1
Sintering technology used for interconnection of large areas: potential and limitation for power modules
Authors:
Licht, Thomas; Speckels, Roland; Thoben, Markus
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
2
Solar Power Inverters
Authors:
Mallwitz, Regine; Engel, Bernd
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
3
System based optimization of the chip size and the thermal path for Si and SiC semiconductors
Authors:
Köneke, Thies; Merkert, Arvid; Mertens, Axel
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
4
The Future of Wire Bonding is? Wire Bonding!
Authors:
Siepe, Dirk; Bayerer, Reinhold; Roth, Roman
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
5
Thermal pre-dimensioning methodology based on thermal impedance
Authors:
Dubus, Patrick; Leon, Renan; Guyader, Delphine Le; Caves, Laurent
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
6
Thermo-mechanical stress analysis for a multilayer SMT manufacturing technology
Authors:
Josifovic, I.; Popovic-Gerber, J.; Ferreira, J. A.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
7
Three-stage DC-DC converter solutions for SMPS applications in comparison
Authors:
Schwalbe, Ulf; Scherf, Marko; Reimann, Tobias
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
8
Validation of a Fast Loss and Temperature Simulation Method for Power Converters
Authors:
Bryant, A. T.; Parker-Allotey, N.-A.; Swan, I. R.; Hamilton, D. P.; Mawby, P. A.; Ueta, T.; Nisijima, T.; Hamada, K.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems
9
Vaporizable Dielectric Fluid Cooling for IGBT Power Semiconductors
Authors:
Saums, David L.
Conference:
CIPS 2010 - 6th International Conference on Integrated Power Electronics Systems