Investigation on Pad-Edge Effects at Multi-layer Packaging containing Grounding Via Arrays
Conference: GeMIC 2008 - German Microwave Conference
03/10/2008 - 03/12/2008 at Hamburg-Harburg, Germany
Proceedings: GeMIC 2008
Pages: 4Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Buchta, M. (AiF Berlin, Arbeitsgemeinschaft industrieller Forschungsvereinigungen, Tschaikowskistr. 49, D-13156 Berlin, Germany)
Heinrich, W. (Ferdinand-Braun-Institut (FBH), Gustav-Kirchhoff-Str. 4, D-12489 Berlin, Germany)
Via arrays for grounding have to be carefully designed not only regarding the via pitch but also with respect to the edges of the resulting pad. At a certain frequency an unwanted wave propagation occurs along the pad edges. This paper provides a detailed analytical and numerical analysis of this crosstalk effect, together with experimental verification. The simplified model achieves very good agreement over a broad range of edge geometries.