Cover IEC 60512-6-2:2002
größer

IEC 60512-6-2:2002

Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests - Test 6b: Bump

Circulation Date: 2002-02
Edition: 1.0
Language: EN-FR - bilingual english/french
Seitenzahl: 9 VDE Artno.: 200791

Content

Defines a standard test method to assess the ability of components (essentially connectors) to withstand specified severities of bump.