| IEC 62007-2:2025Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods 
                280.00 € 
               | 
| IEC 60749-34-1:2025Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module 
                200.00 € 
               | 
| IEC 63378-3:2025Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis 
                80.00 € 
               | 
| IEC 60747-5-4:2022/AMD1:2024Amendment 1 - Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers 
                20.00 € 
               | 
| IEC 60747-5-4:2022+AMD1:2024 CSV (Consolidated Version)Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers 
                465.00 € 
               | 
| IEC 63378-2-1:2024Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages 
                80.00 € 
               | 
| IEC 60749-5:2023Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test 
                40.00 € 
               | 
| IEC 60749-5:2023 RLVSemiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test 
                68.00 € 
               | 
| IEC 63287-2:2023Semiconductor devices - Guidelines for reliability qualification plans - Part 2: Concept of mission profile 
                80.00 € 
               | 
| IEC 60749-37:2022Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer 
                155.00 € 
               | 
| IEC 60749-37:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer 
                264.00 € 
               | 
| IEC 62007-1:2015/AMD1:2022Amendment 1 - Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics 
                10.00 € 
               | 
| IEC 62007-1:2015+AMD1:2022 CSV (Consolidated Version)Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics 
                439.99 € 
               | 
| IEC 60747-5-4:2022Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers 
                249.99 € 
               | 
| IEC 60749-10:2022Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly 
                80.00 € 
               | 
| IEC 60749-28:2022Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level 
                280.00 € 
               | 
| IEC 60749-28:2022 RLVSemiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level 
                476.00 € 
               | 
| IEC TR 63378-1:2021Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages 
                115.00 € 
               | 
| IEC 60749-39:2021Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components 
                80.00 € 
               | 
| IEC 60749-39:2021 RLVSemiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components 
                136.00 € 
               | 


