1
DBC substrate based EMC Transfer Molded Power Module
Autoren:
Lee, Keunhyuk; Jeon, Oseob; Lim, Seungwon; Park, Sungmin; Lee, Byoungok; Lee, Taekkeun
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
2
DCDC Converter for Hybrid Vehicle Applications
Autoren:
Schmidt, Wolfgang
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
3
Design and assembly of power semiconductors with double-sided water cooling
Autoren:
Schneider-Ramelow, Martin; Baumann, Thomas; Hoene, Eckart
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
4
Direct Substrate Cooling of Power Electronics
Autoren:
Skuriat, Robert; Johnson, C. M.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
5
Duplex pulse controlled inverter with a film capacitor DC-link
Autoren:
Kleimaier, A.; Hoffmann, B.; Scherer, A.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
6
ECPE Power Electronics Research and Technology Roadmaps: Team No.5: High Frequency Power Conversion > 1kW
Autoren:
Reimann, Tobias
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
7
EMC in Power Electronics
Autoren:
Hoene, Eckart
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
8
EMS Analysis on Digital Pulse Width Modulators
Autoren:
Orietti, Enrico; Saggini, Stefano; Mattavelli, Paolo; Spiazzi, Giorgio
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
9
Extraction of Efficient Thermal Models for Life Limiting Interfaces in Power Modules
Autoren:
Musallam, Mahera; Johnson, C. Mark
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
10
High Efficiency Isolated Half-Bridge Gate Driver with PCB Integrated Transformer
Autoren:
Zeltner, Stefan
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
11
Influence of Parasitic Elements on the Commutation of a Resonant Matrix Converter
Autoren:
Schulz, Sebastian; Ecklebe, Andreas; Lindemann, Andreas
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
12
IPEM-Based Power Electronics System Integration
Autoren:
Boroyevich, Dushan; Fred. C. Lee; Wyk, J. Daan van; Lu, Guo-Quan; Scott, Elaine P.; Xu, Ming; Burgos, Rolando; Wang, Fred; Jahns, Thomas M.; Lipo, Thomas A.; Lorenz, Robert D.; Chow, T. Paul
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
13
Issues and Options for Planar Packaging of High-Voltage SiC Diodes
Autoren:
Xu, Jing; Ngo, Khai D. T.; Calata, Jess; Wyk, J. D. van; Wyk, J. D. van
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
14
Life time prediction and design for reliability of Smart Power devices for automotive exterior lighting
Autoren:
letor, Romeo; Russo, Sebastiano; Crisafulli, Roberto
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
15
Lifetime Modeling and Prediction of Power Devices
Autoren:
Ciappa, Mauro
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
16
Low-cost digital control for SMPS integration
Autoren:
Lin-Shi, Xuefang; Allard, Bruno; Guo, Shuibao; Gao, Yanxia
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
17
Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment
Autoren:
Lu, Guo-Quan; Lu, Guo-Quan; Lu, Guo-Quan; Calata, Jesus N.; Calata, Jesus N.; Lei, Thomas G.; Lei, Thomas G.
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
18
Model for Power Cycling lifetime of IGBT Modules – various factors influencing lifetime
Autoren:
Bayerer, Reinhold; Herrmann, Tobias; Licht, Thomas; Lutz, Josef; Feller, Marco
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
19
Modularity bridging future Power Electronics in automotive volume applications – speeding up HEV applications
Autoren:
Rekofsky, Andreas; Brey, Roland; Thoben, Markus; Mertens, Christian; Löcher, Günter
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
20
Non-Destructive Experimental Investigation about RBSOA in High Power IGBT Modules
Autoren:
Busatto, Giovanni; Abbate, Carmine; Abbate, Benedetto; Iannuzzo, Francesco
Konferenz:
CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems