VDE e.V.; ETG (Hrsg.)

ETG-Fb. 141: CIPS 2014

8th International Conference on Integrated Power Electronics Systems, Proceedings February, 25-27, 2014 Nuremberg/Germany

ETG-Fachberichte

2014, 522 Seiten, Din A4, Broschur
ISBN 978-3-8007-3578-5
Beigefügt: CD
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis

The CIPS 2014 event is held to be a technical and scientific forum for engineers and researchers engaged in all the aspects of hybrid integration and reliability of power electronics systems.

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A proposal of embedded SoC power supply compatible with a digital block design flow

Autoren: Souvignet, Thomas; Allard, Bruno; Trochut, Severin; Hasbani, Frederic

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Ultra-low Power Autonomous Power Management System with Effective Impedance Matching for RF Energy Harvesting

Autoren: Adami, Salah-Eddine; Vollaire, Christian; Allard, Bruno; Costa, François; Haboubi, Walid; Cirio, Laurent

5

GaN Power Semiconductors for PV Inverter Applications – Opportunities and Risks

Autoren: Stubbe, Thorsten; Mallwitz, Regine; Rupp, Roland; Pozzovivo, Gianmauro; Bergner, Wolfgang; Haeberlen, Oliver; Kunze, Mike

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Design of Photovoltaic Microinverter for Off-Grid and Grid-Parallel Applications

Autoren: Felgemacher, Christian; Jaeger, Philipp; Kobeissi, Ali; Pfeiffer, Jonas; Wiegand, Dennis; Kruschel, Wolfram; Dombert, Benjamin; Vasconcelos Araújo, Samuel; Zacharias, Peter

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An Improved Method of Controlling IGBT Modules Using an Optimized Gate Current Waveform

Autoren: Cenusa, Marius; Cretu, Gabriel; Pfost, Martin

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Impact of the control on the size of the output capacitor in the integration of Buck converters

Autoren: Cortes, Jorge; Švikovic, Vladimir; Alou, Pedro; Oliver, Jesús A.; Cobos, José A.

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Power Semiconductor Packaging in PV Inverters up to 30 kW power, a difficult choice

Autoren: Hinze, Juliane; Zacharias, Peter; Araujo, Samuel; Friebe, Jens; Leifert, Torsten

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Data-driven Modeling of the Ultrasonic Softening Effect for Robust Copper Wire Bonding

Autoren: Unger, Andreas; Sextro, Walter; Althoff, Simon; Meyer, Tobias; Neumann, Klaus; Reinhart, René Felix; Broekelmann, Michael; Guth, Karsten; Bolowski, Daniel

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Influence of nickel-phosphorus surface roughness on both wettability and pores formation in solder joints for high power electronic applications

Autoren: Vivet, L.; Joudrier, A.-L.; Tan, K.-L.; Morelle, J.-M.; Etcheberry, A.; Chalumeau, L.

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Challenges on Diagnostics of Power Electronics Modules and Assemblies

Autoren: Albrecht, H.-J.; Busche, N.; Strogies, J.; Wilke, K.; Schuster, M.; Cassigniol, C.

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Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints

Autoren: Wang, Yun; Li, Jianfeng; Agyakwa, Pearl; Johnson, Christopher Mark; Li, Shuguang; Wang, Yun; Wang, Yun

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Robustness study of solder joints of different compositions by using Stochastic Finite Element Modeling

Autoren: Aoues, Younes; Makhloufi, Abderahman; Pougnet, Philippe; El-Hami, Abdelkhalak

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Internal degradation monitoring of power devices during power cycling test

Autoren: Watanabe, Akihiko; Tsukuda, Masahiro; Omura, Ichiro

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Characterization of different wire bonding materials during passive thermal test

Autoren: Cosiansi, Fernando; Mattiuzzo, Emilio; Turnaturi, Marcello; Thomas, Sven; Koetter, Steffen

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Manufacturability and Reliability Assessment of Power Sandwich Technology

Autoren: Josifovic, I.; Huesgen, T.; Mengotti, E.; Popovic-Gerber, J.; Ferreira, J.A.; Drofenik, U.

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Reliability Prediction Approach of DC-DC Converter with Electrical Stress Analysis

Autoren: Kim, Jemin; Choi, Sungsoon; Lee, Kwanhun; Lee, Kwanhun

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A Multi-Disciplinary Virtual Prototyping Design Tool for Power Electronics

Autoren: Evans, P. L.; Castellazzi, A.; Johnson, C. M.

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Evolution of Electrical Performance in New Generation of SiC MOSFET for High Temperature Applications

Autoren: Ouaida, Rémy; Calvez, Cyril; Podlejski, Anne-Sophie; Brosselard, Pierre; Ouaida, Rémy

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Technology, industry and market trends in WBG power module packaging

Autoren: Roussel, Philippe; Azemar, Jerome

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Novel Layout and Packaging for Lateral, Low-Resistance GaN-on-Si Power Transistors

Autoren: Reiner, R.; Waltereit, P.; Benkhelifa, F.; Walcher, H.; Quay, R.; Schlechtweg, M.; Ambacher, O.

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High Temperature Discrete Integrated Coreless Signal Insulator

Autoren: Bergogne, Dominique; Martin, Christian; Allard, Bruno; El Falahi, Khalil; Picun, Gonzalo; Ezzeddine, Hilal; Pintout, Cedric

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Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules

Autoren: Uhlemann, Andre; Fath, Thorsten; Hymon, Erwin

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Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery

Autoren: Gschwend, Dominic; Tick, Timo; Oggioni, Stefano; Paredes, Stephan; Matsumoto, Keiji; Tiwari, Manish K.; Poulikakos, Dimos; Brunschwiler, Thomas

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A Simple Method to Evaluate Substrate Layout for Power Modules

Autoren: Zhu, Nan; Chen, Min; Xu, Dehong

29

Planar, double-layer magnetic inductors for low power, high frequency DC-DC converters

Autoren: Haddad, Elias; Martin, Christian; Joubert, Charles; Allard, Bruno; Buttay, Cyril; Tannous, Tony Abi; Bevilacqua, Pascal

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High-throughput DBC-assembled IGBT screening for power module

Autoren: Tsukuda, Masanori; Okoda, Seiichi; Noda, Ryuzo; Tashiro, Katsuji; Omura, Ichiro; Tsukuda, Masanori

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Power cycling capability of Modules with SiC-Diodes

Autoren: Herold, Ch.; Schaefer, M.; Sauerland, F.; Poller, T.; Lutz, J.; Schilling, O.

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A real time measurement of junction temperature variation in high power IGBT modules for wind power converter application

Autoren: Ghimire, Pramod; Pedersen, Kristian Bonderup; Vega, Angel Ruiz de; Rannestad, Bjorn; Munk-Nielsen, Stig; Thogersen, Paul Bach

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Thermal path integrity monitoring for IGBT power electronics modules

Autoren: Eleffendi, Mohd. Amir; Johnson, C. Mark

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Reliability assessment of molded Smart Power Modules

Autoren: Thomas, Tina; Becker, Karl-Friedrich; Dijk, Marius van; Wittler, Olaf; Braun, Tanja; Bauer, Joerg; Lang, Klaus-Dieter

37

Microstructural study of the fatigue mechanism of aluminum cladded copper wires

Autoren: Naumann, Falk; Maerz, Benjamin; Klengel, Robert; Schischka, Jan; Petzold, Matthias

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Aging of new Interconnect-Technologies of Power-Modules during Power-Cycling

Autoren: Heuck, N.; Guth, K.; Thoben, M.; Mueller, A.; Oeschler, N.; L. Boewer; Speckels, R.; Krasel, S.; Ciliox, A.

39

High resolution failure analysis of silver-sintered contact interfaces for power electronics

Autoren: Boettge, Bianca; Maerz, Benjamin; Schischka, Jan; Klengel, Sandy; Petzold, Matthias

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A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography

Autoren: Agyakwa, Pearl A.; Yang, Li; Corfield, Martin R.; Johnson, C. Mark

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Power Supply with Integrated PassivEs - The EU FP7 PowerSwipe Project

Autoren: Mathuna, Cian O.; Wang, Ningning; Kulkarni, Santosh; Anthony, Ricky; Cordero, Nicolas; Oliver, Jesus; Alou, Pedro; Svikovic, Vladimir; Cobos, Jose Antonio; Cortes, Jorge; Neveu, Florian; Martin, Christian; Allard, Bruno; Voiron, Frederic; Knott, Bernhard; Sandner, Christoph; Maderbacher, Gerhard; Pichler, Joachim; Agostinelli, Matteo; Anca, Anamaria; Breig, Markus; Mathuna, Cian O.; Anthony, Ricky

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Review of high frequency, highly integrated inductive DC-DC converters

Autoren: Neveu, F.; Martin, C.; Allard, B.

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Losses Comparison of Gallium Nitride and Silicon Transistors in a High Frequency Boost Converter

Autoren: Wang, Wenbo; Pansier, Frans; Haan, S. W. H. de; Ferreira, J. A.

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3D Packaging for vertical power devices

Autoren: Rouger, N.; Widiez, J.; Benaissa, L.; Imbert, B.; Gondcharton, P.; Letowski, B.; Crebier, JC.; Letowski, B.

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Scalable high frequency converters for motor drives based on switching cells

Autoren: Schulz, Martin; Kapaun, Florian; Marquardt, Rainer

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Integrated gate driver circuits with an ultra-compact design and high level of galvanic isolation for power transistors

Autoren: To, N.-D.; Rouger, N.; Arnould, J.-D.; Corrao, N.; Crebier, J.-C.; Lembeye, Y.

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Foil Based Transient Liquid Phase Bonding as a Die-Attachment Method for High Temperature Devices

Autoren: Bajwa, A. A.; Qin, Y. Y.; Zeiser, R.; Wilde, J,

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Partial transient liquid phase bonding for high-temperature power electronics using Sn/Zn/Sn sandwich structure solder

Autoren: Park, S. W.; Nagao, S.; Sugahara, T.; Katoh, Y.; Ishino, H.; Sugiura, K.; Suganuma, K.

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Is Conductive Adhesive Bonding Suited for the Die-Attachment of Power Devices?

Autoren: Ocklenburg, Johanna; Rastjagaev, Eugen; Moeller, Eike; Wilde, Juergen

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Conducted EMI and Systems Integration

Autoren: Boroyevich, Dushan; Zhang, Xuning; Bishinoi, Hemant; Burgos, Rolando; Mattavelli, Paolo; Wang, Fred

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Power Electronics for Renewable Energy Systems – Status and Trends

Autoren: Blaabjerg, Frede; Ma, Ke; Yang, Yongheng

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System Integration of GaN Converters – Paradigm Shift – Challenges and Opportunities

Autoren: Popovic, J.; Ferreira, J. A.; Wyk, J. D. van; Pansier, F.

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Analyzing the State of Health of Diode Layers by using Structure Functions

Autoren: Richter, Martin; Kopp, Michael; Schroth, Ruediger; Lutz, Josef

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Electro – Thermal Simulations and Experimental Results on the Surge – Current Capability of 1200 V SiC MPS Diodes

Autoren: Fichtner, Susanne; Lutz, Josef; Basler, Thomas; Rupp, Roland; Gerlach, Rolf

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Power Modules with Increased Power Density and Reliability Using Cu Wire Bonds on Sintered Metal Buffer Layers

Autoren: Rudzki, Jacek; Becker, Martin; Eisele, Ronald; Poech, Max; Osterwald, Frank

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New power-module structures consisting of both Cu and Al bonded to AlN substrates with an Al base plate

Autoren: Terasaki, Nobuyuki; Nagatomo, Yoshiyuki; Nagase, Toshiyuki; Kuromitsu, Yoshirou

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Influence of Cu/Ni(P) Metallized Si3N4 Ceramic Substrate in Bond Reliability of Power Components at 250 °C

Autoren: Lang, Fengqun; Yamaguchi, Hiroshi; Nakagawa, Hiroshi; Sato, Hiroshi

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DCB-based low-inductive SiC modules for high frequency operation

Autoren: Meisser, Michael; Hamilton, Dean; Mawby, Philip

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1200 V-360 A SiC Power Module with Phase Leg Clustering Concept for Low Parasitic Inductance and High Speed Switching

Autoren: Takao, Kazuto; Shinohe, Takashi; Yamamoto, Takashi; Hasegawa, Kohei; Ishida, Masaaki

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Comparison of thermo-mechanical reliability of high-temperature bonding materials for attachment of SiC devices

Autoren: Li, Jianfeng; Yaqub, Imran; Corfield, Martin; Agyakwa, Pearl; Johnson, Christopher Mark

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Robust Top Side Contact Technology on Power Semiconductors – Results from the Public Funded Project ‘ProPower’

Autoren: Rittner, Martin; Gross, David; Guyenot, Michael; Guenther, Michael; Haag, Sabine; Kaden, Thomas; Reinold, Manfred; Thoben, Markus; Stegmeier, Stefan; Weidner, Karl; Kock, Mathias

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Packaging Very Fast Switching Semiconductors

Autoren: Hoene, Eckart; Ostmann, Andreas; Marczok, Christoph

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Multi-chip circuit designs for silicon carbide power electronics

Autoren: Nee, Hans-Peter; Rabkowski, Jacek; Peftitsis, Dimosthenis

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Present and Future of GaN Power Devices

Autoren: Ueda, Daisuke; Fukuda, Takeshi; Nagai, Shuichi; Sakai, Hiroyuki; Otsuka, Nobuyuki; Morita, Tatsuo; Negoro, Noboru; Ueda, Tetsuzo; Tanaka, Tsuyoshi