1
Evaluation of failure modes in film capacitors after accelerated lifetime testing compared to field returns
Autoren:
Rudolph, Marco; Naumann, Falk; Muehs-Portius, Bolko; Klengel, Sandy; Knoch, Jan
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
2
Evaluation of the Thermal Fatigue and Failure Mechanisms on Power Modules with Different Types of Substrates (DBC / IMS)
Autoren:
Spano, Chiara; Galfré, Giulio; Mattiuzzo, Emilio; D’Ancona, Lorenzo; Bertana, Valentina; Scaltrito, Luciano; Ferrero, Sergio
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
3
Examination of the Pore Structure of Copper Sintered Die Attach Layers by Local Thickness Analysis and Scratch Test
Autoren:
Raemer, Olaf; Hutter, Matthias; Schneider-Ramelow, Martin
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
4
Exploring coupling coil integration in Power Semi-Conductor Modules environment for sensing in Railway traction
Autoren:
Dumollard, Yannick; Escrouzailles, Vincent; Batista, Emmanuel; Tisne-Grimaud, Damien
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
5
Fabrication and characterization of low value embedded resistors for use in PCB embedded RC snubber for more integrated converter.
Autoren:
Can-Ortiz, Alejandro; Bley, Vincent; Botter, Nicolas; Avenas, Yvan
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
6
Fast Two-Step Sintering Process with High Strength
Autoren:
Schellscheidt, Benjamin; Kopczynski, Anna; Richter, Jessica; Licht, Thomas
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
7
GaN Power Converter with low inductive hybrid PCB Technology
Autoren:
Braun, Gerrit; Wethmar, Julian; Kessler, Jan-Thorben
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
8
Horizontal Cracks in PCB Embedded Semiconductor Devices: A Real Problem or a Ghost Hunt?
Autoren:
Huesgen, Till; Bhushan Sharma, Ankit
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
9
Hyperbolic Segmentation of Gate Driver Output Transistors for a Clean Switching of 650V GaN HEMTs Half Bridges
Autoren:
Fiori, Franco; Nuebling, Marcus; Klotz, Frank
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
10
Impact of the Level of Negative Gate Voltage on the Temperature Measurement during Power Cycling Testing of SiC MOSFETs
Autoren:
Heimler, Patrick; Reiter, Kristiane; Guenther, Marco; Lutz, Josef; Basler, Thomas
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
11
Impact of VCE,sat measurement conditions on cycle-to-failure determination of IGBT samples in power cycling test
Autoren:
Zhang, Yichi; Zhang, Yi; Yao, Bo; Wang, Huai
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
12
Implementation of a Junction Temperature Cycle Recorder in a Battery Electric Vehicle and Accuracy Assessment by Road Testing
Autoren:
Denk, Marco; Esau, Marvin; Fritsch, Sascha; Ubben, Ole
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
13
Improvement of PC ruggedness by AlN substrate in Easy power modules with Silicon Carbide technology
Autoren:
Methfessel, Torsten; Zhou, Meng-Meng; Mier, Ainhoa Puyadena; Salmen, Paul
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
14
Influence of Current Density on Power Cycling Test of Low Voltage MOSFETs in DC Body-Diode Mode and Switching MOSFET-Mode
Autoren:
Abuogo, James; Schwabe, Christian; Lutz, Josef; Basler, Thomas
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
15
Influence of hard encapsulation onto reliability of soldered die-attach in power modules
Autoren:
Sprenger, Mario; Oeztuerk, Beyza; Forndran, Freerik; Sippel, Marcel; Ockel, Manuela; Goth, Christian; Franke, Joerg
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
16
Influence of VDS Bias on SiC MOSFET Dynamic Gate Stress
Autoren:
Gebhardt, Mathias; Lieser, Gabriel
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
17
Integration of controllable inductors in hardware in the loop systems
Autoren:
Maier, Herbert; Pfeiffer, Jonas; Schmidhuber, Michael
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
18
Interest of high frequency decoupling inductors for reducing common mode current in high speed switching cells
Autoren:
Botter, N.; Bikinga, W. F.; Avenas, Y.; Guichon, J. M.; Schanen, J. L.
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
19
Investigating the Effect of Voltage and Current Stress on Temperature Dependent On-State Resistance in GaN HEMT Power Devices
Autoren:
Li, Tianyu; Lindemann, Andreas
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
20
Investigation of Moisture Absorption and Drying Characteristics of HVIGBT Power Modules
Autoren:
Sakai, Yasuhiro; Mikami, Kazuto; Hatori, Kenji; Nakamura, Keiichi; Oya, Daisuke; Soltau, Nils
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems