Cover IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV (Consolidated Version)

IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV (Consolidated Version)

Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types

Circulation Date: 2012-12
Edition: 3.2
Language: EN-FR - bilingual english/french
Seitenzahl: 61 VDE Artno.: 219451


IEC 60127-4:2005+A1:2008+A2:2012 relates to universal modular fuse-links (UMF) for printed circuits and other substrate systems, used for the protection of electric appliances, electronic equipment, and component parts thereof, normally intended to be used indoors. It does not apply to fuse-links for appliances intended to be used under special conditions, such as in a corrosive or explosive atmosphere. This standard applies in addition to the requirements of IEC 60127-1. This consolidated version consists of the third edition (2005), its amendment 1 (2008) and its amendment 2 (2012). Therefore, no need to order amendments in addition to this publication.