1
Condition Monitoring of Power Modules for SiC and GaN Semiconductors by Piezoelectric Effect
Autoren:
Bickel, Philipp; Jung, Marco; Kriegel, Kai; Donat, Albrecht; Mitic, Gerhard; Walbrecker-Baar, Christian
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
2
Cu-Si3N4 AMB-substrates for circuit boards in power electronics
Autoren:
Rost, A.; Kuczynski, M.; Zschippang, E.; Dold, P.; Hoerig, J.; Mosch, S.; dos Santos, S.; Gierth, P.; Winhauer, J.; Pfeiffer, J.; Schilm, J.; Herrmann, M.
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
3
Current Ripple Reduction Approaches in a Heavy-Duty Fuel Cell Truck
Autoren:
Guerlek, Yavuz; Akerl, Martin; Pfeifer, Kristina; Dold, Roland; Sippl, Simon; Lang, Charlotte; Basler, Thomas; Piriienko, Stanislav; Neuburger, Martin
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
4
DC- and AC-Side EMI Filter Design for an Interleaved Three Phase/Level ANPC High-Power GaN PV Inverter Using Coupled Inductors
Autoren:
Wang, Fan; Wagner, Valentin; Sprunck, Sebastian; Dick, Christian; Jung, Marco
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
5
Design Automation for Power Electronics: a path towards realization
Autoren:
Hermanns, Kevin
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
6
Design, Characterisation and Implementation of PCB Based 3-Φ Coupled Inductors for High Power Density Interleaved DC-DC Converter
Autoren:
Le Lesle, Johan; Lefevre, Guillaume
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
7
Development and testing of GaN Power Modules for EV traction inverters.
Autoren:
Novo, Dima; Briga, Adam; Bunin, Gregory; Bunin, Ilia; Cohen, Oren; Chang, Joey; Dubinsky, Oleg; Firtel, Alex; Gitelmakher, Yuri; Iskhakbayev, Nissim; Liesabeths, Dieter; Montazeri, Mahsa; Romero, Memo; Rozanov, Evgeny; Shapiro, David; Stessin, Lev; Tsai, Ray; Volkov, Roman; Veprinsky, Valery; Veprinski, Dana; Roiter, Yulia; Wainwright, Simon
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
8
Development of High-speed Current Switch Box for Transient Thermal Characterization of SiC Power Modules
Autoren:
Fukunaga, Shuhei; Funaki, Tsuyoshi
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
9
Die-Level Series-Connection of SiC MOSFETs and Integration of Decoupling Capacitors
Autoren:
Ubostad, Tobias Nieckula; Peftitsis, Dimosthenis
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
10
Digital Twin and Virtual Release of Automotive Electronics
Autoren:
Loos, Florian; Schautzgy, Johannes; Obermayr, Martin; Tauscher, Markus; Sova, Libor; Krejcova, Milada
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
11
Double-Side Cooled 1.2kV, 300A SiC MOSFET Phase-leg Modules for 200 kW, > 100 kW/L Traction Inverters
Autoren:
Zhang, Zichen; Lu, Guo-Quan; Zhao, Xingchen; Dong, Dong; Arriola, Emmanuel; Ubando, Aristotle; Gao, Yuan
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
12
Dynamic calibration: How to properly estimate junction temperature in SiC MOSFETs subject to body diode voltage shift
Autoren:
Noah, Mostafa; Fuentes, Carlos; Filsecker, Felipe
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
13
Effect of local concavity of DBC substrate on junction-to-heatsink thermal resistance of power module designs
Autoren:
Csiki, Daniel; Buza, Mate; van Dijk, Marius; Tauer, Matthias; Wittler, Olaf
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
14
Energy Balancing in Paralleled SiC MOSFETs During an Avalanche Event
Autoren:
Herrmann, Clemens; He, Mengdi; Alaluss, Mohamed; Basler, Thomas; Elpelt, Rudolf; Zeng, Guang
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
15
Ensuring optimal switching of power MOSFETs by compensating Vth variations using an integrated active gate driver
Autoren:
Feng, Zhengyang; Kumar, Manish; Wang, Sheng; Kawai, Shusuke; Ueno, Takeshi; Ishihara, Hiroaki; Onizuka, Kohei
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
16
Estimation of thermo-mechanical Anand model parameters of die-attach materials for power electronics assemblies
Autoren:
Fuste, Nauem; Sola, Emma; Avino, Oriol; Perpina, Xavier; Vellvehi, Miquel; Jorda, Xavier
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
17
Evaluating non-isolated chip-assembly with direct liquid cooling
Autoren:
Schulz, Martin; Klemmer, Ralf; Kreiner, Lukas
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
18
Evaluation of a Rogowski-based di/dt sensing for temperature monitoring of SiC MOSFET in TO-247 package
Autoren:
Jamois, Arthur; Morand, Julien
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
19
Evaluation of accuracy and performance of an optimized simulation model by measuring a manufactured test vehicle
Autoren:
Papperi Devarajulu Deenadayalan, Janagan; Weis, Gerald
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
20
Evaluation of Different Diode Technologies in a Si-SiC Hybrid Switch Used in a 540V/30kVA Inverter
Autoren:
Andrade, Marco; Cougo, Bernardo; Morais, Lenin M F; Sathler, Gustavo
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems