Parametric Extraction of Lumped Via Models

Conference: ISTET 2009 - VXV International Symposium on Theoretical Engineering
06/22/2009 - 06/24/2009 at Lübeck, Germany

Proceedings: ISTET 2009

Pages: 4Language: englishTyp: PDF

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Heinrich, Gerd; Dickmann, Stefan (Helmut–Schmidt–Universität / Universität der Bundeswehr Hamburg, Germany)

Vias in multilayer PCBs can be described using lumped models since their geometric dimensions are small in comparison to the signal wavelength. The elements of these models can be derived directly from physics and calculated using analytical formulas. When using these formulas as initial parameters for an optimisation algorithm the model parameters for a real via geometry can be extracted using the reference data from measurements or numerical simulations.