Si and InP Integration in the HELIOS project

Conference: ECOC 2009 - 35th European Conference on Optical Communication
09/20/2009 - 09/24/2009 at Vienna, Austria

Proceedings: ECOC 2009

Pages: 3Language: englishTyp: PDF

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Fedeli, Jean-Marc (CEA-Leti, Minatec 17 rue des Martyrs 38054 Grenoble, France)

Photonics and Electronics integration is considered using molecular wafer bonding of an optical SOI processed wafer on top of an electronics wafer. InP sources and Ge photodetectors are processed together on 200mm wafers.