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IEC 60749-26:2025

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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358.45 € 

IEC 60749-26:2025 CMV

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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716.90 € 

IEC 60749-21:2025 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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291.04 € 

IEC 60749-21:2025

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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171.20 € 

IEC 60749-23:2025 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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72.76 € 

IEC 60749-23:2025

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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42.80 € 

IEC 60749-7:2025

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

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85.60 € 

IEC 60749-24:2025 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

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72.76 € 

IEC 60749-24:2025

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

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42.80 € 

IEC 60749-22-1:2025

Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - Wire bond pull test methods

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406.60 € 

IEC 60749-22-2:2025

Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods

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278.20 € 

IEC 62007-2:2025

Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods

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315.65 € 

IEC 60749-34-1:2025

Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module

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224.70 € 

IEC 63378-3:2025

Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis

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85.60 € 

IEC 60747-5-4:2022/AMD1:2024

Amendment 1 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

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21.40 € 

IEC 60747-5-4:2022+AMD1:2024 CSV (Consolidated Version)

Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers

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513.60 € 

IEC 63378-2-1:2024

Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages

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85.60 € 

IEC 60749-5:2023

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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42.80 € 

IEC 60749-5:2023 RLV

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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72.76 € 

IEC 63287-2:2023

Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile

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85.60 €