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1

DBC substrate based EMC Transfer Molded Power Module

Autoren:
Lee, Keunhyuk; Jeon, Oseob; Lim, Seungwon; Park, Sungmin; Lee, Byoungok; Lee, Taekkeun
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

2

DCDC Converter for Hybrid Vehicle Applications

Autoren:
Schmidt, Wolfgang
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

3

Design and assembly of power semiconductors with double-sided water cooling

Autoren:
Schneider-Ramelow, Martin; Baumann, Thomas; Hoene, Eckart
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

4

Direct Substrate Cooling of Power Electronics

Autoren:
Skuriat, Robert; Johnson, C. M.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

5

Duplex pulse controlled inverter with a film capacitor DC-link

Autoren:
Kleimaier, A.; Hoffmann, B.; Scherer, A.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

6

ECPE Power Electronics Research and Technology Roadmaps: Team No.5: High Frequency Power Conversion > 1kW

Autoren:
Reimann, Tobias
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

7

EMC in Power Electronics

Autoren:
Hoene, Eckart
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

8

EMS Analysis on Digital Pulse Width Modulators

Autoren:
Orietti, Enrico; Saggini, Stefano; Mattavelli, Paolo; Spiazzi, Giorgio
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

9

Extraction of Efficient Thermal Models for Life Limiting Interfaces in Power Modules

Autoren:
Musallam, Mahera; Johnson, C. Mark
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

10

High Efficiency Isolated Half-Bridge Gate Driver with PCB Integrated Transformer

Autoren:
Zeltner, Stefan
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

11

Influence of Parasitic Elements on the Commutation of a Resonant Matrix Converter

Autoren:
Schulz, Sebastian; Ecklebe, Andreas; Lindemann, Andreas
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

12

IPEM-Based Power Electronics System Integration

Autoren:
Boroyevich, Dushan; Fred. C. Lee; Wyk, J. Daan van; Lu, Guo-Quan; Scott, Elaine P.; Xu, Ming; Burgos, Rolando; Wang, Fred; Jahns, Thomas M.; Lipo, Thomas A.; Lorenz, Robert D.; Chow, T. Paul
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

13

Issues and Options for Planar Packaging of High-Voltage SiC Diodes

Autoren:
Xu, Jing; Ngo, Khai D. T.; Calata, Jess; Wyk, J. D. van; Wyk, J. D. van
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

14

Life time prediction and design for reliability of Smart Power devices for automotive exterior lighting

Autoren:
letor, Romeo; Russo, Sebastiano; Crisafulli, Roberto
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

15

Lifetime Modeling and Prediction of Power Devices

Autoren:
Ciappa, Mauro
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

16

Low-cost digital control for SMPS integration

Autoren:
Lin-Shi, Xuefang; Allard, Bruno; Guo, Shuibao; Gao, Yanxia
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

17

Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment

Autoren:
Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan; Calata, Jesus N.; Calata, Jesus N.; Lei, Thomas G.; Lei, Thomas G.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

18

Model for Power Cycling lifetime of IGBT Modules – various factors influencing lifetime

Autoren:
Bayerer, Reinhold; Herrmann, Tobias; Licht, Thomas; Lutz,  Josef; Feller, Marco
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

19

Modularity bridging future Power Electronics in automotive volume applications – speeding up HEV applications

Autoren:
Rekofsky, Andreas; Brey, Roland; Thoben, Markus; Mertens, Christian; Löcher, Günter
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems

20

Non-Destructive Experimental Investigation about RBSOA in High Power IGBT Modules

Autoren:
Busatto, Giovanni; Abbate, Carmine; Abbate, Benedetto; Iannuzzo, Francesco
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems