Rubrik: Proceedings - Allgemeine Proceedings
PCIM Asia 2019
größer

Guangzhou Guangya Messe Frankfurt Co Ltd. (Hrsg.)

PCIM Asia 2019

International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management Proceedings, 26 – 28 June 2019, Shanghai, China

2019, 270 Seiten, 140 x 124 mm, Slimlinebox, CD-Rom
ISBN 978-3-8007-4970-6, E-Book: ISBN 978-3-8007-4971-3
Persönliche VDE-Mitglieder erhalten auf diesen Titel 10% Rabatt

Inhaltsverzeichnis Vorwort

The PCIM is the leading Power Electronics Conference worldwide for discussing future technologies in this technical discipline and offering a competent forum for introducing the next generation of components and power electronic building blocks in the market. For almost 10 years power electronics industry is having a positive economic development trend. Within the last decade power electronics technology has become the driving forces for many new fields of applications such as all electric transportation systems, future renewable energy technologies and factory automation systems. The PCIM Asia Conference and Exhibition serves as a technical and scientific platform for engineers and researchers engaged in all fields of power electronics starting from power components, power converter technologies, and future SMART control systems.
Organizer: Guangzhou Guangya Messe Frankfurt Co. Ltd.
Partner: Mesago Messe Frankfurt GmbH
Zur erweiterten Tagungsbeitragssuche
1

Analysis and Suppression of Common Mode Voltage for Motor Drive in EV

Autoren: Lu, Haifeng; Han, Yang; Li, Yongdong; Chai, Jianyun
2

Key Technologies of Multi-Port Power Conversion Systems for the More Electric Aircraft

Autoren: Gu, Chunyang
3

Paralleling of medium-power IGBT modules in windmill converter to reduce size and cost

Autoren: Liu, Andy; Pluschke, Norbert
4

3 level topologies for windmill converter

Autoren: Zhu, Jack
5

3-Level NPC Topology in Wind Inverter

Autoren: Fei, Meng Xiang; Jun, Lian; Zhigang, Zeng
6

Control Strategy of Parallel Unidirectional Controlled Rectifiers for Reactive Power Compensation

Autoren: Wang, Cong; Tian, Changgeng; Cheng, Hong; Zhao, Zhihao
7

Power Module Application Test System Setup in 3 Levels ANPC Solar Inverter

Autoren: Zeng, Elvis; Zhang, QingYang; Hu, ZhiPing; Whitcomb, Richard; Hong, Seok; Mei, Simon; Jin, ZhuFeng
8

Using IGBT with antiparallel diode in SOT-223

Autoren: Rebec, Mitja; Schmoelzer, Bernd
9

pH neutral Cleaning Agents – Market Expectation & Field Performance

Autoren: Tosun, Umut; Patel, Jigar; Nukala, Kalyan; Gazcon, Fernando; Ji, Jerry
10

Research on Current Balance of MOSFET Multi - tube Parallel Connection

Autoren: Gao, Ming; Li, Quan; Tang, Tianhao
11

Electromagnetic analysis of Press Pack IEGT with Transient Skin and Proximity Effects

Autoren: Dai, Siyang; Ji, Bing; Song, Xueguan; Pickert, Volker; Li, Guofeng
12

A 1200V/400 A Hybrid Module with Si-IGBT and SiC-MOSFET Development

Autoren: Cao, Han; Ning, Puqi; Yuan, Tianshu; Wen, Xuhui
13

Rectifier Design for Frequency Converters using Thyristor or Diode Modules in Parallel Connection

Autoren: Wettengel, Stefan; Lindenmueller, Lars; Laessig, Florian; Bernet, Steffen; Stelte, Michael; Drilling, Christof; Leifeld, Matthias; Schiele, Juergen; Schenk, Mario
14

Research on SiC MOSFET Application in 1MW PV Inverter

Autoren: Hu, Bo; Ma, Xiankui; Song, Gaosheng
15

A Prospect of Hybrid Planar Power Module

Autoren: Yuan, Tianshu; Ning, Puqi; Cao, Han; Wen, Xuhui
16

New HVIC circuit topology to improve FTB immunity with 650 V / 50 A IGBT IPM for Industrial Applications

Autoren: Ohashi, Hidetomo; Yamaji, Masaharu; Akahane, Masashi; Sumida, Hitoshi; Yamada, Tadanori; Kobayashi, Yasuyuki; Chen, Song; Sato, Takahide
17

Introduction of Automotive Smart Power Module series for up to 7.5 kW Automotive High Voltage Auxiliary Motor Drive Applications

Autoren: Lee, Kangyoon; Jin, Bumseung; Park, Choonbae; Yim, Thomas; Zhou, Allan
18

A practical example of hard paralleling SiC MOSFET modules

Autoren: Zheng, Ziqing; Lenze, Andre; Levett, David; Mainka, Krzysztof; Zhang, Minda
19

2nd Generation Trench Gate SiC MOSFETs for All-SiC Module

Autoren: Chonabayashi, Mikiya; Okumura, Keiji; Sekino, Yusuke; Iwamoto, Susumu; Miyajima, Masaaki; Kumada, Keishirou; Shiigi, Takashi; Kimura, Hiroshi; Onishi, Yasuhiko; Isozaki, Makoto; Harada, Takahito; Okita, Soichi; Kobayashi, Yasuyuki
20

