale, Angelika; Wolf, Daniela; Schießl, Andreas; Tarnovetchi, Marius

11

Separating Failure Modes in Power Cycling Tests

Autoren: Schmidt, Ralf; Scheuermann, Uwe

12

In-situ Bond Wire and Solder Layer Health Monitoring Circuit for IGBT Power Modules

Autoren: Ji, Bing; Pickert, Volker; Zahawi, Bashar

13

14

Lifetime Evaluation of IGBT Power Modules Applying a Nonlinear Saturation Voltage Observer

Autoren: Wagenitz, Dennis; Hambrecht, Andreas; Dieckerhoff, Sibylle

15

Influence of thermal cross-couplings on power cycling lifetime of IGBT power modules

Autoren: Poller, Tilo; D'Arco, Salvatore; Hernes, Magnar; Lutz, Josef

16

Combined Reliability Testing: An approach to assure reliability under complex loading conditions

Autoren: Wittler, Olaf; Jaeschke, Johannes; Bochow-Neß, Olaf; Middendorf, Andreas; Lang, Klaus-Dieter

17

System Approach for Reliability of Low-power Power Electronics; How to Break Down into Their Constructed Parts

Autoren: Tarashioon, S.; Tarashioon, S.; Driel, W. D. van; Zhang, G. Q.

18

Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors

Autoren: Goehre, Jens; Geißler, Ute; Schneider-Ramelow, Martin; Lang, Klaus-Dieter

19

Microstructural and Mechanical Characterization of Ceramic Substrates with Different Metallization for Power Applications

Autoren: Böttge, Bianca; Klengel, Sandy; Schischka, Jan; Lorenz, Georg; Knoll, Heiko

20

Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

Autoren: Riedel, G. J.; Schmidt, R.; Liu, C.; Beyer, H.; Alaperä, I.

21

Effect of Input Power Interruptions on Power Electronics Reliability

Autoren: Pippola, J.; Frisk, L.; Kokko, K.; Kiilunen, J.; Marttila, T.

22

Efficient nonlinear inductors for PV inverters and active PFC

Autoren: Stadler, Alexander; Gulden, Christof

23

24

25

Laminated Bus Bar Structure for Low Induced Noise

Autoren: Ariga, Zen-nosuke; Wada, Keiji

26

27

Micro-fabricated thin-film inductors for on-chip power conversion

Autoren: Harburg, Daniel V.; Yu, Xuehong; Herrault, Florian; Levey, Christopher G.; Allen, Mark G.; Sullivan, Charles R.

28

29

An Improved Parasitic Capacitance Cancellation Method for Planar Differential Mode Inductor in EMI Filters

Autoren: Tan, Wenhua; Margueron, Xavier; Duquesne, Thierry; Idir, Nadir

30

Hybrid Integrated EMC filter for CM and DM EMC Suppression in a DC-DC Power converter

Autoren: Ali, Marwan; Laboure, Eric; François Costa,; Revol, Bertrand; Gautier, Cyrille

31

Integrated High Power Modules

Autoren: Johnson, C. Mark; Castellazzi, Alberto; Skuriat, Robert; Evans, Paul; Li, Jianfeng; Agyakwa, Pearl

32

Alternative lead free die attach for power module packaging

Autoren: Morelle, Jean Michel; Tan, Ky Lim; Vivet, Laurent; Leon, Renan; Lavrentieff, Serge

33

Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure

Autoren: Liang, Zhenxian; Ning, Puqi; Wang, Fred; Marlino, Laura

34

New assembly and interconnect technologies for power modules

Autoren: Guth, K.; Oeschler, N.; Böwer, L.; Speckels, R.; Strotmann, G.; Heuck, N.; Krasel, S.; Ciliox, A.

35

Direct cooled modules - integrated heat sinks

Autoren: Hohlfeld, Olaf; Herbrandt, Alexander

36

Stacked substrates for high voltage applications

Autoren: Hohlfeld, Olaf; Bayerer, R.; Hunger, Th.; Hartung, H.

37

SiC and GaN Devices - Competition or Coexistence?

Autoren: Kaminski, Nando; Hilt, Oliver

38

Holistic Approach to Maximize Power Density in Industrial Inverter Designs

Autoren: Schulz, Martin; Lillo, Liliana De; Empringham, Lee

39

Integrated Anti-Short-Circuit Safety Circuit in CMOS SOI for Normally-On JFET

Autoren: Falahi, Khalil El; Dubois, Fabien; Bergogne, Dominique; Risaletto, Damien; Allard, Bruno

40

Electrical Analysis and Packaging Solutions for High-Current Fast-Switching SiC Components

Autoren: Mermet-Guyennet, Michel; Castellazzi, Alberto; Fabre, Joseph; Fabre, Joseph; Ladoux, Philippe

41

Design of an integrated power converter in Wide Band Gap for harsh environments

Autoren: Mogniotte, Jean-Francois; Tournier, Dominique; Bevilacqua, Pascal; Godignon, Philippe; Planson, Dominique

42

43

3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules

Autoren: Mouawad, Bassem; Buttay, Cyril; Soueidan, Maher; Morel, Hervé; Allard, Bruno; Fabrègue, Damien; Bley, Vincent

44

45

Low-pressure (< 5 MPa) Low-temperature Joining of Large-area Chips on Copper Using Nanosilver Paste

Autoren: Zheng, Hanguang; Zheng, Hanguang; Calata, Jesus; Calata, Jesus; Ngo, Khai; Ngo, Khai; Luo, Susan; Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan

46

Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

Autoren: Wereszczak, Andrew A.; Vuono, Daniel J.; Liang, Zhenxian; Fox, Ethan E.

47

48

Planar Interconnect Technology for Power Module System Integration

Autoren: Weidner, K.; Kaspar, M.; Seliger, N.

49

50

51

52

Scalable High Insulation Power Supply for Medium Voltage Power Converters

Autoren: Aizpuru, Iosu; Canales, Jose María; Fernández, Jesus

53

Amplitude Modulated Resonant Push-Pull Driver for Piezoelectric Transformers in Switching Power Applications

Autoren: Schwarzmann, Holger; Erlbacher, Tobias; Bauer, Anton J.; Ryssel, Heiner; Frey, Lothar; Frey, Lothar

54

55

Thermal Management Concepts for Power Sandwich Industrial Drive

Autoren: Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.

56

Reliable Integration of Double-Sided Cooled Stacked Power Switches based on 70 µm Thin IGBTs and Diodes

Autoren: Li, J. F.; Castellazzi, A.; Solomon, A.; Johnson, C. M.

57

Influence of baseplate design on cooling performance and reliability

Autoren: Kriegel, Kai; Komma, Thomas; Kiffe, Walter; Levchuk, Svetlana; Otto, Johann

58

59

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications

Autoren: Zürcher, J.; Goicochea, J.; Matsumoto, K.; Michel, B.; Brunschwiler, T.

60

Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications

Autoren: Rastjagaev, Eugen; Wilde, Jürgen; Wielage, Bernhard; Grund, Thomas; Kümmel, Sabine

61

62

63

Design Considerations of Very Low Profile Coupled Inductors for Flexible Photovoltaic Module

Autoren: Ouyang, Z.; Acanski, M.; Popovic, J.; Ferreira, J. A.; Thomsen, O. C.; Andersen, M. A. E.

64

Design of a PCB Rogowski Coil based on the PEEC Method

Autoren: Guillod, T.; Gerber, D.; Biela, J.; Müsing, A.

65

Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique

Autoren: Li, Jiping; Ngo, Khai D. T.; Lu, Guo-Quan; Xie, Huikai

66

Hybrid Hydraulic Piezo Actuator and its Control for Camless Internal Combustion Engines

Autoren: Mercorelli, Paolo; Werner, Nils; Becker, Udo; Harndorf, Horst

67

68

EMI Prediction of Power Converters using Switching Waveform Analysis

Autoren: Schulz, Sebastian; Kanschat, Peter; Lindemann, Andreas

69

70

71

How to Control SiC BJT with High Efficiency?

Autoren: Wang, Luyu; Bängtsson, Hans

72

Application of eGaN FETs for highly efficient Radio Frequency Power Amplifier

Autoren: Cucak, D.; Vasic, M.; García, O.; Oliver, J. A.; Alou, P.; Cobos, J. A.

73

Sinter materials for broad process windows in DCB packages - concepts and results

Autoren: Schmitt, Wolfgang; Fritzsche, Sebastian; Thomas, Muriel

74

Quality evaluation for silver sintering layers in power electronic modules

Autoren: Rudzki, Jacek; Jensen, Lars; Poech, Max; Schmidt, Lothar; Osterwald, Frank

75

Evaluation of silver-sintering die attach

Autoren: Sabbah,  W.; Sabbah,  W.; Sabbah,  W.; Riva, R.; Hascoët,  S.; Buttay,  C.; Azzopardi,  S.; Woirgard,  E.; Planson,  D.; Allard,  B.; Meuret, R.