IEC 61189-2-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

IEC 61189-5-1:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

IEC 60068-3-13:2016

Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering

IEC 61249-2-44:2016

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-2-43:2016

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61671-2:2016

Standard for automatic test markup language (ATML) instrument description

IEC 61671-4:2016

Standard for automatic test markup language (ATML) test configuration

IEC 61671-5:2016

Standard for automatic test markup language (ATML) test adapter description

IEC 61671-6:2016

Standard for automatic test markup language (ATML) test station description

IEC 62326-20:2016

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

IEC 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

IEC 61189-3-913:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

IEC TR 63018:2015

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

IEC TR 63017:2015

Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations

IEC 63003:2015

Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™

IEC 63004:2015

Standard for receiver fixture interface

IEC TR 62878-2-2:2015

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

IEC 62878-1-1:2015

Device embedded substrate - Part 1-1: Generic specification - Test methods

IEC 61760-4:2015

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices

IEC 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator