Interconnects for Buried W-Band MMICs Using Novel System-in-Package Technology

Conference: GeMiC 2009 - German Microwave Conference
03/16/2009 - 03/18/2009 at München, Germany

Proceedings: GeMiC 2009

Pages: 4Language: englishTyp: PDF

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Authors:
Richter, Marius D.; Schneider, Martin (Department of RF & Microwave Engineering, University of Bremen, Otto-Hahn-Allee, 28359 Bremen, Germany)
Becker, Karl-F.; Böttcher, Lars (Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany)

Abstract:
A novel system-in-package technology has been developed which enables to bury active 77 GHz chips inside a printed circuit board (PCB). The chips are connected to an RF substrate on top of the PCB using microvias. To evaluate the performance of these interconnects, silicon daisy chain chips with coplanar lines are buried inside a PCB. Simulation and measurement data are compared. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.