IEC 63003:2015Standard for the common test interface pin map configuration for high-density, single-tier electronics test requirements utilizing IEEE Std 1505™
400.00 €
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IEC 62878-1-1:2015Device embedded substrate - Part 1-1: Generic specification - Test methods
300.00 €
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IEC 61760-4:2015Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
235.00 €
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IEC 61189-2-721:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
150.00 €
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IEC TS 62878-2-1:2015Device embedded substrate - Part 2-1: Guidelines - General description of technology
190.00 €
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IEC TS 62878-2-4:2015Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
235.00 €
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IEC 60068-2-58:2015Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
235.00 €
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IEC 62014-4:2015IP-XACT, Standard Structure for Packaging, Integrating, and Reusing IP within Tool Flows
425.00 €
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IEC 62014-5:2015Quality of Electronic and Software Intellectual Property Used in System and System on Chip (SoC) Designs
270.00 €
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IEC 61189-5-2:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
270.00 €
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IEC 61189-5-3:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
235.00 €
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IEC 61189-5-4:2015Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
150.00 €
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IEC TR 62699-1:2014Mapping rules and exchange methods for heterogeneous electronic parts libraries - Part 1: Building an integrated search system
235.00 €
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IEC 62137-4:2014Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
270.00 €
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IEC TR 62866:2014Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
375.00 €
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IEC 61190-1-2:2014Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
150.00 €
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IEC 61249-4-18:2013Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
80.00 €
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