Environmental Evaluation of LTCC Surface Mount Technology for Satellite Applications

Conference: GeMIC 2008 - German Microwave Conference
03/10/2008 - 03/12/2008 at Hamburg-Harburg, Germany

Proceedings: GeMIC 2008

Pages: 4Language: englishTyp: PDF

Personal VDE Members are entitled to a 10% discount on this title

Baras, Torben; Molke, Alexander; Jacob, Arne F. (Institut für Hochfrequenztechnik - Tech. Univ. Hamburg-Harburg, 21073 Hamburg, Germany)
Schwarz, Andreas; Reppe, Günter (RHe Microsystems GmbH, 01454 Radeberg, Germany)
Pohlner, Jürgen; Quahs, Dany; Schwanke, Dieter (Micro Systems Engineering GmbH, 95180 Berg, Ofr., Germany)

An environmental qualification of a hybrid technology for satellite applications is presented. It is based on low temperature cofired ceramics modules attached in a surface mount technology to a mother board on an aluminum base plate. For the module assembly flip-chip mounting using ultrasonic and thermocompression bonding is considered. As a validation the circuits are exposed to numerous mechanical and thermal testing procedures. In two qualification steps the different manufacturing methods are evaluated and discussed.