IEC 61189-2-501:2022

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials

IEC 61189-2-807:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA

IEC 62530:2021

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

IEC 61691-8:2021

Behavioural languages - Part 8: Standard SystemC Analog/Mixed-Signal Extensions Language Reference Manual

IEC 61760-2:2021

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 61760-2:2021 RLV

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

IEC 60068-2-21:2021

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

IEC TR 62878-2-8:2021

Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate

IEC 62878-2-602:2021

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity

IEC 61636:2021

Software Interface for Maintenance Information Collection and Analysis (SIMICA)

IEC 61636-1:2021

Software Interface for Maintenance Information Collection and Analysis (SIMICA): Exchanging Test Results and Session Information via the eXtensible Markup Language (XML)

IEC 61691-6:2021

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

IEC 60068-2-20:2021 RLV

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

IEC 60068-2-20:2021

Environmental testing - Part 2-20: Tests - Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

IEC TR 61191-8:2021

Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices

IEC 61189-5-301:2021

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

IEC 61188-6-1:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards

IEC 60194-1:2021

Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies

IEC 61188-6-2:2021

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)

IEC 61189-5-502:2021

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface Insulation Resistance (SIR) testing of assemblies