1
Development of chemical mechanical polishing process for carbon nanotube interconnects on 300 mm wafer
Autoren:
Ito, Ban; Nishide, Daisuke; Matsumoto, Takashi; Katagiri, Masayuki; Saito, Tatsuro; Wada, Makoto; Watanabe, Masahito; Sakuma, Naoshi; Kajita, Akihiro; Sakai, Tadashi
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
2
Development of Innovative Tunable Polishing Formulations for Chemical Mechanical Planarization of Silicon Nitride, Silicon Carbide, and Silicon Oxide Materials
Autoren:
Schlueter, James; Stoeva, Savka; Graham, Maitland; Shi, Tom
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
3
Development of linear roll CMP system for large area micropatterns
Autoren:
Kim, Seongsoo; Kim, Jiyoon; Lee, Changsuk; Jeong, Haedo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
4
Development of new copper post-CMP cleaning solutions that allow direct bonding
Autoren:
Ouerd, Aziz; Dulphy, Hervé; Lelièvre, Vincent; Cioccio, Léa Di; Rivoire, Maurice
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
5
Direct Polish STI HSS CMP with Improved Planarity and Defect Performance
Autoren:
Iyer, A.; Yang, T.; Li, T.; Diao, J.; Lee, C. H.; Leung, G.; Osterheld, T.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
6
Effect of process parameter on particle removal efficiency in brush scrubber cleaning
Autoren:
Mei, Hegeng; Wang, Jie; Lu, Xinchun
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
7
Effect of Slurry Chemistry on W CMP Performance
Autoren:
Kang, Mincheol; Kim, Kyungbo; Jung, Taeyeon; Park, Hyungsoon; Kim, Hyunghwan; Kang, Hyosang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
8
Evaluation of Glass Lapping using Fixed Abrasive Pad
Autoren:
Kim, Hyuk-Min; Manivannan, R.; Moon, Deog-Ju; Kwon, Tae-Young; Noh, Jin-Hyeong; Park, Jin-Goo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
9
Experimental Studies on Interfacial Fluid Lubrication and Wafer Status during Chemical Mechanical Polishing of 12-inch Wafer
Autoren:
Zhao, Dewen; Wang, Tongqing; He, Yongyong; Lu, Xinchun
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
10
Feature analysis and simulation of optical endpoint traces in tungsten CMP
Autoren:
Mazzone, Giovanni; Gianni, Davide M.; Bano, Giuseppe; Castelletti, Luca
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
11
FullVision™ Endpoint for CMP of SiGe Fin Structures
Autoren:
Menk, G.; Dhandapani, S.; Huang, Y.-C.; Wood, B.; Qian, J.; Cherian, B.; Garretson, C.; Osterheld, T.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
12
Global Thickness Measurement System for Metal Layer on Wafer
Autoren:
Yu, Qiang; Zhao, Dewen; Li, Hongkai; Qu, Zilian; Qian Zhao; Lu, Xinchun; Meng, Yonggang
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
13
Haze used as wafer, die and intra-die indirect characterization technique for advanced CMP processes on patterned wafers
Autoren:
Dettoni, F.; Beitia, C.; Euvrard, C.; Morand, Y.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
14
Identification of Nonlinear Viscoelasticity of Polishing Pad Using an On- Machine Compression Tester
Autoren:
Suzuki, Norikazu; Asaba, Masakazu; Hashimoto, Yohei; Shamoto, Eiji
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
15
Improvements in Profile Control using ISPC™ System During the Stop-in- Oxide CMP Step in the RMG Process Flow on IBM 20nm Short-Loop Wafers
Autoren:
Komarenko, P.; Qian, J.; Salfelder, J.; Levedakis, D.; Economikos, L.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
16
In Situ Profile Control with Titan Edge™ Heads for Dielectric Planarization of Advanced CMOS Devices
Autoren:
Dhandapani, S.; Qian, J.; Cherian, B.; Menk, G.; Garretson, C.; Lee, H.; Bennett, D.; Osterheld, T.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
17
Influence of different anneal processes on copper surfaces pre - and post - CMP
Autoren:
Rudolph, C.; Wachsmuth, H.; Bartusseck, I.; Dobritz, S.; Grafe, J.; Boettcher, M.; Wolf, M. J.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
18
Innovative Barrier CMP Process: Benefit of High Selective Approach on Morphological and Electrical Performances
Autoren:
Robin, O.; Nemouchi, F.; Charrion, E.; Hinsinger, O.; Galpin, D.; Rivoire, M.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
19
Interferometry: a direct die level characterization technique
Autoren:
Dettoni, F.; Beitia, C.; Morand, Y.; Euvrard, C.; Balan, V.; Peak, J.; Gaillard, S.; Hinsinger, O.; Bertin, F.; Rivoire, M.
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology
20
Investigation on Analysis and Design of Pad Conditioning Process in Double Side Polishing
Autoren:
Lee, Sangjik; Kim, Hyoungjae; Lee, Hyunseop; Jeong, Haedo
Konferenz:
ICPT 2012 - International Conference on Planarization / CMP Technology