High Voltage GaN Power HEMTs Reliability

Autoren: Shen, Likun; Barr, Ronald; Shono, Ken; Smith, Peter; Lal, Rakesh; Wu, Yifeng
21

An Integrated Gate Driver Solution for Silicon Carbide Semiconductor Applications

Autoren: Wang, Hao; Fink, Karsten
22

Gate Driver Design Consideration and Optimization for Noninverting Buck-Boost Converters

Autoren: Xue, Fei; Zhang, Wenjing; Zhou Ryan, Chengjun
23

Analysis the Reverse Conduction Characteristic and Influence of Anti-parallel SiC SBD of eGaN HEMT

Autoren: Qin, Haihong; Peng, Zihe; Zhang, Ying; Wang, Wenlu; Xun, Qian
24

Crosstalk Mechanism and Suppression Methods for Enhancement-Mode GaN HEMTs in A Phase-Leg Topology

Autoren: Peng, Zihe; Qin, Haihong; Gong, Jiayan; Zhang, Ying; Xun, Qian
25

A Novel 20MHz DC/DC Resonant Converter With Soft-Switching Characteristics and Small Volume

Autoren: Guan, Yueshi; Hu, Xihong; Wang, Yijie; Wang, Wei; Xu, Dianguo
26

A Novel Type of Phase-Shift Controlled Wireless V2H with Dual-Active Single-Ended Converters

Autoren: Yamamoto, Aoto; Omori, Hideki; Tsuno, Masahito; Kimura, Noriyuki; Morizane, Toshimitsu
27

A New Fast Reverse Recovery Super-Junction MOSFET for high efficiency and reliable EV charging applications

Autoren: Choi, Wonsuk; Kim, Sungnam; Kim, Dongwook; Son, Dongkook
28

Reliability evaluation of IGCT based on demanding long-term application

Autoren: Tsyplakov, Evgeny; Chen, Makan; Stiasny, Thomas; Winter, Christian; Quittard, Olivier; Weber, Florian; Berner, Joerg
29

High power IGBT modules with new compact package

Autoren: Ma, Xiankui; Song, Gaosheng; Zhang, Xing
30

Evaluation of the Square-Root-t Method in Junction Temperature Measurement

Autoren: Cao, Haiyang; Zeng, Guang
31

A High-Power Miniaturized Wireless EV Charger with a New SiC-VMOSFET driven Single-Ended Inverter

Autoren: Tono, Yuki; Omori, Hideki; Iwanaga, Taichi; Michikoshi, Hisato; Sakamoto, Kunihiro
32

Reliable High-temperature SiC Power Module for Automotive Traction Inverter

Autoren: Liu, Chunlei; Schuderer, Juergen; Pavlicek, Niko; Salvatore, Giovanni; Loisy, Jean-Yves; Schroeder, Arne; Torresin, Daniele; Gradinger, Thomas; Baumann, David; Mohn, Fabian; Apelsmeier, Andreas
33

Light Load Efficiency Optimization for Synchronous Converter in Passenger Vehicle

Autoren: Li, Mengyu; Rong, Rui
34

High Efficiency Cooling Technology for High Power Density Automotive IGBT Module

Autoren: Yamauchi, Kohei; Gohara, Hiromichi; Kai, Kenshi; Satou, Kenichiro; Yoshida, Souichi; Mochizuki, Eiji; Shiohara, Kazuyoshi; Yamazaki, Tomoyuki
35

Hardware-in-Loop Real-Time Test Bed for Microgrid Systems with Multi-Level Control

Autoren: Mao, Meiqin; Jiang, Xun; Ding, Yong; Hu, Jian
36

A new, intelligent power module with higher power density and smallest package size

Autoren: Young, Sungmo; Chen, Zhou; Lee, Taejin; Choo, Byoungho; Son, Joonseo
37

Application introduction of a small IPM for inverter washing machine

Autoren: Zhang, Yongbao; Zhu, Qingle; Wang, Xiaoling
38

Increasing discrete IGBTs power density performance by improv-ing thermal design in welding machines

Autoren: Cerezo, Jorge; Klobucar, Blaz
39

Sintered Silver Interconnects for Traction Inverter Assembly

Autoren: Dutt, Gyan; Durham, Jeffrey; Koep, Paul; Boureghda, Monnir; Khaselev, Oscar; Pandher, Ranjit; Arouh, Jeffrey; Marczi, Mike
40

A Quick PCB Thermal Calculation for Power Electronic Devices with Exposed Pad Packages

Autoren: Zhang, Wenjing; Feng, George
41

Highly Reliable Protection of Power Module for Automotive Inverter Application

Autoren: Wang, Baoqi; He, Hongtao; Song, Zihao
42

Reactive Power Sharing using modified Virtual Impedance and Local load measurement for Islanded Microgrid

Autoren: Javed, Akhtar Hussain; Meng, Xin; Jinjun, Lui
43

IGBT Failure Analysis in the Praxis

Autoren: Zhu, Dan