High speed chip-to-chip data transmission using the SLVS signaling method

Conference: ANALOG '06 - 9. ITG/GMM-Fachtagung
09/27/2006 - 09/29/2006 at Dresden, Germany

Proceedings: ANALOG '06

Pages: 6Language: englishTyp: PDF

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Buchmann, Michael; Miiller, Markus (Nokia Research Center, Bochum, Germany)

The MIPI (Mobile Industry Processor Interfaces) Alliance standardizes a number of interfaces inside a mobile device. The MIPI D-PHY is a scalable, low-power, high-speed physical layer upon which several MIPI standards, like camera and display interfaces, are based. It is using the SLVS signaling method. A test chip designed by Nokia Research Center Bochum proves now the potential of SLVS for high-speed and low-power data transmission. Whereas the bi-directional link runs up to 1.2 Gbps on an unshielded flex PCB, it still consumes less than 10mW in total. Four wires per direction transfer differential Strobe and Data signals. The chip has been designed as full custom, using Texas Instruments' latest 65nm process technology. The major building blocks are a serializer / deserializer, comma detection, physical media access as well as additional control and test logic. The active chip area is 0.01mm2 . First samples have been extensively tested and show full functionality.