IEC TR 61191-9:2023

Printed board assemblies - Part 9: Electrochemical reliability and ionic contamination on printed circuit board assemblies for use in automotive applications - Best practices

IEC PAS 61191-10:2022

Printed board assemblies - Part 10: Application and utilization of protective coatings for electronic assemblies

IEC TR 61191-8:2021

Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices

IEC TR 61191-7:2020

Printed board assemblies - Part 7: Technical cleanliness of components and printed board assemblies

IEC 61191-2:2017/COR1:2019

Corrigendum 1 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-1:2018

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-1:2018 RLV

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-4:2017

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

IEC 61191-3:2017

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

IEC 61191-2:2017

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

IEC 61191-6:2010

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method