IEC 61188-5-3:2007

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

IEC 61188-5-4:2007

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

IEC 61188-5-5:2007

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

IEC 61188-5-8:2007

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

IEC 61189-3:2007

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

IEC 61193-2:2007

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

IEC 62421:2007

Electronics assembly technology - Electronic modules

IEC 62137-1-2:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

IEC 62137-1-1:2007

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

IEC 61189-2:2006

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

IEC 61249-4-11:2005

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

IEC 61249-4-12:2005

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

IEC 61249-4-5:2005

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

IEC 61249-4-2:2005

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

IEC 61249-2-2:2005

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

IEC 61249-2-23:2005

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

IEC 61249-2-26:2005

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-1:2005

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

IEC 61249-2-22:2005

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61523-3:2004

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process