IEC 61249-4-19:2013Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
80,00 €
|
IEC TR 62856:2013Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)
150,00 €
|
IEC 62739-1:2013Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
115,00 €
|
IEC 61189-11:2013Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
80,00 €
|
IEC 61193-3:2013Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
345,00 €
|
IEC 61249-2-27:2012Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
150,00 €
|
IEC 61249-2-30:2012Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
150,00 €
|
IEC 61249-2-39:2012Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
150,00 €
|
IEC 61249-2-40:2012Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
150,00 €
|
IEC 62243:2012Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
400,00 €
|
|
|
|
IEC 61671:2012Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML
425,00 €
|
IEC 62137-3:2011Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
270,00 €
|
IEC 60068-2-83:2011Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
235,00 €
|
IEC 61249-2-41:2010Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
150,00 €
|
IEC 61249-2-42:2010Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
150,00 €
|
IEC 61191-6:2010Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
235,00 €
|
|