Flip-chip integration of differential CMOS power amplifier and antenna in PCB technology for the 60-GHz frequency band
Conference: EuCAP 2009 - 3rd European Conference on Antennas and Propagation
03/23/2009 - 03/27/2009 at Berlin, Germany
Proceedings: EuCAP 2009
Pages: 5Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Akkermans, J. A. G.; Kazim, M. I.; Yu, Y.; Herben, M. H. A. J.; Baltus, P. G. M.; Smulders, P. F. M. (Electrical Engineering, Eindhoven University of Technology (TU/e), Eindhoven, The Netherlands)
The integration of a CMOS power amplifier (PA) and antenna in printed circuit-board (PCB) technology is investigated. Both the PA and the antenna have a differential design to provide a reliable low-loss interconnect. A PCB package is proposed that enables the implementation of a high-efficiency antenna while providing mechanical rigidity. The interconnection between the PA and the antenna is realised with flip-chip technology. The performance of the package is demonstrated with measurements of the realised antenna gain and radiation patterns.