Anzeige
Sortierung
Seite 5 von 6

1

Reliability Design of Dual Sided Cooled Power Semiconductor Module for Hybrid and Electric Vehicles

Autoren:
Wang, Yangang; Li, Yun; Liu, Xuyu; Li, Helong; Dai, Xiaoping; Wu, Yibo; Liu, Guoyou
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

2

Review of Parasitic Minimization Techniques for High Frequency Power Conversion

Autoren:
Reusch, David; Lidow, Alex
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

3

Signal Sweeping Technique to Decouple the Influence of Junction Temperature and Bondwire Lift-off in Condition Monitoring for Multichip IGBT Modules

Autoren:
Chen, Cuili; Pickert, Volker; Tsimenidis, Charalampos; Lu, Xiang; Al-Greer, Maher; Logenthiran, Thillainathan; Ng, Chong; Jia, Chunjiang
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

4

Silver sinter paste optimized for pressure sintering under air atmosphere on precious and non-precious metal surfaces with high reliable sintered joints

Autoren:
Chew, Ly May; Schmitt, Wolfgang; Nachreiner, Jens; Gunst, Stefan
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

5

Simulation of the Thermal Transient Behaviour of Silicon Carbide Modules Using Liquid Convection Cooling

Autoren:
Mueter, Ulf; Radvan, Jens; Richter, Stefan; Hoffmann, Klaus F.
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

6

SMPS electromagnetic noise in System-on-Chip: Resonant frequency and amplitude dependencies

Autoren:
Feltrin, Eric; Chesneau, David; Vollaire, Christian
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

7

Solder layer degradation measurement for SiC-MOSFET Modules under accelerated power cycling conditions

Autoren:
Luo, Haoze; Iannuzzo, Francesco; Blaabjerg, Frede
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

8

Suppression of Electromagnetic Interference using Multi-Stage Integrated Filtering with Screening and Partitioning

Autoren:
Zhang, Zhe; Johnson, C. Mark
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

9

Surge Current Capability of IGBTs Used in Low Voltage DC/AC Hybrid Circuit Breaker

Autoren:
Askan, Kenan; Bartonek, Michael; Sobe, Klaus
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

10

Switching characteristics of low inductance SiC module with integrated capacitors for aircraft applications

Autoren:
Cougo, Bernardo; Sathler, Hans; Riva, Raphael
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

11

Test Strategies in Industrial Companies

Autoren:
Rimestad, Lars
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

12

The M-Shunt Structure Applied to Printed Circuit Boards

Autoren:
Boedeker, Christian; Adelmund, Melanie; Kaminski, Nando
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

13

The Promise of GaN in Light of Future Requirements for Power Electronics

Autoren:
Deboy, Gerald; Kasper, Matthias; Garcia, Alfredo Medina; Schlenk, Manfred
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

14

Thermal and thermo-mechanical design of an integrated substrate and heat sink for planar power module

Autoren:
Li, Jianfeng; Lin, Xi; Dai, Jingru; Mouawad, Bassem; Johnson, Christopher Mark; Zhang, Hui; Liu, Xuejian; Huang, Zhengren
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

15

Thermal Characteristic Evaluation and Transient Thermal Analysis of Next-generation SiC Power Module at 250 °C

Autoren:
Imakiire, Akihiro; Kozako, Masahiro; Hikta, Masayuki; Inagaki, Masakazu; Iizuka, Tomonori; Narimatsu, Hiroaki; Sato, Nobuaki; Shimizu, Koji; Ueda, Kazutoshi; Sugiura, Kazuhiko; Tsuruta, Kazuhiro; Iida, Makio; Toda, Keiji
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

16

Thermistor Die for Power Module Applications

Autoren:
Schuurman, Sophie; Mattens, Erik; Beneden, Bruno Van; Mattiuzzo, Emilio; Turnaturi, Marcello
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

17

Thermo-mechanical stress and deformation behavior of joined semiconductor devices using different die attach technologies

Autoren:
Naumann, Falk; Lorenz, Georg; Bernasch, Michael; Boettge, Bianca; Ebensperger, Christina; Oehling, Stefan
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

18

Towards Wafer Level 3D Power Integration

Autoren:
Charbonnier, Jean; Rat, Venceslass; Carvalho, Hamilton de; Bergogne, Dominique; Siegert, Joerg; Pressel, Klaus
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

19

Transfer molding for power semiconductor modules

Autoren:
Schuderer, Juergen; Lindstroem, Viktor; Liu, Chunlei; Mohn, Fabian
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems

20

Trends in SiC MOSFET Threshold Voltage and ON-Resistance Measurements from Thermal Cycling and Electrical Switching Stresses

Autoren:
Kozak, Joseph P.; DeVoto, Douglas J.; Major, Joshua J.; Ngo, Khai D.T.
Konferenz:
CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems