Hybrid Co-Packaged Receiver Module with pin-Photodiode Chip and DEMUX-IC for 107 Gb/s Data Rates
Conference: ECOC 2009 - 35th European Conference on Optical Communication
09/20/2009 - 09/24/2009 at Vienna, Austria
Proceedings: ECOC 2009
Pages: 2Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Mekonnen, G. G.; Bach, H.-G.; Kunkel, R.; Schubert, C.; Pech, D.; Rosin, T. (Fraunhofer Institute for Telecommunications, Heinrich-Hertz-Institut, Einsteinufer 37, 10587 Berlin, Germany)
Konczykowska, A.; Jorge, F.; Scavennec, A.; Riet, M. (Alcatel Thales III-V Lab, joint la: Bell Labs and Thales Research and Technology, Route de Nozay, 91461 Marcoussis Cedex, France)
A hybrid co-packaged receiver with pin-photodetector and DEMUX-IC for 107 Gb/s is presented. Well opened demultiplexed eye diagrams at 53.5 Gb/s for 107 Gb/s input and error-free demultiplexing performance at PRBS31 were demonstrated.