IEC PAS 63720:2026
Norm
Rigid circuit board - Routing parameters
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Zuständiges Komitee:
Hauptnummer/Reihe:
63720
IEC PAS 63720:2026 defines standardized routing parameter tables applicable to the design of rigid circuit board with mechanically or laser drilled vias.
These parameter tables are based on the concept of "Routing Classes" initially introduced in the French standard NF-93713 (1971-1989, cancelled: 2019). They are linked to the pitch of electronic components (e.g., BGA, QFN, connector, etc.) and thus allow a better coupling with component and circuit board manufacturers.
They can be easily integrated into EDA tools to facilitate the work of designers, while ensuring a common standard of communication between customers and manufacturers.
Routing classes should not be confused with IPC performance classes, which are used in the context of circuit board acceptance (IPC-A-600) as well as qualification and performance (IPC-6012) standards. Additional information on circuit board design is provided by IPC-2221 (Generic Standard on Printed Board Design), IPC-2222 (Sectional Design Standard for Rigid Organic Printed Boards) and IPC-2226 (Sectional Design Standard for High Density Interconnect (HDI) Printed Boards).
This document is based on French AFNOR Spec 2212 and was submitted as a PAS document.
These parameter tables are based on the concept of "Routing Classes" initially introduced in the French standard NF-93713 (1971-1989, cancelled: 2019). They are linked to the pitch of electronic components (e.g., BGA, QFN, connector, etc.) and thus allow a better coupling with component and circuit board manufacturers.
They can be easily integrated into EDA tools to facilitate the work of designers, while ensuring a common standard of communication between customers and manufacturers.
Routing classes should not be confused with IPC performance classes, which are used in the context of circuit board acceptance (IPC-A-600) as well as qualification and performance (IPC-6012) standards. Additional information on circuit board design is provided by IPC-2221 (Generic Standard on Printed Board Design), IPC-2222 (Sectional Design Standard for Rigid Organic Printed Boards) and IPC-2226 (Sectional Design Standard for High Density Interconnect (HDI) Printed Boards).
This document is based on French AFNOR Spec 2212 and was submitted as a PAS document.
Dieses Dokument wird folgenden, in Fettschrift gekennzeichneten, Fachgebiet(en) zugeordnet:
- 31Elektronik
- 31.020Elektronische Bauelemente im Allgemeinen
- 31.040Widerstände
- 31.060Kondensatoren
- 31.080Halbleiterbauelemente
- 31.100Elektronenröhren
- 31.120Elektronische Anzeigeeinrichtungen. Bildschirme
- 31.140Piezoelektrische Bauelemente
- 31.160Elektrische Filter
- 31.180Gedruckte Schaltungen. Leiterplatten
- 31.190Elektronische Baugruppen
- 31.200Integrierte Schaltungen. Mikroelektronik
- 31.220Elektromechanische Bauelemente für elektronische und Telekommunikationsgeräte
- 31.240Mechanische Bauteile für elektronische Geräte
- 31.260Optoelektronik. Lasertechnik
Artikeldetails
- Edition: 1.0
- Umfang: 24 Seiten
- Sprache: Englisch
- Ausgabedatum: 2026-08
- Erscheinungsdatum: 2026-08-06
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