IEC 61249-2-43:2016

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogenated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 62326-20:2016

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs

IEC 61189-3-719:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

IEC 61189-3-913:2016

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit boards for high-brightness LEDs

IEC TR 63018:2015

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

IEC TR 63017:2015

Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations

IEC TR 62878-2-2:2015

Device embedded substrate - Part 2-2: Guidelines - Electrical testing

IEC 62878-1-1:2015

Device embedded substrate - Part 1-1: Generic specification - Test methods

IEC 61189-2-721:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator

IEC TS 62878-2-1:2015

Device embedded substrate - Part 2-1: Guidelines - General description of technology

IEC TS 62878-2-3:2015

Device embedded substrate - Part 2-3: Guidelines - Design guide

IEC TS 62878-2-4:2015

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)

IEC 61189-5-2:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

IEC 61189-5-3:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

IEC 61189-5-4:2015

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

IEC TR 62866:2014

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

IEC 61249-4-18:2013

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-4-19:2013

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61189-11:2013

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

IEC 61249-2-27:2012

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad