1
The Reliability of High Temperature Pb-Free Solder for High Power Semiconductor Device Packaging
Autoren:
Mat, Maryam; Grant, Thomas; Wang, Yangang; Morshed, Muhammad
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
2
Thermal coupling assessment for a PCB-based package with embedded chips and graphite heat spreader
Autoren:
Ahmed, Ahmed Sabry Eltaher; Hamed, Bahaeddine Ben; Perrin, Remi; Regnat, Guillaume; Lefevre, Guillaume; Buttay, Cyril; Jay, Jaques
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
3
Thermo-mechanical and electromagnetic simulations of a Half-Bridge Insulated Prepackage for Modular Power Modules
Autoren:
Frroku, Saimir; Sharma, Ankit Bhushan; Huesgen, Till; Irace, Andrea; Salvatore, Giovanni A.
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
4
Thermomechanical characterisation of soft potting materials and stress reduction by compressibility
Autoren:
Wirries, Jonas; Ruetters, Martin
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
5
Time-Domain Simulation Based Multi-Domain Optimization of Gallium Nitride-Based DC/DC Converters utilizing Spice Models
Autoren:
Nuzzo, Jeremy; Koch, Dominik; Bosch, Michael; Fink, Tobias; Kallfass, Ingmar
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
6
Ultrasonic Rivet Welding as Signal Technology in Power-Modules
Autoren:
Dreps, Florian; Zoellner, Nils; Borghoff, Georg; Guth, Karsten; Strotmann, Guido
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
7
Unlocking the Opportunities of Bidirectional GaN Devices in Isolated DC/DC Converters and Multilevel Inverters
Autoren:
Barzegarkhoo, Reza; Pereira, Thiago; Liserre, Marco
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
8
Voltage-Sensorless Control and GaN Multilevel Converter for Charging Non-Linear and Lossy Electrocaloric Capacitors
Autoren:
Moench, Stefan; Reiner, Richard; Basler, Michael; Waltereit, Patrick; Quay, Ruediger; Bartholome, Kilian
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
9
Why the 3 dB bandwidth of a current sensor does not provide an exact statement about its measurement capability
Autoren:
Lutzen, Hauke; Ziegler, Philipp; Roth-Stielow, Joerg; Kaminski, Nando
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems
10
Wide Bandwidth PCB Rogowski Coil Current Sensor with Droop Suppression and DC Restoration for In-Situ Inverter Measurements
Autoren:
Quergfelder, Simon; Sax, Julian; Heckel, Thomas; Eckardt, Bernd; Maerz, Martin
Konferenz:
CIPS 2024 - 13th International Conference on Integrated Power Electronics Systems