ETG – Energietechnische Gesellschaft im VDE (ETG) (Hrsg.)

ETG-Fb. 148: CIPS 2016

9th International Conference on Integrated Power Electronics Systems, Proceedings March, 8 – 10, 2016, Nuremberg/Germany

ETG-Fachberichte

2016, 586 Seiten, Slimlinebox, CD-Rom
ISBN 978-3-8007-4171-7
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis Vorwort

The Conference focus is today more important than ever, with the issue of increasing energy efficiency and system reliability by decreasing costs.
Energietechnische Gesellschaft im VDE (ETG)
Die ETG bündelt im VDE die Fachkompetenz der Elektrischen Energietechnik von der Erzeugung, Übertragung, Verteilung bis hin zu den vielfältigen Anwendungsfeldern in Fachbereichen und Fachausschüssen. Ungefähr 300 Experten aus Industrie, Forschung, Versorgungsunternehmen, Hochschulen und Behörden sind dort ehrenamtlich tätig und bilden damit die technisch-wissenschaftliche Basis für die Aktivitäten der ETG.

1

Highly integrated SiC module with thick-film dielectric allows for high frequency operation

Autoren: Meisser, Michael; Schmenger, Max; Bernd, Martin; Leyrer, Benjamin; Demattio, Horst; Hamilton, Dean; Mawby, Philip; Blank, Thomas

2

Case Sensitive Condition Monitoring of an IGBT Inverter in a Hybrid Car

Autoren: Denk, Marco; Bakran, Mark-M.; Schafferhans, Stephan

3

Life-time modeling of DBC-based MOSFET-power modules

Autoren: Faust-Ellsaesser, Carmen; Proepper, Thomas; Riester, Konrad; Duerr, Johannes

4

PCB Embedded Power Electronics for Low Voltage Applications

Autoren: Kearney, Daniel; Kicin, Slavo; Bianda, Enea; Krivda, Andrej; Bauman, David

5

A Parametric Layout Study of Radiated Emission from High-Frequency Half-Bridge Switching Cells

Autoren: Seliger, Norbert; Stubenrauch, Franz; Schmitt-Landsiedel, Doris

6

Requirements of short-circuit detection methods and turn-off for wide band gap semiconductors

Autoren: Maerz, Andreas; Bertelshofer, Teresa; Horff, Roman; Bakran, Mark-M.

7

8

Damage protection of power modules

Autoren: Hohlfeld, Olaf

9

10

An Overview of Advanced Power Semiconductor Packaging for Automotive System

Autoren: Wang, Yangang; Dai, Xiaoping; Liu, Guoyou; Li, Daohui; Jones, Steve

11

12

Dimensioning of a Novel Design Concept for MMC Submodules

Autoren: Waltrich, U.; Ruccius, B.; Malipaard, D.; Schletz, A.; Maerz, M.

13

Mechanical properties of silver sintered bond lines: Aspects for a reliable material data base for numerical simulations

Autoren: Letz, Sebastian; Hutzler, Aaron; Waltrich, Uwe; Zischler, Sigrid; Schletz, Andreas

14

Enhancing partial discharge inception voltage of DBCs by geometrical variations based on simulations of the electric field strength

Autoren: Bayer, Christoph Friedrich; Waltrich, Uwe; Schneider, Richard; Soueidan, Amal; Baer, Eberhard; Schletz, Andreas

15

16

17

Experimental Evaluation of IGBT Junction Temperature Measurement via a Modified-VCE (ΔVCE_ΔVGE) Method with Series Resistance Removal

Autoren: Baker, Nick; Iannuzzo, Francesco; Munk-Nielsen, Stig; Dupont, Laurent; Avenas, Yvan

18

Low Temperature Bonding Technology for 250 °C-Operating SiC Power Modules Using Nano-Composite Cu/Sn Paste

Autoren: Lang, Fengqun; Kato, Fumiki; Nakagawa, Hiroshi; Yamaguchi, Hiroshi; Sato, Hiroshi; Kimura, Ryuji; Ikeda, Hiroaki; Shimokawa, Koichi; Tamaki, Rei; Sekine, Shigenobu

19

Low Temperature Silver Sinter Processes on ENIG Surfaces

Autoren: Blank, T.; Bruns, M.; Kuebel, C.; Leyrer, B.; Meisser, M.; Weber, M.; Rudzki, J.; Osterwald, F.; Wilke, K.; Busche, N.; Eisele, R.

20

Processing and Properties of Chip-bonding on Copper by Low-temperature Sintering a Nanosilver Paste

Autoren: Zheng, Hanguang; Gao, Shan; Ngo, Khai; Lu, Guo-Quan; Lu, Guo-Quan

21

Evaluation of electrochemical migration into an isolated sintered power module

Autoren: Cosiansi, Fernando; Mattiuzzo, Emilio; Turnaturi, Marcello; Candido, Pirri Fabrizio

22

Dual-Side Ceramic Power Module for Fast Switching Silicon Carbide Transistors

Autoren: Mueter, U.; Luerkens, P.; Garcia i Tormo, A.; Bast, M.; Hoffmann, K.F.; Eisele, R.

23

Passive thermal cycling of power diodes under controlled atmospheric conditions - effects on metallization degradation

Autoren: Brincker, Mads; Bonderup Pedersen, Kristian; Kristensen, Peter Kjaer; Popok, Vladimir

24

400 A, 1200 V SiC power module with 1nH commutation inductance

Autoren: Beckedahl, Peter; Buetow, Sven; Maul, Andreas; Roeblitz, Martin; Spang, Matthias

25

Enhancement of the partial discharge inception voltage of DBCs by adjusting the permittivity of the encapsulation

Autoren: Bayer, Christoph Friedrich; Waltrich, Uwe; Soueidan, Amal; Schneider, Richard; Baer, Eberhard; Schletz, Andreas

26

Monitoring of IGBT modules - temperature and degradation simulation

Autoren: Bonderup Pedersen, Kristian; Brincker, Mads; Ghimire, Pramod; Pedersen, Kjeld

27

Influence of wire material and diameter on the reliability of Al-H11, Al-CR, Al-R and AlX heavy wire bonds during power cycling

Autoren: Ehrhardt, Christian; Geissler, Ute; Hoefer, Jan; Broll, Marian; Schneider-Ramelow, Martin; Lang, Klaus-Dieter; Schmitz, Stefan

28

29

30

High heat dissipation and high heat durability technologies for transfer-molded power modules with insulating sheets

Autoren: Nishimura, Takashi; Mimura, Kenji; Yamamoto, Kei; Idaka, Shiori; Shinohara, Toshiaki

31

Application-specific micro Rogowski coil for power modules - Design tool, novel coil pattern and demonstration

Autoren: Koga, M.; Tsukuda, M.; Tsukuda, M.; Nakashima, K.; Omura, I.

32

Silver Sintering at Low Temperatures Without Using Pressure: An Approach for Joining Large Area Copper-to-Copper Interconnects

Autoren: Oestreicher, Annerose; Lerch, Martin; Rabay, Battist; Roehrich, Tobias

33

34

Towards Highly Integrated, Automotive Power SoCs Using Capacitors Operating at 100 V implemented in TSV

Autoren: Gruenler, S.; Rattmann, G.; Erlbacher, T.; Bauer, A. J.; Krach, F.; Frey, L.

35

36

Wear optimized consumables for copper wire bonding in industrial mass production

Autoren: Broekelmann, Michael; Siepe, Dirk; Hunstig, Matthias; Guth, Karsten; Schnietz, Mark

37

38

Simulation of the Lifetime of Wire Bonds Modified through Wedge Trenches for Higher Reliability

Autoren: Grams, Arian; Ehrhardt, Christian; Jaeschke, Johannes; Middendorf, Andreas; Wittler, Olaf; Lang, Klaus-Dieter

39

Non-Destructive Assessment of Reliability and Quality related Properties of Power Electronic Devices for the In-Line Application of Scanning Acoustic Microscopy

Autoren: Brand, Sebastian; Naumann, Falk; Tismer, Sebastian; Boettge, Bianca; Rudzki, Jacek; Osterwald, Frank; Petzold, Matthias

40

Influence of the Magnetic’s Parasitic Capacitance in the switching of High-Voltage Cascode GaN HEMT

Autoren: Galanos, N.; Popovic, J.; Ferreira, J. A.; Gerber, M.

41

Microstructure and thermophysical characterization of innovative plastic materials for power electronics

Autoren: Klengel, S.; Boettge, B.; Naumann, F.; Mittag, M.; Hirsch, U.; Ehrich, C.

42

Full SiC power module with substrate integrated liquid cooling for battery electric vehicles

Autoren: An, Bao Ngoc; Bernd, Martin; Leyrer, Benjamin; Blank, Thomas; Weber, Marc; Loges, Andre; Wetzel, Thomas; Kolb, Johannes

43

Innovative monolithic RC-snubber for fast switching power modules

Autoren: Krach, Florian; Heckel, Thomas; Frey, Lothar; Bauer, Anton J.; Erlbacher, Tobias; Maerz, Martin

44

Considerations on the influence of the current ripple and switching frequency towards the differential mode EMI filter

Autoren: Schittler, Andressa C.; Kleeb, Thiemo; Kazanbas, Mehmet; Araujo, Samuel V.; Zacharias, Peter

45

IGBT Online-Temperature Monitoring using Turn-Off Delay as a Temperature Sensitive Electrical Parameter

Autoren: Felgemacher, Christian; Dombert, Benjamin; Noeding, Christian; Zacharias, Peter

46

Loss evaluation of GaN GIT in a high frequency boost converter in different operation modes

Autoren: Wang, Wenbo; Pansier, Frans; Popovic, Jelena; Ferreira, J. A.

47

Potential failure risks causing delamination of sinter joints

Autoren: Boettge, Bianca; Reissaus, Stephan; Klengel, Sandy

48

49

Power Cycling Tests in High Temperature Conditions of SiC-MOSFET Power Modules and Ageing Assessment

Autoren: Ibrahim, A.; Ousten, J. P.; Lallemand, R.; Khatir, Z.

50

Evaluation of Cycling Stress Imposed on IGBT Modules in PV Central Inverters in Sunbelt Regions

Autoren: Felgemacher, Christian; Araujo, Samuel; Noeding, Christian; Zacharias, Peter; Ehrlich, Alexander; Schidleja, Martin

51

Mechanical Reliability of Power Electronic Systems

Autoren: Schriefer, T.; Hofmann, M.

52

Adaptive, Iterative Closed-Loop Control for the Turn-on of IGBTs with Improved Efficiency

Autoren: Cenusa, Marius; Cretu, Gabriel; Pfost, Martin

53

Thermal Performance of High-Temperature Stable Die-Attachments for GaN HEMTs

Autoren: Bajwa, A. A.; Reiner, R.; Quay, R.; Wilde, J.

54

Integrated High-Temperature Isolation barrier with Coreless Transformer

Autoren: Perrin, Remi; Allard, Bruno; Martin, Christian; Buttay, Cyril

55

A Health Monitoring Framework for IGBT Power Modules

Autoren: Eleffendi, Mohd. Amir; Johnson, C. Mark

56

Low inductance 2.5 kV packaging technology for SiC switches

Autoren: Mouawad, Bassem; Li, Jianfeng; Castellazzi, Alberto; Johnson, C. Mark; Erlbacher, Tobias; Friedrichs, Peter

57

58

59

60

Integrated converter network for active balancing structure of battery

Autoren: Phung, Thanh Hai; Mestrallet, Fabien; Vladimirova, Kremena; Collet, Alexandre; Kerachev, Lyubomir; Lembeye, Yves; Crebier, Jean-Christophe

61

Optimization of a Gallium Nitride HEMT design for a high frequency DC-DC converter application

Autoren: Cucak, D.; Vasic, M.; Garcia, O.; Oliver, J. A.; Alou, P.; Cobos, J. A.

62

High temperature thermal cycling performance of DBA, AMB and thick film power module substrates

Autoren: Hamilton, Dean. P.; Riches, Steve; Meisser, Michael; Mills, Liam; Mawby, Philip

63

High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints

Autoren: Hamilton, Dean. P.; Syed-Khaja, Aarief; Franke, Joerg; Mawby, Philip

64

65

66

Metallurgical structure of lead free solder alloy to improve the reliability of power module

Autoren: Tan, K.-L.; Morelle, J.-M.; Vivet, L.; Lavrentieff, S.

67

Rapid Sintering of Nanosilver Paste Using Current for attaching IGBT Chips

Autoren: Feng, Shuang-Tao; Mei, Yun-Hui; Li, Xin; Lu, Guo-Quan

68

Electrothermal Considerations for Power Cycling in SiC Technologies

Autoren: Ortiz Gonzalez, Jose Angel; Alatise, Olayiwola; Nobeen, Nadeesh; Hu, Ji; Ran, Li; Mawby, Phil

69

Investigations of Power Semiconductor Modules using Conductive Adhesive for Chip Assembly

Autoren: Grieger, Folkhart; Middelstaedt, Lars; Lindemann, Andreas; Moeller, Eike; Wilde, Juergen

70

71

72

Magnetic flux signal simulation with 16-channel sensor array to specify accurate IGBT current distribution

Autoren: Tsukuda, M.; Matsuo, K.; Tomonaga, H.; Okoda, S.; Noda, R.; Tashiro, K.; Omura, I.

73

74

Thermal Performance and Reliability of Copper Thick Film Substrates

Autoren: Gundel, Paul; Nowak, Torsten; Bawohl, Melanie; Challingsworth, Mark; Czwickla, Christoph; Garcia, Virginia; Nikolaidis, Ilias; Modes, Christina; Persons, Ryan; Reitz, Jessica; Shahbazi, Caitlin

75

76

Characterization and analysis of an innovative gate driver and power supplies architecture for HF power devices in harsh environment

Autoren: Nguyen, Van-Sang; Kerachev, Lyubomir; Lefranc, Pierre; Crebier, Jean-Christophe

77

Transient Thermal Impedance Model based on Online-Measurement of the On-State Voltage in IGBT Converters

Autoren: Hambrecht, Andreas; Klitzke, Reno; Lehmann, Stephan; Wagenitz, Dennis; Dieckerhoff, Sibylle

78

Empirical study on humidity conditions inside of power modules under varying external conditions

Autoren: Kremp, Sebastian; Schilling, Oliver; Mueller, Verena

79

HEV power modules robust against cyclic thermo-mechanical stress

Autoren: Leicht, Markus; Greif, Andreas; Muellmaier, Michael; Renner, Dietrich

80

Study on Packaging and Driver Integration with GaN Switches for Fast Switching

Autoren: Klein, Kirill; Hoene, Eckart; Reiner, Richard; Quay, Ruediger

81

82

Comparison of different technologies for the die attach of power semiconductor devices conducting active power cycling

Autoren: Hutter, Matthias; Weber, Constanze; Ehrhardt, Christian; Lang, Klaus-Dieter

83

Coupled Electro-Thermo-Mechanical Analyses on Power Cycling Induced Loadings in Sintered Silver IGBT-Modules with and without Overmolding

Autoren: Dudek, Rainer; Doering, Ralf; Rzepka, Sven; Stegmeier, Stefan; Ehrhardt, Christian; Rittner, Martin; Rudzki, Jacek

84

Wide Band Gap Power Transistors Gate Driver Cutting Edge Bloc Functions

Autoren: Grezaud, Romain; Ayel, François; Chapel, Antoine; Bergogne, Dominique

85

Lifetime Analysis of IGBTs in Periodic Surge Current Operation

Autoren: Kemper, J.; Nevoigt, J.; Huebner, H.; Hoffmann, K.

86

A cost-controlled, 4.3 kW/l 1-Φ Inverter with a 97.2 % CEC efficiency

Autoren: Lefevre, Guillaume; Ewanchuk, Jeffrey; Degrenne, Nicolas; Lefevre, Yoan

87

Assessment of the Thermal Conductivity of Transient Liquid Phase Sintered Interconnects

Autoren: Greve, Hannes; Moeini, S. Ali; McCluskey, F. Patrick; Joshi, Shailesh

88

Thermal Impedance Identification of a SiC JFET Module

Autoren: Merkert, Arvid; Weber, Simon; Mertens, Axel

89

Review of Integration Trends in Power Electronics Systems and Devices

Autoren: Majumdar, Gourab; Oi, Takeshi; Terashima, Tomohide; Idaka, Shiori; Nakajima, Dai; Goto, Yoichi

90

91

Investigation of a power module with double sided cooling using a new concept for chip embedding

Autoren: Stahr, H.; Morianz, M.; Gross, S.; Unger, M.; Nicolics, J.; Boettcher, L.

92

93

Prospects for advances in power magnetics

Autoren: Sullivan, Charles R.

94

95

Challenges in low-voltage high-current applications – fathom the limits in system design

Autoren: Schwalbe, Ulf; Schilling, Marco; Koehnlechner, Benjamin; Reimann, Tobias

96

Photovoltaic Inverters in µ-Scale

Autoren: Mallwitz, Regine; Lippold, Florian

97

98

Current Trends for GaN on Si Power Devices for Industrial Applications

Autoren: Mitova, Radoslava; Dentella, Alain; Reilly, David; Miquel, Olivier; Blanchard, Xavier