IEC 61523-3:2004

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process

IEC 61249-2-5:2003

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-6:2003

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-11:2003

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-21:2003

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61188-5-2:2003

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

IEC 61249-2-9:2003

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-8:2003

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61249-2-10:2003

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

IEC 61188-5-6:2003

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

IEC 61190-1-1:2002

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

IEC 61249-2-7:2002

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

IEC 62326-1:2002

Printed boards - Part 1: Generic specification

IEC 61193-1:2001

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

IEC 61249-2-4:2001

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

IEC 61189-1:1997+AMD1:2001 CSV (Consolidated Version)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 61189-1:1997/AMD1:2001

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

IEC 61690-1:2000

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

IEC 61690-2:2000

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

IEC 61926-1:1999

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)