LTCC Multi-Chip Modules for Ka-Band Multimedia Satellite Technology
Conference: GeMIC 2008 - German Microwave Conference
03/10/2008 - 03/12/2008 at Hamburg-Harburg, Germany
Proceedings: GeMIC 2008
Pages: 4Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Kulke, R.; Möllenbeck, G.; Günner, C.; Uhlig, P.; Rittweger, M. (IMST GmbH, Carl-Friedrich-Gauss-Str.2, 47475 Kamp-Lintfort, Germany)
This paper will focus upon the investigation and development of innovative and inexpensive microwave components for applications in multimedia satellite communication. This effort is part of the national R&D project KERAMIS-2, which is funded by German DLR/BMWI. The goal of the project is to participate with the KERAMIS-technology in an On-Orbit- Verification (OOV) mission, which is scheduled to launch an exploration mini-satellite as LEO in early 2010. Three independent payloads have been defined by the consortium partners. This paper reports on a payload where the authors have the responsibility to design and develop multi-chip modules in multilayer LTCC (Low Temperature Co-fired Ceramic) technology. This is demonstrated with the example of a fractional-N synthesizer, a medium power amplifier and an SPDT switch. Those modules have been designed for operation in Ka-band (18 – 20 GHz), which is the satellites down-link frequency.