Compact thermal model for the analysis of power devices thermal interactions

Conference: CIPS 2008 - 5th International Conference on Integrated Power Electronics Systems
03/11/2008 - 03/13/2008 at Nuremberg, Germany

Proceedings: CIPS 2008

Pages: 6Language: englishTyp: PDF

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Bruno, Allard; Sabrine, M’Rad (AMPERE, INSA Lyon, Villeurbanne, France)
Xavier, Jordà; Xavier, Perpinya (CENTRE NACIONAL DE MICROELECTRÒNICA, Barcelona, Spain)

Compact thermal models are required for many analyses where only part of the thermal time-constants are excited. Generally a RC-ladder model is used and analytical expressions enable to quantify the R and C values. Unfortunately the trade-off between complexity, convergence and accuracy is hard to settle. Diffusive approximation of the Heat Law equation offers an alternative representation. The compact thermal model comes as a statespace model. Model parameter identification procedures exist and have been validated. The present paper demonstrates the application of such thermal models to the representation of thermal couplings.