Compact thermal model for the analysis of power devices thermal interactions
Conference: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
03/11/2008 - 03/13/2008 at Nuremberg, Germany
Proceedings: CIPS 2008
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Bruno, Allard; Sabrine, M’Rad (AMPERE, INSA Lyon, Villeurbanne, France)
Xavier, Jordà; Xavier, Perpinya (CENTRE NACIONAL DE MICROELECTRÒNICA, Barcelona, Spain)
Compact thermal models are required for many analyses where only part of the thermal time-constants are excited. Generally a RC-ladder model is used and analytical expressions enable to quantify the R and C values. Unfortunately the trade-off between complexity, convergence and accuracy is hard to settle. Diffusive approximation of the Heat Law equation offers an alternative representation. The compact thermal model comes as a statespace model. Model parameter identification procedures exist and have been validated. The present paper demonstrates the application of such thermal models to the representation of thermal couplings.