1
SiCmodul - Modular high-temperature SiC power electronics for fail-safe power control in electrical drive engineering
Authors:
Marczok, Christoph; Martina, Manuel; Laumen, Michael; Richter, Sebastian; Birkhold, Andreas; Flieger, Bjoern; Wendt, Oliver; Paesler, Thomas
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
2
Simple and Precise Calorimetry Method for Evaluation of Losses in Power Electronic Converters
Authors:
Mary, Nicolas; Perrin, Remi; Mollov, Stefan; Buttay, Cyril
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
3
Simultaneous Imaging of Strain and Temperature using Single IR Camera
Authors:
Masuda, Yoshiki; Watanabe, Akihiko; Omura, Ichiro
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
4
Sintered-copper Die-attach: Processing, Properties, and Reliability
Authors:
Wang, Meiyu; Shan, Yanliang; Mei, Yunhui; Li, Xin; Lu, Guo-Quan
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
5
Smart Ultrasonic Welding in Power Electronics Packaging
Authors:
Hunstig, Matthias; Schaermann, Waldemar; Broekelmann, Michael; Holtkaemper, Sebastian; Siepe, Dirk; Hesse, Hans J.
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
6
Study and Design of an Integrated CMOS Laser Diode Driver for an iToF-based 3D Image Sensor
Authors:
David, Romain; Allard, Bruno; Branca, Xavier; Joubert, Charles
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
7
Surface-Mount Package IPM with Highly Reliable Transfer Molding Resin
Authors:
Hodaka, Rokubuichi,; Harada, Hiroyuki; Sakamoto, Ken; Iwai, Takamasa; Kosugi, Akira; Shikano, Taketoshi; Hiramatsu, Seiki
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
8
Survey on Generative and Discriminative Fault Detection Approaches with Focus on SiC Components
Authors:
Loghmani Moghaddam Toussi, Afshin; Bahman, Amir Sajjad; Blaabjerg, Frede
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
9
Switching speed evaluation of e-mode GaN HEMTs in ultra-low inductive switching cell designs
Authors:
Risch, Raffael; Hu, Anliang; Biela, Juergen
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
10
System integration and analysis of SiC-based high power inverter with up to 250 kW and switching slopes of up to 50 kV/μs for novel powertrain concepts
Authors:
De Doncker, Rik W.; Fuchs, Lea; Hepp, Maximilian; Luedecke, Christoph; Meyne, Christian; Nisch, Alexander; Otto, Alexander; Reum, Thomas; Rzepka, Sven; Strenger, Christian; Uhlemann, Andre; Vanegas, Omar; Wondrak, Wolfgang
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
11
The Opportunities of Integration Technologies for Active and Passive Components
Authors:
Ostmann, Andreas; Hoene, Eckart; Marczok, Christoph
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
12
Thermal Analysis of Power Module with Double Sided Direct Cooling using Ceramic Heat Sinks
Authors:
Botter, Nicolas; Avenas, Yvan; Missiaen, Jean-Michel; Bouvard, Didier; Khazaka, Rabih
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
13
Thermal Simulation for Power Density Optimization of SiC-MOSFET Automotive Inverter
Authors:
Becker, Nathalie; Bulovic, Sandro; Bittner, Roland; Herzer, Reinhard
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
14
Thermo-mechanical reliability of nanosilver sintered joints for large-area bonding
Authors:
Dai, Jingru; Bello, Abubakar Umar; Agyakwa, Pearl; Cofield, Martin; Johnson, Christopher Mark
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
15
Thick film paste systems for multifunctional copper power modules
Authors:
Reinhardt, Kathrin; Körner, Stefan; Partsch, Uwe
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
16
Thin-film Magnetics-on-Silicon Integrated Transformer for Isolated Signal and Power Coupling Applications
Authors:
Pavlovic, Zoran; Podder, Pranay; Dobbyn, Dermot; Masood, Ansar; Wei, Guannan; Lordan, Daniel; McCloskey, Paul; O’Mathuna, Cian; O’Driscoll, Seamus
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
17
Three-State Output Gate Driver for IGBTs
Authors:
Reigosa, Paula Diaz; Urcan, Bogdan Marian; Gascue, Martin Iriondo; Iannuzzo, Francesco
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
18
Two-layered planar SiC power module for industrial applications
Authors:
Raab, Oliver; Kriegel, Kai; Ghesquiere, Pol
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
19
Ultra-Compact Combined Common Mode (CM)- and Differential Mode (DM)-Inductors
Authors:
Deck, Patrick; Niessen, Martin; Dick, Christian P.
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
20
Ultra-high Power Density Server Supplies Employing GaN Power Semiconductors and PCB-Integrated Magnetics
Authors:
Kasper, Matthias J.; Peluso, Luca; Deboy, Gerald; Knabben, Gustavo; Guillod, Thomas; Kolar, Johann W.
Conference:
CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems